KR102563985B1 - 전도성 트랙을 형성하는 방법 및 장치 - Google Patents

전도성 트랙을 형성하는 방법 및 장치 Download PDF

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Publication number
KR102563985B1
KR102563985B1 KR1020187004936A KR20187004936A KR102563985B1 KR 102563985 B1 KR102563985 B1 KR 102563985B1 KR 1020187004936 A KR1020187004936 A KR 1020187004936A KR 20187004936 A KR20187004936 A KR 20187004936A KR 102563985 B1 KR102563985 B1 KR 102563985B1
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South Korea
Prior art keywords
laser beam
substrate
energy distribution
cross
path
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English (en)
Korean (ko)
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KR20180040594A (ko
Inventor
애덤 노쓰 브런튼
사이먼 존 핸리
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엠-솔브 리미티드
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/34—Laser welding for purposes other than joining
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0732—Shaping the laser spot into a rectangular shape
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0927—Systems for changing the beam intensity distribution, e.g. Gaussian to top-hat
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Laser Beam Processing (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Structure Of Printed Boards (AREA)
  • Electrodes Of Semiconductors (AREA)
KR1020187004936A 2015-08-18 2016-08-03 전도성 트랙을 형성하는 방법 및 장치 Active KR102563985B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB1514655.8 2015-08-18
GB1514655.8A GB2541412B (en) 2015-08-18 2015-08-18 Method and Apparatus for Forming a Conductive Track
PCT/GB2016/052387 WO2017029472A1 (en) 2015-08-18 2016-08-03 Method and apparatus for forming a conductive track

Publications (2)

Publication Number Publication Date
KR20180040594A KR20180040594A (ko) 2018-04-20
KR102563985B1 true KR102563985B1 (ko) 2023-08-04

Family

ID=54258784

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187004936A Active KR102563985B1 (ko) 2015-08-18 2016-08-03 전도성 트랙을 형성하는 방법 및 장치

Country Status (8)

Country Link
US (1) US10882136B2 (enExample)
EP (1) EP3337636B1 (enExample)
JP (1) JP7079727B2 (enExample)
KR (1) KR102563985B1 (enExample)
CN (1) CN107921582B (enExample)
GB (1) GB2541412B (enExample)
TW (1) TWI694881B (enExample)
WO (1) WO2017029472A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6955932B2 (ja) * 2017-08-25 2021-10-27 株式会社ディスコ レーザービームプロファイラユニット及びレーザー加工装置
EP3624571A1 (en) * 2018-09-14 2020-03-18 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO A process for the manufacturing of printed conductive tracks on an object and 3d printed electronics
CN115361785B (zh) * 2022-08-23 2025-03-21 广东工业大学 一种精细线路的制备方法及系统
GB2629349A (en) * 2023-04-24 2024-10-30 M Solv Ltd Apparatus and method for directing laser radiation onto a target, laser drilling apparatus and method
CN118016737B (zh) * 2024-01-24 2025-05-30 天合光能股份有限公司 太阳能电池及其制备方法

Citations (2)

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JP2006032916A (ja) * 2004-06-14 2006-02-02 Semiconductor Energy Lab Co Ltd 配線基板、及び半導体装置、並びにその作製方法
JP2010145562A (ja) * 2008-12-17 2010-07-01 Panasonic Corp パターン形成方法

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GB2220502A (en) * 1988-07-09 1990-01-10 Exitech Ltd Excimer laser beam homogenizer system
JP3149450B2 (ja) 1991-04-04 2001-03-26 セイコーエプソン株式会社 薄膜トランジスタの製造方法及び製造装置
US6331692B1 (en) 1996-10-12 2001-12-18 Volker Krause Diode laser, laser optics, device for laser treatment of a workpiece, process for a laser treatment of workpiece
JP3436858B2 (ja) * 1997-02-27 2003-08-18 シャープ株式会社 薄膜太陽電池の製造方法
JP4663047B2 (ja) 1998-07-13 2011-03-30 株式会社半導体エネルギー研究所 レーザー照射装置及び半導体装置の作製方法
US6750423B2 (en) * 2001-10-25 2004-06-15 Semiconductor Energy Laboratory Co., Ltd. Laser irradiation method, laser irradiation apparatus, and method of manufacturing a semiconductor device
TWI221102B (en) 2002-08-30 2004-09-21 Sumitomo Heavy Industries Laser material processing method and processing device
US20060003262A1 (en) * 2004-06-30 2006-01-05 Eastman Kodak Company Forming electrical conductors on a substrate
JP2006038999A (ja) * 2004-07-23 2006-02-09 Sumitomo Electric Ind Ltd レーザ照射を用いた導電性回路形成方法と導電性回路
CN100565806C (zh) * 2004-07-30 2009-12-02 株式会社半导体能源研究所 激光辐照装置和激光辐照方法
US7722422B2 (en) 2007-05-21 2010-05-25 Global Oled Technology Llc Device and method for improved power distribution for a transparent electrode
JP4601679B2 (ja) * 2008-02-21 2010-12-22 三洋電機株式会社 太陽電池モジュール
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KR20100080120A (ko) * 2008-12-31 2010-07-08 한국생산기술연구원 인쇄회로 소결방법
GB0900036D0 (en) 2009-01-03 2009-02-11 M Solv Ltd Method and apparatus for forming grooves with complex shape in the surface of apolymer
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KR101247619B1 (ko) * 2011-08-29 2013-04-01 한국과학기술원 금속 나노입자 극미세 레이저 소결 장치 및 방법
WO2016075822A1 (ja) 2014-11-14 2016-05-19 富士機械製造株式会社 配線基板作製方法および配線基板作製装置

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JP2006032916A (ja) * 2004-06-14 2006-02-02 Semiconductor Energy Lab Co Ltd 配線基板、及び半導体装置、並びにその作製方法
JP2010145562A (ja) * 2008-12-17 2010-07-01 Panasonic Corp パターン形成方法

Also Published As

Publication number Publication date
GB2541412A (en) 2017-02-22
WO2017029472A1 (en) 2017-02-23
TW201718151A (zh) 2017-06-01
US20180236601A1 (en) 2018-08-23
CN107921582A (zh) 2018-04-17
EP3337636B1 (en) 2023-06-07
KR20180040594A (ko) 2018-04-20
US10882136B2 (en) 2021-01-05
CN107921582B (zh) 2020-02-07
JP7079727B2 (ja) 2022-06-02
GB2541412B (en) 2018-08-01
JP2018525838A (ja) 2018-09-06
GB201514655D0 (en) 2015-09-30
EP3337636A1 (en) 2018-06-27
TWI694881B (zh) 2020-06-01

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