JP7076132B2 - コンタクト - Google Patents
コンタクト Download PDFInfo
- Publication number
- JP7076132B2 JP7076132B2 JP2018088795A JP2018088795A JP7076132B2 JP 7076132 B2 JP7076132 B2 JP 7076132B2 JP 2018088795 A JP2018088795 A JP 2018088795A JP 2018088795 A JP2018088795 A JP 2018088795A JP 7076132 B2 JP7076132 B2 JP 7076132B2
- Authority
- JP
- Japan
- Prior art keywords
- contact
- hole
- base
- joint surface
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229910000679 solder Inorganic materials 0.000 claims description 26
- 238000005476 soldering Methods 0.000 claims description 10
- 230000002093 peripheral effect Effects 0.000 claims description 5
- 238000007747 plating Methods 0.000 description 24
- 239000000758 substrate Substances 0.000 description 23
- 239000010931 gold Substances 0.000 description 14
- 229910052737 gold Inorganic materials 0.000 description 14
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 13
- 238000005304 joining Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 6
- 230000001681 protective effect Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 238000004381 surface treatment Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000005489 elastic deformation Effects 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 150000002343 gold Chemical class 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
- H01R4/028—Soldered or welded connections comprising means for preventing flowing or wicking of solder or flux in parts not desired
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2442—Contacts for co-operating by abutting resilient; resiliently-mounted with a single cantilevered beam
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Contacts (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018088795A JP7076132B2 (ja) | 2018-05-02 | 2018-05-02 | コンタクト |
| EP19796536.1A EP3758153B1 (en) | 2018-05-02 | 2019-04-18 | Contact |
| CN201980022518.6A CN112437999B (zh) | 2018-05-02 | 2019-04-18 | 接触件 |
| US16/982,325 US11121494B2 (en) | 2018-05-02 | 2019-04-18 | Contact |
| PCT/JP2019/016565 WO2019211988A1 (ja) | 2018-05-02 | 2019-04-18 | コンタクト |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018088795A JP7076132B2 (ja) | 2018-05-02 | 2018-05-02 | コンタクト |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019194956A JP2019194956A (ja) | 2019-11-07 |
| JP2019194956A5 JP2019194956A5 (https=) | 2021-06-10 |
| JP7076132B2 true JP7076132B2 (ja) | 2022-05-27 |
Family
ID=68386386
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018088795A Active JP7076132B2 (ja) | 2018-05-02 | 2018-05-02 | コンタクト |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US11121494B2 (https=) |
| EP (1) | EP3758153B1 (https=) |
| JP (1) | JP7076132B2 (https=) |
| CN (1) | CN112437999B (https=) |
| WO (1) | WO2019211988A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN215266745U (zh) * | 2020-12-29 | 2021-12-21 | 番禺得意精密电子工业有限公司 | 连接器组件 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3064756U (ja) | 1999-06-10 | 2000-01-21 | トーマス アンド ベッツ インターナショナル,インク. | ア―ス用端子 |
| JP2007250320A (ja) | 2006-03-15 | 2007-09-27 | Kitagawa Ind Co Ltd | コンタクト部材 |
| JP2009093806A (ja) | 2007-10-03 | 2009-04-30 | Kitagawa Ind Co Ltd | 表面実装コンタクト |
| JP2010161010A (ja) | 2009-01-09 | 2010-07-22 | Kitagawa Ind Co Ltd | コンタクト |
| JP2013191518A (ja) | 2012-03-15 | 2013-09-26 | Kitagawa Ind Co Ltd | コンタクト部材 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58178282U (ja) | 1982-05-21 | 1983-11-29 | 三菱電機株式会社 | 電気部品のろう付端子 |
| JP2529849Y2 (ja) * | 1990-12-25 | 1997-03-19 | ヒロセ電機株式会社 | 表面実装用コネクタの補強金具構造 |
| JPH08248435A (ja) * | 1995-03-14 | 1996-09-27 | Hitachi Ltd | 電子部品およびこの電子部品を用いた液晶表示モジュール |
| US6065980A (en) | 1998-06-29 | 2000-05-23 | Cisco Technology, Inc. | Grounding a PCB to an enclosure sub-assembly using a grounding spring |
| JP3321133B2 (ja) | 2000-01-31 | 2002-09-03 | 北川工業株式会社 | 導電部材 |
| SG99960A1 (en) * | 2001-11-23 | 2003-11-27 | Fci Asia Technology Pte Ltd | Electrical connector |
| GB2390755A (en) * | 2002-07-11 | 2004-01-14 | Itt Mfg Enterprises Inc | Spring terminal |
| JP2006208062A (ja) * | 2005-01-26 | 2006-08-10 | Alps Electric Co Ltd | 接点部材及び、前記接点部材を用いた接点シート、接点基板、ならびに電子機器ユニット |
| JP4887412B2 (ja) * | 2009-09-18 | 2012-02-29 | ヒロセ電機株式会社 | 回路基板用電気コネクタ |
| US8206188B1 (en) * | 2010-12-28 | 2012-06-26 | Cheng Uei Precision Industry Co., Ltd. | Connector terminal |
| JP5809509B2 (ja) * | 2011-09-29 | 2015-11-11 | 新光電気工業株式会社 | スプリング端子付配線基板及びその実装構造とソケット |
| KR101165558B1 (ko) * | 2012-01-04 | 2012-07-16 | 강태석 | 컨텍터 |
| US10707627B2 (en) * | 2017-09-29 | 2020-07-07 | Apple Inc. | Hybrid connector |
| US10741951B2 (en) * | 2017-11-13 | 2020-08-11 | Te Connectivity Corporation | Socket connector assembly for an electronic package |
-
2018
- 2018-05-02 JP JP2018088795A patent/JP7076132B2/ja active Active
-
2019
- 2019-04-18 CN CN201980022518.6A patent/CN112437999B/zh active Active
- 2019-04-18 US US16/982,325 patent/US11121494B2/en active Active
- 2019-04-18 WO PCT/JP2019/016565 patent/WO2019211988A1/ja not_active Ceased
- 2019-04-18 EP EP19796536.1A patent/EP3758153B1/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3064756U (ja) | 1999-06-10 | 2000-01-21 | トーマス アンド ベッツ インターナショナル,インク. | ア―ス用端子 |
| JP2007250320A (ja) | 2006-03-15 | 2007-09-27 | Kitagawa Ind Co Ltd | コンタクト部材 |
| JP2009093806A (ja) | 2007-10-03 | 2009-04-30 | Kitagawa Ind Co Ltd | 表面実装コンタクト |
| JP2010161010A (ja) | 2009-01-09 | 2010-07-22 | Kitagawa Ind Co Ltd | コンタクト |
| JP2013191518A (ja) | 2012-03-15 | 2013-09-26 | Kitagawa Ind Co Ltd | コンタクト部材 |
Also Published As
| Publication number | Publication date |
|---|---|
| US11121494B2 (en) | 2021-09-14 |
| EP3758153A1 (en) | 2020-12-30 |
| US20210013658A1 (en) | 2021-01-14 |
| CN112437999A (zh) | 2021-03-02 |
| EP3758153B1 (en) | 2024-11-20 |
| EP3758153A4 (en) | 2021-11-10 |
| JP2019194956A (ja) | 2019-11-07 |
| WO2019211988A1 (ja) | 2019-11-07 |
| CN112437999B (zh) | 2022-08-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3520277B2 (ja) | 導電部材 | |
| JP6804888B2 (ja) | 同軸コネクタ | |
| CN107275305B (zh) | 一种qfn芯片 | |
| CN216698775U (zh) | 用于将基板连接在一起的电触头及包括其的电学组件 | |
| EP1684391A2 (en) | Connector terminal fabrication process and connector terminal | |
| JP6561805B2 (ja) | 基板用コネクタ | |
| JP6398354B2 (ja) | コネクタ | |
| JP5479406B2 (ja) | コネクタ | |
| JP7076132B2 (ja) | コンタクト | |
| TW202044680A (zh) | 導電端子及其製造方法以及端子料帶結構 | |
| US9570827B2 (en) | Contact member | |
| WO2019044677A1 (ja) | 端子金具 | |
| JP5927607B2 (ja) | コンタクト部材 | |
| JP2013115058A (ja) | シールドケース | |
| TWM512205U (zh) | 電接觸件及可熔元件 | |
| CN215010824U (zh) | 线路板组件和电子设备 | |
| JP4827135B2 (ja) | 表面実装クリップ | |
| JPH10340747A (ja) | 表面実装ジャンパ | |
| CN112930625B (zh) | 接触件 | |
| JP3110160U (ja) | プリント基板の接続構造 | |
| CN109417235B (zh) | 连接器 | |
| JP4724963B2 (ja) | 温度ヒューズ | |
| JP2006318833A (ja) | コネクタ | |
| JP4151498B2 (ja) | コネクタ | |
| US20080198565A1 (en) | Surface mount foot with coined edge surface |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20210416 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20210426 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20220125 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20220328 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20220426 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20220510 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 7076132 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |