JPH0346231B2 - - Google Patents
Info
- Publication number
- JPH0346231B2 JPH0346231B2 JP61086880A JP8688086A JPH0346231B2 JP H0346231 B2 JPH0346231 B2 JP H0346231B2 JP 61086880 A JP61086880 A JP 61086880A JP 8688086 A JP8688086 A JP 8688086A JP H0346231 B2 JPH0346231 B2 JP H0346231B2
- Authority
- JP
- Japan
- Prior art keywords
- laser
- power supply
- output
- workpiece
- oscillator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/16—Composite materials, e.g. fibre reinforced
- B23K2103/166—Multilayered materials
- B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61086880A JPS62244592A (ja) | 1986-04-15 | 1986-04-15 | レ−ザ加工装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61086880A JPS62244592A (ja) | 1986-04-15 | 1986-04-15 | レ−ザ加工装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62244592A JPS62244592A (ja) | 1987-10-24 |
| JPH0346231B2 true JPH0346231B2 (enExample) | 1991-07-15 |
Family
ID=13899148
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61086880A Granted JPS62244592A (ja) | 1986-04-15 | 1986-04-15 | レ−ザ加工装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62244592A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007313774A (ja) * | 2006-05-26 | 2007-12-06 | Tdk Corp | サーマルヘッド用基板の分割溝形成方法、サーマルヘッドの製造方法、サーマルヘッド及び印画装置 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR970008386A (ko) * | 1995-07-07 | 1997-02-24 | 하라 세이지 | 기판의 할단(割斷)방법 및 그 할단장치 |
-
1986
- 1986-04-15 JP JP61086880A patent/JPS62244592A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007313774A (ja) * | 2006-05-26 | 2007-12-06 | Tdk Corp | サーマルヘッド用基板の分割溝形成方法、サーマルヘッドの製造方法、サーマルヘッド及び印画装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62244592A (ja) | 1987-10-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4734550A (en) | Laser processing method | |
| US8143552B2 (en) | Laser beam machining system | |
| CN113199160B (zh) | 一种激光同步扫描加工群孔系统及扫描方法 | |
| US20110132885A1 (en) | Laser machining and scribing systems and methods | |
| US20110266264A1 (en) | Method and apparatus for forming grooves in the surface of a polymer layer | |
| US6300594B1 (en) | Method and apparatus for machining an electrically conductive film | |
| US6763045B2 (en) | Apparatus for and method of targeting | |
| JP2008503355A (ja) | 基板材料の切断、分断または分割装置、システムおよび方法 | |
| JP2013233556A (ja) | レーザー加工装置 | |
| CN117718610A (zh) | 一种激光钻孔光学系统、钻孔设备与钻孔方法 | |
| WO2025129945A1 (zh) | 激光加工装置、极片加工设备以及极片加工方法 | |
| US7332415B2 (en) | Silicon wafer dividing method and apparatus | |
| JP2005101413A (ja) | 薄板状被加工物の分割方法及び装置 | |
| JP4112745B2 (ja) | レーザーラインパターンニング方法 | |
| US7795560B2 (en) | Apparatus for processing work-piece | |
| JPH0346231B2 (enExample) | ||
| JPH0453630B2 (enExample) | ||
| CN220591880U (zh) | 一种激光焊接装置 | |
| JPS62168688A (ja) | レ−ザ加工装置 | |
| CN117123909A (zh) | 印刷基板的激光加工方法及印刷基板的激光加工机 | |
| US7767550B2 (en) | Wafer laser processing method and laser processing equipment | |
| CN221735129U (zh) | 一种激光钻孔光学系统与钻孔设备 | |
| JP5947402B2 (ja) | 2つのレーザービームを用いた加工片のレーザー加工装置 | |
| TWI736484B (zh) | 使用於光軸傾斜加工之光學透鏡模組 | |
| CN222403957U (zh) | 一种对射式激光切割装置 |