JP7076263B2 - 硬化性樹脂組成物、ドライフィルム、硬化物、および、電子部品 - Google Patents

硬化性樹脂組成物、ドライフィルム、硬化物、および、電子部品 Download PDF

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Publication number
JP7076263B2
JP7076263B2 JP2018070152A JP2018070152A JP7076263B2 JP 7076263 B2 JP7076263 B2 JP 7076263B2 JP 2018070152 A JP2018070152 A JP 2018070152A JP 2018070152 A JP2018070152 A JP 2018070152A JP 7076263 B2 JP7076263 B2 JP 7076263B2
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JP
Japan
Prior art keywords
compound
resin
group
silica particles
curable resin
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JP2018070152A
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English (en)
Japanese (ja)
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JP2019178308A (ja
Inventor
千穂 植田
和也 岡田
沙和子 嶋田
知哉 工藤
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Taiyo Ink Manufacturing Co Ltd
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Taiyo Ink Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Taiyo Ink Manufacturing Co Ltd filed Critical Taiyo Ink Manufacturing Co Ltd
Priority to JP2018070152A priority Critical patent/JP7076263B2/ja
Priority to CN201980023562.9A priority patent/CN111936575B/zh
Priority to PCT/JP2019/002809 priority patent/WO2019187588A1/fr
Priority to KR1020207029607A priority patent/KR20200140289A/ko
Priority to TW108103257A priority patent/TW201941953A/zh
Publication of JP2019178308A publication Critical patent/JP2019178308A/ja
Application granted granted Critical
Publication of JP7076263B2 publication Critical patent/JP7076263B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/0427—Coating with only one layer of a composition containing a polymer binder
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/02—Ingredients treated with inorganic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Epoxy Resins (AREA)
JP2018070152A 2018-03-30 2018-03-30 硬化性樹脂組成物、ドライフィルム、硬化物、および、電子部品 Active JP7076263B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2018070152A JP7076263B2 (ja) 2018-03-30 2018-03-30 硬化性樹脂組成物、ドライフィルム、硬化物、および、電子部品
CN201980023562.9A CN111936575B (zh) 2018-03-30 2019-01-28 固化性树脂组合物、干膜、固化物和电子部件
PCT/JP2019/002809 WO2019187588A1 (fr) 2018-03-30 2019-01-28 Composition de résine durcissable, film sec, objet durci et composant électronique
KR1020207029607A KR20200140289A (ko) 2018-03-30 2019-01-28 경화성 수지 조성물, 드라이 필름, 경화물, 및 전자 부품
TW108103257A TW201941953A (zh) 2018-03-30 2019-01-29 硬化性樹脂組成物、乾膜、硬化物，及電子零件

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018070152A JP7076263B2 (ja) 2018-03-30 2018-03-30 硬化性樹脂組成物、ドライフィルム、硬化物、および、電子部品

Publications (2)

Publication Number Publication Date
JP2019178308A JP2019178308A (ja) 2019-10-17
JP7076263B2 true JP7076263B2 (ja) 2022-05-27

Family

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Family Applications (1)

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JP2018070152A Active JP7076263B2 (ja) 2018-03-30 2018-03-30 硬化性樹脂組成物、ドライフィルム、硬化物、および、電子部品

Country Status (5)

Country Link
JP (1) JP7076263B2 (fr)
KR (1) KR20200140289A (fr)
CN (1) CN111936575B (fr)
TW (1) TW201941953A (fr)
WO (1) WO2019187588A1 (fr)

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* Cited by examiner, † Cited by third party
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JP2021014545A (ja) * 2019-07-12 2021-02-12 味の素株式会社 樹脂組成物
JP7402681B2 (ja) * 2019-12-27 2023-12-21 太陽ホールディングス株式会社 硬化性樹脂組成物、ドライフィルム、樹脂付き銅箔、硬化物、及び電子部品
JP7474592B2 (ja) * 2019-12-27 2024-04-25 太陽ホールディングス株式会社 硬化性樹脂組成物、ドライフィルム、樹脂付き銅箔、硬化物、および電子部品
JP7489775B2 (ja) * 2019-12-27 2024-05-24 太陽ホールディングス株式会社 硬化性樹脂組成物、ドライフィルム、樹脂付き銅箔、硬化物、および電子部品
CN113281965A (zh) * 2020-02-20 2021-08-20 东友精细化工有限公司 固化性树脂组合物、图案以及图像显示装置
WO2022190600A1 (fr) * 2021-03-08 2022-09-15 ナミックス株式会社 Composition de résine isolante, film isolant de couche intermédiaire de substrat, procédé de fabrication de film isolant de couche intermédiaire de substrat et substrat intégré à circuit intégré à semi-conducteur
CN113423183A (zh) * 2021-07-01 2021-09-21 定颖电子（昆山）有限公司 5g通讯高频信号板制造工艺

Citations (3)

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Publication number Priority date Publication date Assignee Title
JP2002161151A (ja) 2000-11-27 2002-06-04 Matsushita Electric Works Ltd プリプレグ及び積層板
WO2016047682A1 (fr) 2014-09-25 2016-03-31 積水化学工業株式会社 Film de résine, et film stratifié
WO2016088358A1 (fr) 2014-12-02 2016-06-09 日本ゼオン株式会社 Composition de résine durcissable, objet moulé en résine durcissable, objet durci, produit stratifié, composite et carte à circuit imprimé multicouche

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JP3479827B2 (ja) * 1998-04-27 2003-12-15 信越化学工業株式会社 半導体封止用エポキシ樹脂組成物及び半導体装置
JP4947612B2 (ja) * 2004-04-28 2012-06-06 神島化学工業株式会社 水酸化マグネシウム系難燃剤とその製造方法、及び難燃性樹脂組成物
JP2005350647A (ja) * 2004-05-11 2005-12-22 Nitto Denko Corp 液状エポキシ樹脂組成物
CN101323703B (zh) * 2008-07-29 2011-01-19 武汉科技学院 一种聚氨双马来酰亚胺树脂组合物、制备方法及其在覆铜板中的应用
JPWO2010035571A1 (ja) * 2008-09-24 2012-02-23 コニカミノルタオプト株式会社 反射防止層用組成物、反射防止フィルム、偏光板、及び画像表示装置
EP2412743B1 (fr) * 2009-03-27 2020-08-19 Hitachi Chemical Company, Ltd. Composition de résine thermodurcissable, et pré-imprégné, film d'isolation sur support, plaque stratifiée, et carte de circuit imprimé obtenus à partir de celle-ci
TWI388623B (zh) * 2009-10-02 2013-03-11 Nanya Plastics Corp A thermosetting epoxy resin composition for improving the drilling processability of printed circuit boards
JP5565005B2 (ja) * 2010-03-10 2014-08-06 いすゞ自動車株式会社 Ｄｐｆ故障検出方法及びｄｐｆ故障検出装置
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JP5413522B1 (ja) * 2012-01-23 2014-02-12 味の素株式会社 樹脂組成物
KR102238207B1 (ko) * 2014-07-18 2021-04-08 미츠비시 가스 가가쿠 가부시키가이샤 수지 조성물, 프리프레그, 금속박 피복 적층판, 및 프린트 배선판
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JP2016108499A (ja) * 2014-12-09 2016-06-20 株式会社ダイセル 硬化性エポキシ樹脂組成物及びその硬化物、光半導体素子搭載用基板、並びに光半導体装置
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Patent Citations (3)

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Publication number Priority date Publication date Assignee Title
JP2002161151A (ja) 2000-11-27 2002-06-04 Matsushita Electric Works Ltd プリプレグ及び積層板
WO2016047682A1 (fr) 2014-09-25 2016-03-31 積水化学工業株式会社 Film de résine, et film stratifié
WO2016088358A1 (fr) 2014-12-02 2016-06-09 日本ゼオン株式会社 Composition de résine durcissable, objet moulé en résine durcissable, objet durci, produit stratifié, composite et carte à circuit imprimé multicouche

Also Published As

Publication number Publication date
JP2019178308A (ja) 2019-10-17
CN111936575A (zh) 2020-11-13
WO2019187588A1 (fr) 2019-10-03
TW201941953A (zh) 2019-11-01
KR20200140289A (ko) 2020-12-15
CN111936575B (zh) 2023-08-01

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