JP2018525838A5 - - Google Patents

Download PDF

Info

Publication number
JP2018525838A5
JP2018525838A5 JP2018509591A JP2018509591A JP2018525838A5 JP 2018525838 A5 JP2018525838 A5 JP 2018525838A5 JP 2018509591 A JP2018509591 A JP 2018509591A JP 2018509591 A JP2018509591 A JP 2018509591A JP 2018525838 A5 JP2018525838 A5 JP 2018525838A5
Authority
JP
Japan
Prior art keywords
laser beam
energy distribution
substrate
cross
path
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2018509591A
Other languages
English (en)
Japanese (ja)
Other versions
JP7079727B2 (ja
JP2018525838A (ja
Filing date
Publication date
Priority claimed from GB1514655.8A external-priority patent/GB2541412B/en
Application filed filed Critical
Publication of JP2018525838A publication Critical patent/JP2018525838A/ja
Publication of JP2018525838A5 publication Critical patent/JP2018525838A5/ja
Application granted granted Critical
Publication of JP7079727B2 publication Critical patent/JP7079727B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2018509591A 2015-08-18 2016-08-03 導電トラックの形成方法および装置 Active JP7079727B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB1514655.8 2015-08-18
GB1514655.8A GB2541412B (en) 2015-08-18 2015-08-18 Method and Apparatus for Forming a Conductive Track
PCT/GB2016/052387 WO2017029472A1 (en) 2015-08-18 2016-08-03 Method and apparatus for forming a conductive track

Publications (3)

Publication Number Publication Date
JP2018525838A JP2018525838A (ja) 2018-09-06
JP2018525838A5 true JP2018525838A5 (enExample) 2019-09-12
JP7079727B2 JP7079727B2 (ja) 2022-06-02

Family

ID=54258784

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018509591A Active JP7079727B2 (ja) 2015-08-18 2016-08-03 導電トラックの形成方法および装置

Country Status (8)

Country Link
US (1) US10882136B2 (enExample)
EP (1) EP3337636B1 (enExample)
JP (1) JP7079727B2 (enExample)
KR (1) KR102563985B1 (enExample)
CN (1) CN107921582B (enExample)
GB (1) GB2541412B (enExample)
TW (1) TWI694881B (enExample)
WO (1) WO2017029472A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6955932B2 (ja) * 2017-08-25 2021-10-27 株式会社ディスコ レーザービームプロファイラユニット及びレーザー加工装置
EP3624571A1 (en) * 2018-09-14 2020-03-18 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO A process for the manufacturing of printed conductive tracks on an object and 3d printed electronics
CN115361785B (zh) * 2022-08-23 2025-03-21 广东工业大学 一种精细线路的制备方法及系统
GB2629349A (en) * 2023-04-24 2024-10-30 M Solv Ltd Apparatus and method for directing laser radiation onto a target, laser drilling apparatus and method
CN118016737B (zh) * 2024-01-24 2025-05-30 天合光能股份有限公司 太阳能电池及其制备方法

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2220502A (en) * 1988-07-09 1990-01-10 Exitech Ltd Excimer laser beam homogenizer system
JP3149450B2 (ja) 1991-04-04 2001-03-26 セイコーエプソン株式会社 薄膜トランジスタの製造方法及び製造装置
US6331692B1 (en) 1996-10-12 2001-12-18 Volker Krause Diode laser, laser optics, device for laser treatment of a workpiece, process for a laser treatment of workpiece
JP3436858B2 (ja) * 1997-02-27 2003-08-18 シャープ株式会社 薄膜太陽電池の製造方法
JP4663047B2 (ja) 1998-07-13 2011-03-30 株式会社半導体エネルギー研究所 レーザー照射装置及び半導体装置の作製方法
US6750423B2 (en) * 2001-10-25 2004-06-15 Semiconductor Energy Laboratory Co., Ltd. Laser irradiation method, laser irradiation apparatus, and method of manufacturing a semiconductor device
TWI221102B (en) 2002-08-30 2004-09-21 Sumitomo Heavy Industries Laser material processing method and processing device
JP4536601B2 (ja) * 2004-06-14 2010-09-01 株式会社半導体エネルギー研究所 半導体装置の作製方法
US20060003262A1 (en) * 2004-06-30 2006-01-05 Eastman Kodak Company Forming electrical conductors on a substrate
JP2006038999A (ja) * 2004-07-23 2006-02-09 Sumitomo Electric Ind Ltd レーザ照射を用いた導電性回路形成方法と導電性回路
CN100565806C (zh) * 2004-07-30 2009-12-02 株式会社半导体能源研究所 激光辐照装置和激光辐照方法
US7722422B2 (en) 2007-05-21 2010-05-25 Global Oled Technology Llc Device and method for improved power distribution for a transparent electrode
JP4601679B2 (ja) * 2008-02-21 2010-12-22 三洋電機株式会社 太陽電池モジュール
DE102008019636A1 (de) * 2008-04-18 2009-10-22 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Bauteil mit Schweißnaht und Verfahren zur Herstellung einer Schweißnaht
JP2010145562A (ja) 2008-12-17 2010-07-01 Panasonic Corp パターン形成方法
KR20100080120A (ko) * 2008-12-31 2010-07-08 한국생산기술연구원 인쇄회로 소결방법
GB0900036D0 (en) 2009-01-03 2009-02-11 M Solv Ltd Method and apparatus for forming grooves with complex shape in the surface of apolymer
GB2474665B (en) * 2009-10-22 2011-10-12 M Solv Ltd Method and apparatus for dividing thin film device into separate cells
JP2011194413A (ja) 2010-03-17 2011-10-06 Sony Corp 表面超微細凹凸構造を有する成形品の製造方法
JP2011249357A (ja) * 2010-05-21 2011-12-08 Panasonic Electric Works Co Ltd 回路基板および回路基板の製造方法
KR101114256B1 (ko) * 2010-07-14 2012-03-05 한국과학기술원 패턴 제조 방법
KR101247619B1 (ko) * 2011-08-29 2013-04-01 한국과학기술원 금속 나노입자 극미세 레이저 소결 장치 및 방법
WO2016075822A1 (ja) 2014-11-14 2016-05-19 富士機械製造株式会社 配線基板作製方法および配線基板作製装置

Similar Documents

Publication Publication Date Title
JP2018525838A5 (enExample)
US10471538B2 (en) Control of lift ejection angle
AU2016273983A1 (en) 3D printing device for producing a spatially extended product
US5578350A (en) Method for depositing a thin layer on a substrate by laser pulse vapor deposition
US20080008854A1 (en) Composite sheet, machining method for composite sheet and laser machining apparatus
CN111132780A (zh) 用于产生连贯面区域的方法,照射装置和加工机
KR20120043072A (ko) 횡방향 등치선 스크라이브, 스티칭, 및 간략화된 레이저 및 스캐너 제어들
US20170173875A1 (en) 3D printing device for producing a spatially extended product
JP2017150037A (ja) シャドーマスク、シャドーマスクの製造方法及び表示装置の製造方法
US20170326682A1 (en) Method of manufacturing display apparatus
TWI694881B (zh) 形成導電軌之方法及裝置
JP7406240B2 (ja) 3d印刷方法および3d印刷装置
TW201812919A (zh) 用於半導體材料層退火之裝置,半導體材料層退火之方法,及平面顯示器
US20200168496A1 (en) Substrate treatment apparatus
JP7614918B2 (ja) ウエーハの加工方法及びウエーハの加工装置
KR102488145B1 (ko) 마스크 세정 장치 및 마스크 세정 방법
KR101671418B1 (ko) 리소그래피 장치, 디바이스 제조 방법, 및 감쇠기를 제조하는 방법
KR102314487B1 (ko) 증착 장치 및 이를 이용한 증착 방법
TWI899143B (zh) 雷射加工裝置和雷射加工工件的方法
TWI873443B (zh) 照明光學系統以及雷射加工裝置
WO2025008121A1 (en) Object holder, object table, method of controlling the shape of a surface, method of manufacturing the object holder, and their use in a lithographic method or apparatus
JP2018065148A (ja) レーザ照射装置及びそれを用いたレーザリフトオフ装置
JP2025071028A (ja) ビーム整形を用いたレーザアシスト堆積
WO2006115346A1 (en) Method and apparatus for forming alignment film of liquid crystal display