TWI694881B - 形成導電軌之方法及裝置 - Google Patents

形成導電軌之方法及裝置 Download PDF

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Publication number
TWI694881B
TWI694881B TW105126210A TW105126210A TWI694881B TW I694881 B TWI694881 B TW I694881B TW 105126210 A TW105126210 A TW 105126210A TW 105126210 A TW105126210 A TW 105126210A TW I694881 B TWI694881 B TW I694881B
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TW
Taiwan
Prior art keywords
laser beam
substrate
path
energy distribution
cross
Prior art date
Application number
TW105126210A
Other languages
English (en)
Chinese (zh)
Other versions
TW201718151A (zh
Inventor
亞當 諾史 布魯特
賽門 約翰 漢利
Original Assignee
英商萬佳雷射有限公司
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Application filed by 英商萬佳雷射有限公司 filed Critical 英商萬佳雷射有限公司
Publication of TW201718151A publication Critical patent/TW201718151A/zh
Application granted granted Critical
Publication of TWI694881B publication Critical patent/TWI694881B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0732—Shaping the laser spot into a rectangular shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/34—Laser welding for purposes other than joining
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0927—Systems for changing the beam intensity distribution, e.g. Gaussian to top-hat
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Laser Beam Processing (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Structure Of Printed Boards (AREA)
  • Electrodes Of Semiconductors (AREA)
TW105126210A 2015-08-18 2016-08-17 形成導電軌之方法及裝置 TWI694881B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB1514655.8 2015-08-18
GB1514655.8A GB2541412B (en) 2015-08-18 2015-08-18 Method and Apparatus for Forming a Conductive Track

Publications (2)

Publication Number Publication Date
TW201718151A TW201718151A (zh) 2017-06-01
TWI694881B true TWI694881B (zh) 2020-06-01

Family

ID=54258784

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105126210A TWI694881B (zh) 2015-08-18 2016-08-17 形成導電軌之方法及裝置

Country Status (8)

Country Link
US (1) US10882136B2 (enExample)
EP (1) EP3337636B1 (enExample)
JP (1) JP7079727B2 (enExample)
KR (1) KR102563985B1 (enExample)
CN (1) CN107921582B (enExample)
GB (1) GB2541412B (enExample)
TW (1) TWI694881B (enExample)
WO (1) WO2017029472A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6955932B2 (ja) * 2017-08-25 2021-10-27 株式会社ディスコ レーザービームプロファイラユニット及びレーザー加工装置
EP3624571A1 (en) * 2018-09-14 2020-03-18 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO A process for the manufacturing of printed conductive tracks on an object and 3d printed electronics
CN115361785B (zh) * 2022-08-23 2025-03-21 广东工业大学 一种精细线路的制备方法及系统
GB2629349A (en) * 2023-04-24 2024-10-30 M Solv Ltd Apparatus and method for directing laser radiation onto a target, laser drilling apparatus and method
CN118016737B (zh) * 2024-01-24 2025-05-30 天合光能股份有限公司 太阳能电池及其制备方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04307727A (ja) * 1991-04-04 1992-10-29 Seiko Epson Corp 薄膜トランジスタの製造方法及び製造装置
EP1055479A2 (en) * 1999-05-24 2000-11-29 Sel Semiconductor Energy Laboratory Co., Ltd. Laser irradiation apparatus
US6168968B1 (en) * 1997-02-27 2001-01-02 Sharp Kabushiki Kaisha Method of fabricating integrated thin film solar cells
US20030080099A1 (en) * 2001-10-25 2003-05-01 Semiconductor Energy Laboratory Co., Ltd. Laser irradiation method, laser irradiation apparatus, and method of manufacturing a semiconductor device

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2220502A (en) * 1988-07-09 1990-01-10 Exitech Ltd Excimer laser beam homogenizer system
US6331692B1 (en) 1996-10-12 2001-12-18 Volker Krause Diode laser, laser optics, device for laser treatment of a workpiece, process for a laser treatment of workpiece
TWI221102B (en) 2002-08-30 2004-09-21 Sumitomo Heavy Industries Laser material processing method and processing device
JP4536601B2 (ja) * 2004-06-14 2010-09-01 株式会社半導体エネルギー研究所 半導体装置の作製方法
US20060003262A1 (en) * 2004-06-30 2006-01-05 Eastman Kodak Company Forming electrical conductors on a substrate
JP2006038999A (ja) * 2004-07-23 2006-02-09 Sumitomo Electric Ind Ltd レーザ照射を用いた導電性回路形成方法と導電性回路
CN100565806C (zh) * 2004-07-30 2009-12-02 株式会社半导体能源研究所 激光辐照装置和激光辐照方法
US7722422B2 (en) 2007-05-21 2010-05-25 Global Oled Technology Llc Device and method for improved power distribution for a transparent electrode
JP4601679B2 (ja) * 2008-02-21 2010-12-22 三洋電機株式会社 太陽電池モジュール
DE102008019636A1 (de) * 2008-04-18 2009-10-22 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Bauteil mit Schweißnaht und Verfahren zur Herstellung einer Schweißnaht
JP2010145562A (ja) 2008-12-17 2010-07-01 Panasonic Corp パターン形成方法
KR20100080120A (ko) * 2008-12-31 2010-07-08 한국생산기술연구원 인쇄회로 소결방법
GB0900036D0 (en) 2009-01-03 2009-02-11 M Solv Ltd Method and apparatus for forming grooves with complex shape in the surface of apolymer
GB2474665B (en) * 2009-10-22 2011-10-12 M Solv Ltd Method and apparatus for dividing thin film device into separate cells
JP2011194413A (ja) 2010-03-17 2011-10-06 Sony Corp 表面超微細凹凸構造を有する成形品の製造方法
JP2011249357A (ja) * 2010-05-21 2011-12-08 Panasonic Electric Works Co Ltd 回路基板および回路基板の製造方法
KR101114256B1 (ko) * 2010-07-14 2012-03-05 한국과학기술원 패턴 제조 방법
KR101247619B1 (ko) * 2011-08-29 2013-04-01 한국과학기술원 금속 나노입자 극미세 레이저 소결 장치 및 방법
WO2016075822A1 (ja) 2014-11-14 2016-05-19 富士機械製造株式会社 配線基板作製方法および配線基板作製装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04307727A (ja) * 1991-04-04 1992-10-29 Seiko Epson Corp 薄膜トランジスタの製造方法及び製造装置
US6168968B1 (en) * 1997-02-27 2001-01-02 Sharp Kabushiki Kaisha Method of fabricating integrated thin film solar cells
EP1055479A2 (en) * 1999-05-24 2000-11-29 Sel Semiconductor Energy Laboratory Co., Ltd. Laser irradiation apparatus
US20030080099A1 (en) * 2001-10-25 2003-05-01 Semiconductor Energy Laboratory Co., Ltd. Laser irradiation method, laser irradiation apparatus, and method of manufacturing a semiconductor device

Also Published As

Publication number Publication date
GB2541412A (en) 2017-02-22
WO2017029472A1 (en) 2017-02-23
KR102563985B1 (ko) 2023-08-04
TW201718151A (zh) 2017-06-01
US20180236601A1 (en) 2018-08-23
CN107921582A (zh) 2018-04-17
EP3337636B1 (en) 2023-06-07
KR20180040594A (ko) 2018-04-20
US10882136B2 (en) 2021-01-05
CN107921582B (zh) 2020-02-07
JP7079727B2 (ja) 2022-06-02
GB2541412B (en) 2018-08-01
JP2018525838A (ja) 2018-09-06
GB201514655D0 (en) 2015-09-30
EP3337636A1 (en) 2018-06-27

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