JP7064823B2 - 太陽電池及びその製造方法 - Google Patents
太陽電池及びその製造方法 Download PDFInfo
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- JP7064823B2 JP7064823B2 JP2016170118A JP2016170118A JP7064823B2 JP 7064823 B2 JP7064823 B2 JP 7064823B2 JP 2016170118 A JP2016170118 A JP 2016170118A JP 2016170118 A JP2016170118 A JP 2016170118A JP 7064823 B2 JP7064823 B2 JP 7064823B2
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 46
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- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 3
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
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Description
形態に何ら限定されるものではなく、本発明の目的の範囲内において、適宜変更を加えて
実施することができる。
本実施形態に係る太陽電池は、金属電極、反射防止膜及び半導体基板を含み、受光面側に形成された前記金属電極の下部と前記基板との間には、前記反射防止膜の存在する部分および存在しない部分が混在して有しており、前記反射防止膜が存在しない部分の平均面積率は、前記金属電極下部の面積のうち、10%以上、80%以下である。
本実施形態に係る金属電極、反射防止膜及び半導体基板を含む太陽電池の製造方法は、前記半導体基板の上に反射防止膜を形成する工程と、前記金属電極の形成位置に対応する前記反射防止膜の領域にレーザー光を照射して、前記反射防止膜を部分的に除去する除去工程と、前記金属電極を形成する工程とを含む。
シリコン太陽電池セルを次のように作製した。シリコン基板の受光面側に、KOH溶液による異方性化学エッチングで高さが3~5μmのピラミッド状のテクスチャを形成した。その上にPECVD法で厚さ80nmのSiN層(反射防止膜)を形成した。また、受光面の反対側に、AlペーストとAgペーストをスクリーン印刷し、大気中800℃において5秒の焼成を行って裏面電極を形成した。
実施例1で使用したシリコン太陽電池セルのサンプルと同様に、シリコン基板の受光面側には、KOH溶液による異方性化学エッチングで高さが3~5μmのピラミッド状のテクスチャを形成した。その上にPECVD法で厚さ80nmのSiN層を形成した。また、受光面の反対側には、AlペーストとAgペーストをスクリーン印刷し、大気中800℃において5秒の焼成を行って裏面電極を形成した。
実施例1で使用したシリコン太陽電池セルのサンプルと同様に、シリコン基板の受光面に、KOH溶液による異方性化学エッチングで高さが3~5μmのピラミッド状のテクスチャを形成した。その上にPECVD法で厚さ80nmのSiN層を形成した。また、受光面の反対側に、AlペーストとAgペーストをスクリーン印刷し、大気中800℃において5秒の焼成を行って裏面電極を形成した。
実施例1で使用したシリコン太陽電池セルのサンプルと同様に、シリコン基板の受光面に、KOH溶液による異方性化学エッチングで高さが3~5μmのピラミッド状のテクスチャを形成した。その上にPECVD法で厚さ80nmのSiN層を形成した。また、受光面の反対側に、AlペーストとAgペーストをスクリーン印刷し、大気中800℃において5秒の焼成を行って裏面電極を形成した。
2 レーザー光の照射領域
3 ベンドコントアー
Claims (5)
- 金属電極、反射防止膜及び半導体基板を含む太陽電池の製造方法であって、
前記半導体基板の上に反射防止膜を形成する工程と、前記金属電極の形成位置に対応する前記反射防止膜の領域にレーザー光を照射して、前記反射防止膜を部分的に除去する除去工程と、前記金属電極を形成する工程とを含み、
前記除去工程は、波長が380nm以上、500nm以下のレーザー光を照射し、
前記レーザー光は、パルスレーザー光及び連続発振レーザー光であり、
前記太陽電池が、受光面側に形成された前記金属電極の下部と前記基板との間に、前記反射防止膜の存在する部分と存在しない部分とを混在して有しており、前記反射防止膜の存在しない部分の平均面積率は、前記金属電極の下部の面積に対して、27%以上、80%以下であり、
前記半導体基板は、受光面側にピラミッド状のテクスチャ組織が形成されているとともに、前記反射防止膜の存在しない部分において前記テクスチャ組織が破壊された平坦状の形態を示しており、
前記反射防止膜の存在しない平坦状の部分は、その表面の中心線平均粗さ(Ra)が1.5μm以下であり、
前記金属電極の下部側に位置する半導体基板は、結晶質の構造を有する、太陽電池の製造方法。 - 前記レーザー光は、出力が5W以上、80W以下である、請求項1に記載の太陽電池の製造方法。
- 前記レーザー光は、バルス幅が1ピコ秒以上、50マイクロ秒以下のパルスレーザー光である、請求項1または2に記載の太陽電池の製造方法。
- 前記レーザー光は、出力密度が0.03mJ/cm2以上、20J/cm2以下のパルスレーザー光である、請求項1~3のいずれか一項に記載の太陽電池の製造方法。
- 前記除去工程は、前記半導体基板を100℃以上、570℃以下に加熱する、請求項1~4のいずれか一項に記載の太陽電池の製造方法。
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