TW201941953A - 硬化性樹脂組成物、乾膜、硬化物，及電子零件 - Google Patents

硬化性樹脂組成物、乾膜、硬化物，及電子零件 Download PDF

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Publication number
TW201941953A
TW201941953A TW108103257A TW108103257A TW201941953A TW 201941953 A TW201941953 A TW 201941953A TW 108103257 A TW108103257 A TW 108103257A TW 108103257 A TW108103257 A TW 108103257A TW 201941953 A TW201941953 A TW 201941953A
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TW
Taiwan
Prior art keywords
compound
group
resin
resin composition
curable resin
Prior art date
Application number
TW108103257A
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English (en)
Chinese (zh)
Inventor
田千穂
岡田和也
嶋田沙和子
工藤知哉
Original Assignee
日商太陽油墨製造股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商太陽油墨製造股份有限公司 filed Critical 日商太陽油墨製造股份有限公司
Publication of TW201941953A publication Critical patent/TW201941953A/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/0427—Coating with only one layer of a composition containing a polymer binder
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/02—Ingredients treated with inorganic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Epoxy Resins (AREA)
TW108103257A 2018-03-30 2019-01-29 硬化性樹脂組成物、乾膜、硬化物，及電子零件 TW201941953A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-070152 2018-03-30
JP2018070152A JP7076263B2 (ja) 2018-03-30 2018-03-30 硬化性樹脂組成物、ドライフィルム、硬化物、および、電子部品

Publications (1)

Publication Number Publication Date
TW201941953A true TW201941953A (zh) 2019-11-01

Family

ID=68061315

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108103257A TW201941953A (zh) 2018-03-30 2019-01-29 硬化性樹脂組成物、乾膜、硬化物，及電子零件

Country Status (5)

Country Link
JP (1) JP7076263B2 (fr)
KR (1) KR20200140289A (fr)
CN (1) CN111936575B (fr)
TW (1) TW201941953A (fr)
WO (1) WO2019187588A1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021014545A (ja) * 2019-07-12 2021-02-12 味の素株式会社 樹脂組成物
JP7402681B2 (ja) * 2019-12-27 2023-12-21 太陽ホールディングス株式会社 硬化性樹脂組成物、ドライフィルム、樹脂付き銅箔、硬化物、及び電子部品
JP7474592B2 (ja) * 2019-12-27 2024-04-25 太陽ホールディングス株式会社 硬化性樹脂組成物、ドライフィルム、樹脂付き銅箔、硬化物、および電子部品
JP7489775B2 (ja) * 2019-12-27 2024-05-24 太陽ホールディングス株式会社 硬化性樹脂組成物、ドライフィルム、樹脂付き銅箔、硬化物、および電子部品
CN113281965A (zh) * 2020-02-20 2021-08-20 东友精细化工有限公司 固化性树脂组合物、图案以及图像显示装置
WO2022190600A1 (fr) * 2021-03-08 2022-09-15 ナミックス株式会社 Composition de résine isolante, film isolant de couche intermédiaire de substrat, procédé de fabrication de film isolant de couche intermédiaire de substrat et substrat intégré à circuit intégré à semi-conducteur
CN113423183A (zh) * 2021-07-01 2021-09-21 定颖电子（昆山）有限公司 5g通讯高频信号板制造工艺

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JP2002161151A (ja) 2000-11-27 2002-06-04 Matsushita Electric Works Ltd プリプレグ及び積層板
JP4947612B2 (ja) * 2004-04-28 2012-06-06 神島化学工業株式会社 水酸化マグネシウム系難燃剤とその製造方法、及び難燃性樹脂組成物
JP2005350647A (ja) * 2004-05-11 2005-12-22 Nitto Denko Corp 液状エポキシ樹脂組成物
CN101323703B (zh) * 2008-07-29 2011-01-19 武汉科技学院 一种聚氨双马来酰亚胺树脂组合物、制备方法及其在覆铜板中的应用
JPWO2010035571A1 (ja) * 2008-09-24 2012-02-23 コニカミノルタオプト株式会社 反射防止層用組成物、反射防止フィルム、偏光板、及び画像表示装置
EP2412743B1 (fr) * 2009-03-27 2020-08-19 Hitachi Chemical Company, Ltd. Composition de résine thermodurcissable, et pré-imprégné, film d'isolation sur support, plaque stratifiée, et carte de circuit imprimé obtenus à partir de celle-ci
TWI388623B (zh) * 2009-10-02 2013-03-11 Nanya Plastics Corp A thermosetting epoxy resin composition for improving the drilling processability of printed circuit boards
JP5565005B2 (ja) * 2010-03-10 2014-08-06 いすゞ自動車株式会社 Ｄｐｆ故障検出方法及びｄｐｆ故障検出装置
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JP5582348B2 (ja) 2010-10-08 2014-09-03 日立化成株式会社 感光性樹脂組成物及び感光性フィルム
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US20180117891A1 (en) 2014-12-02 2018-05-03 Zeon Corporation Curable resin composition, molded curable-resin object, cured object, layered product, composite, and multilayered printed wiring board
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JP6776577B2 (ja) * 2016-03-28 2020-10-28 味の素株式会社 樹脂組成物

Also Published As

Publication number Publication date
JP2019178308A (ja) 2019-10-17
CN111936575A (zh) 2020-11-13
WO2019187588A1 (fr) 2019-10-03
JP7076263B2 (ja) 2022-05-27
KR20200140289A (ko) 2020-12-15
CN111936575B (zh) 2023-08-01

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