JPS62244592A - レ−ザ加工装置 - Google Patents

レ−ザ加工装置

Info

Publication number
JPS62244592A
JPS62244592A JP61086880A JP8688086A JPS62244592A JP S62244592 A JPS62244592 A JP S62244592A JP 61086880 A JP61086880 A JP 61086880A JP 8688086 A JP8688086 A JP 8688086A JP S62244592 A JPS62244592 A JP S62244592A
Authority
JP
Japan
Prior art keywords
laser
power supply
output
workpiece
oscillator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61086880A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0346231B2 (enExample
Inventor
Seiji Imamura
清治 今村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Corporate Research and Development Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Corporate Research and Development Ltd filed Critical Fuji Electric Corporate Research and Development Ltd
Priority to JP61086880A priority Critical patent/JPS62244592A/ja
Publication of JPS62244592A publication Critical patent/JPS62244592A/ja
Publication of JPH0346231B2 publication Critical patent/JPH0346231B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
JP61086880A 1986-04-15 1986-04-15 レ−ザ加工装置 Granted JPS62244592A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61086880A JPS62244592A (ja) 1986-04-15 1986-04-15 レ−ザ加工装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61086880A JPS62244592A (ja) 1986-04-15 1986-04-15 レ−ザ加工装置

Publications (2)

Publication Number Publication Date
JPS62244592A true JPS62244592A (ja) 1987-10-24
JPH0346231B2 JPH0346231B2 (enExample) 1991-07-15

Family

ID=13899148

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61086880A Granted JPS62244592A (ja) 1986-04-15 1986-04-15 レ−ザ加工装置

Country Status (1)

Country Link
JP (1) JPS62244592A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5916460A (en) * 1995-07-07 1999-06-29 Hitachi Cable, Ltd. Method and apparatus for dicing a substrate

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007313774A (ja) * 2006-05-26 2007-12-06 Tdk Corp サーマルヘッド用基板の分割溝形成方法、サーマルヘッドの製造方法、サーマルヘッド及び印画装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5916460A (en) * 1995-07-07 1999-06-29 Hitachi Cable, Ltd. Method and apparatus for dicing a substrate

Also Published As

Publication number Publication date
JPH0346231B2 (enExample) 1991-07-15

Similar Documents

Publication Publication Date Title
US4734550A (en) Laser processing method
US8143552B2 (en) Laser beam machining system
US7364986B2 (en) Laser beam processing method and laser beam machine
EP2465634B1 (en) Laser machining device and laser machining method
JP4459530B2 (ja) レーザ加工装置
EP1990124B1 (en) Multi laser system
JP4171399B2 (ja) レーザ照射装置
US20110132885A1 (en) Laser machining and scribing systems and methods
KR102775012B1 (ko) 블라인드 비아들을 레이저 드릴링하는 방법 및 장치
KR20030064808A (ko) 반도체 재료의 레이저 기계 가공
JP2013233556A (ja) レーザー加工装置
US20060255022A1 (en) Wafer laser processing method and laser beam processing machine
JP2015189667A (ja) 強化ガラスのレーザ加工方法
CN112371654A (zh) 一种激光清洗装置及清洗方法
CN117718610A (zh) 一种激光钻孔光学系统、钻孔设备与钻孔方法
JP3257157B2 (ja) Ｃｏ２レーザ穴加工装置及び方法
JP3194248B2 (ja) レーザドリル装置及びレーザ穴あけ加工方法
US7332415B2 (en) Silicon wafer dividing method and apparatus
JPS62244592A (ja) レ−ザ加工装置
JPS62104692A (ja) レ−ザ加工装置
JP2000343254A (ja) レーザーラインパターンニング方法
JPS62168688A (ja) レ−ザ加工装置
CN214600801U (zh) 一种激光清洗装置
KR20210133196A (ko) 멀티 레이저 절삭 방법 및 그 시스템
JP3213884B2 (ja) レーザドリル装置