CN101323703B - 一种聚氨双马来酰亚胺树脂组合物、制备方法及其在覆铜板中的应用 - Google Patents
一种聚氨双马来酰亚胺树脂组合物、制备方法及其在覆铜板中的应用 Download PDFInfo
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- CN101323703B CN101323703B CN2008100486207A CN200810048620A CN101323703B CN 101323703 B CN101323703 B CN 101323703B CN 2008100486207 A CN2008100486207 A CN 2008100486207A CN 200810048620 A CN200810048620 A CN 200810048620A CN 101323703 B CN101323703 B CN 101323703B
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CN2008100486207A CN101323703B (zh) | 2008-07-29 | 2008-07-29 | 一种聚氨双马来酰亚胺树脂组合物、制备方法及其在覆铜板中的应用 |
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CN2008100486207A CN101323703B (zh) | 2008-07-29 | 2008-07-29 | 一种聚氨双马来酰亚胺树脂组合物、制备方法及其在覆铜板中的应用 |
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CN101323703A CN101323703A (zh) | 2008-12-17 |
CN101323703B true CN101323703B (zh) | 2011-01-19 |
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CN2008100486207A Expired - Fee Related CN101323703B (zh) | 2008-07-29 | 2008-07-29 | 一种聚氨双马来酰亚胺树脂组合物、制备方法及其在覆铜板中的应用 |
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Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
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CN101560287B (zh) * | 2009-05-15 | 2011-03-02 | 联茂(无锡)电子科技有限公司 | 一种加速热固化的热固型树脂 |
CN102558471A (zh) * | 2010-12-24 | 2012-07-11 | 广东生益科技股份有限公司 | 酚醛芳烷基型氰酸酯树脂及其合成方法 |
CN102558472A (zh) * | 2010-12-24 | 2012-07-11 | 广东生益科技股份有限公司 | 萘酚酚醛型氰酸酯树脂及其合成方法 |
CN102643543B (zh) * | 2011-02-18 | 2014-09-17 | 中国科学院深圳先进技术研究院 | 复合电介质材料、采用其制作的覆铜箔半固化片以及覆铜箔层压板 |
CN102276791B (zh) * | 2011-07-08 | 2013-02-27 | 绵阳惠利电子材料有限公司 | 阻燃环氧树脂复合物 |
CN103173086A (zh) * | 2011-12-23 | 2013-06-26 | 江苏国力电力安装工程有限公司 | 热电厂湿法脱硫烟囱阻燃型整体喷涂聚合物防腐内衬材料 |
CN102532593B (zh) * | 2011-12-30 | 2014-04-09 | 中国地质大学(武汉) | 一种低硬度、高导热系数覆铜板用功能填充料及其制备方法 |
CN105140028A (zh) * | 2015-09-25 | 2015-12-09 | 安捷利(番禺)电子实业有限公司 | 一种高介电常数的埋入式电容的制备方法 |
CN107241819A (zh) * | 2017-06-20 | 2017-10-10 | 武汉纺织大学 | 一种无卤阻燃柔性高分子复合电热膜的制备方法 |
CN107141794A (zh) * | 2017-06-20 | 2017-09-08 | 苏州大学 | 一种树脂基电刷及其制备方法 |
JP7076263B2 (ja) * | 2018-03-30 | 2022-05-27 | 太陽インキ製造株式会社 | 硬化性樹脂組成物、ドライフィルム、硬化物、および、電子部品 |
CN110027276A (zh) * | 2019-04-15 | 2019-07-19 | 山东金宝电子股份有限公司 | 一种高cti、无卤cem-1覆铜板的制备方法 |
CN115637127B (zh) * | 2022-07-07 | 2023-09-19 | 深圳市纽菲斯新材料科技有限公司 | 低介电损耗的fc-bga封装载板用增层胶膜及其制备方法与应用 |
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