JP7064054B2 - 高い全光線透過率を持つポリイミド薄膜上に形成された触覚センサとそれを用いたスイッチングデバイス - Google Patents
高い全光線透過率を持つポリイミド薄膜上に形成された触覚センサとそれを用いたスイッチングデバイス Download PDFInfo
- Publication number
- JP7064054B2 JP7064054B2 JP2021528215A JP2021528215A JP7064054B2 JP 7064054 B2 JP7064054 B2 JP 7064054B2 JP 2021528215 A JP2021528215 A JP 2021528215A JP 2021528215 A JP2021528215 A JP 2021528215A JP 7064054 B2 JP7064054 B2 JP 7064054B2
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- tactile sensor
- ferroelectric layer
- thin film
- printing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229920001721 polyimide Polymers 0.000 title claims description 90
- 239000004642 Polyimide Substances 0.000 title claims description 75
- 239000010409 thin film Substances 0.000 title claims description 71
- 238000002834 transmittance Methods 0.000 title claims description 22
- 229920001940 conductive polymer Polymers 0.000 claims description 32
- BQCIDUSAKPWEOX-UHFFFAOYSA-N 1,1-Difluoroethene Chemical compound FC(F)=C BQCIDUSAKPWEOX-UHFFFAOYSA-N 0.000 claims description 28
- MIZLGWKEZAPEFJ-UHFFFAOYSA-N 1,1,2-trifluoroethene Chemical group FC=C(F)F MIZLGWKEZAPEFJ-UHFFFAOYSA-N 0.000 claims description 23
- 230000002950 deficient Effects 0.000 claims description 20
- 230000009477 glass transition Effects 0.000 claims description 19
- 229910052709 silver Inorganic materials 0.000 claims description 18
- 239000004332 silver Substances 0.000 claims description 18
- 229920001577 copolymer Polymers 0.000 claims description 14
- 125000002723 alicyclic group Chemical group 0.000 claims description 6
- 125000003118 aryl group Chemical group 0.000 claims description 2
- 230000001149 cognitive effect Effects 0.000 claims description 2
- 229920000123 polythiophene Polymers 0.000 claims description 2
- 230000001737 promoting effect Effects 0.000 claims 1
- 239000010410 layer Substances 0.000 description 119
- 238000000034 method Methods 0.000 description 79
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 60
- 238000007639 printing Methods 0.000 description 60
- 239000011248 coating agent Substances 0.000 description 49
- 238000000576 coating method Methods 0.000 description 49
- -1 polyethylene terephthalate Polymers 0.000 description 40
- 238000007645 offset printing Methods 0.000 description 39
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 36
- 239000000463 material Substances 0.000 description 36
- 229910052751 metal Inorganic materials 0.000 description 34
- 239000002184 metal Substances 0.000 description 34
- 238000010304 firing Methods 0.000 description 33
- 239000002861 polymer material Substances 0.000 description 32
- 239000000976 ink Substances 0.000 description 29
- 230000010287 polarization Effects 0.000 description 29
- 239000002966 varnish Substances 0.000 description 28
- 239000000758 substrate Substances 0.000 description 27
- 230000005684 electric field Effects 0.000 description 26
- 238000010438 heat treatment Methods 0.000 description 26
- 238000007650 screen-printing Methods 0.000 description 23
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 22
- 230000006870 function Effects 0.000 description 22
- 239000002923 metal particle Substances 0.000 description 22
- 239000010408 film Substances 0.000 description 19
- 239000004698 Polyethylene Substances 0.000 description 18
- 239000005388 borosilicate glass Substances 0.000 description 18
- 229920006254 polymer film Polymers 0.000 description 18
- 239000002904 solvent Substances 0.000 description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 18
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 17
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 16
- 230000007547 defect Effects 0.000 description 16
- 239000011521 glass Substances 0.000 description 16
- 230000000052 comparative effect Effects 0.000 description 13
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 12
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 12
- 239000003575 carbonaceous material Substances 0.000 description 12
- 150000002894 organic compounds Chemical class 0.000 description 12
- 230000008569 process Effects 0.000 description 12
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 11
- 238000004891 communication Methods 0.000 description 11
- 239000013078 crystal Substances 0.000 description 11
- 238000005516 engineering process Methods 0.000 description 11
- 229920005575 poly(amic acid) Polymers 0.000 description 11
- 230000015572 biosynthetic process Effects 0.000 description 10
- 239000010935 stainless steel Substances 0.000 description 10
- 229910001220 stainless steel Inorganic materials 0.000 description 10
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 9
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 9
- 241000209094 Oryza Species 0.000 description 9
- 235000007164 Oryza sativa Nutrition 0.000 description 9
- 230000002238 attenuated effect Effects 0.000 description 9
- 230000008859 change Effects 0.000 description 9
- 238000005259 measurement Methods 0.000 description 9
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 9
- 239000003960 organic solvent Substances 0.000 description 9
- 229920003023 plastic Polymers 0.000 description 9
- 239000004033 plastic Substances 0.000 description 9
- 239000005020 polyethylene terephthalate Substances 0.000 description 9
- 229920000139 polyethylene terephthalate Polymers 0.000 description 9
- 235000009566 rice Nutrition 0.000 description 9
- 239000002033 PVDF binder Substances 0.000 description 8
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 8
- 238000011161 development Methods 0.000 description 8
- 230000018109 developmental process Effects 0.000 description 8
- 239000004205 dimethyl polysiloxane Substances 0.000 description 8
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 8
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 8
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 8
- 230000035882 stress Effects 0.000 description 8
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 7
- 239000004734 Polyphenylene sulfide Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 7
- 229920001971 elastomer Polymers 0.000 description 7
- 239000011261 inert gas Substances 0.000 description 7
- 238000007641 inkjet printing Methods 0.000 description 7
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 description 7
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 description 7
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 7
- 239000011112 polyethylene naphthalate Substances 0.000 description 7
- 229920000069 polyphenylene sulfide Polymers 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 6
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 6
- 239000004743 Polypropylene Substances 0.000 description 6
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- NNBZCPXTIHJBJL-UHFFFAOYSA-N decalin Chemical compound C1CCCC2CCCCC21 NNBZCPXTIHJBJL-UHFFFAOYSA-N 0.000 description 6
- 238000001514 detection method Methods 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 238000012544 monitoring process Methods 0.000 description 6
- 229920001155 polypropylene Polymers 0.000 description 6
- 239000005060 rubber Substances 0.000 description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 5
- 241000282412 Homo Species 0.000 description 5
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical group CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 230000018044 dehydration Effects 0.000 description 5
- 238000006297 dehydration reaction Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- 238000007363 ring formation reaction Methods 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 230000037303 wrinkles Effects 0.000 description 5
- QPFMBZIOSGYJDE-UHFFFAOYSA-N 1,1,2,2-tetrachloroethane Chemical compound ClC(Cl)C(Cl)Cl QPFMBZIOSGYJDE-UHFFFAOYSA-N 0.000 description 4
- QEGNUYASOUJEHD-UHFFFAOYSA-N 1,1-dimethylcyclohexane Chemical compound CC1(C)CCCCC1 QEGNUYASOUJEHD-UHFFFAOYSA-N 0.000 description 4
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 4
- RGSFGYAAUTVSQA-UHFFFAOYSA-N Cyclopentane Chemical compound C1CCCC1 RGSFGYAAUTVSQA-UHFFFAOYSA-N 0.000 description 4
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 4
- YNQLUTRBYVCPMQ-UHFFFAOYSA-N Ethylbenzene Chemical compound CCC1=CC=CC=C1 YNQLUTRBYVCPMQ-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 4
- OXIKYYJDTWKERT-UHFFFAOYSA-N [4-(aminomethyl)cyclohexyl]methanamine Chemical compound NCC1CCC(CN)CC1 OXIKYYJDTWKERT-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- RDOXTESZEPMUJZ-UHFFFAOYSA-N anisole Chemical compound COC1=CC=CC=C1 RDOXTESZEPMUJZ-UHFFFAOYSA-N 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 239000006185 dispersion Substances 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- UAEPNZWRGJTJPN-UHFFFAOYSA-N methylcyclohexane Chemical compound CC1CCCCC1 UAEPNZWRGJTJPN-UHFFFAOYSA-N 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 239000002985 plastic film Substances 0.000 description 4
- 229920006255 plastic film Polymers 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 239000004417 polycarbonate Substances 0.000 description 4
- 229920000515 polycarbonate Polymers 0.000 description 4
- 239000007858 starting material Substances 0.000 description 4
- RELMFMZEBKVZJC-UHFFFAOYSA-N 1,2,3-trichlorobenzene Chemical compound ClC1=CC=CC(Cl)=C1Cl RELMFMZEBKVZJC-UHFFFAOYSA-N 0.000 description 3
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 3
- OISVCGZHLKNMSJ-UHFFFAOYSA-N 2,6-dimethylpyridine Chemical compound CC1=CC=CC(C)=N1 OISVCGZHLKNMSJ-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 3
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- 239000004696 Poly ether ether ketone Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 description 3
- 238000013473 artificial intelligence Methods 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000000470 constituent Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- VKIRRGRTJUUZHS-UHFFFAOYSA-N cyclohexane-1,4-diamine Chemical compound NC1CCC(N)CC1 VKIRRGRTJUUZHS-UHFFFAOYSA-N 0.000 description 3
- 238000007607 die coating method Methods 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 230000036541 health Effects 0.000 description 3
- 229930195733 hydrocarbon Natural products 0.000 description 3
- 150000002430 hydrocarbons Chemical class 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 238000001459 lithography Methods 0.000 description 3
- 230000007774 longterm Effects 0.000 description 3
- 210000004072 lung Anatomy 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 229920002530 polyetherether ketone Polymers 0.000 description 3
- 230000002265 prevention Effects 0.000 description 3
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 230000000241 respiratory effect Effects 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 3
- CXWXQJXEFPUFDZ-UHFFFAOYSA-N tetralin Chemical compound C1=CC=C2CCCCC2=C1 CXWXQJXEFPUFDZ-UHFFFAOYSA-N 0.000 description 3
- 238000003856 thermoforming Methods 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 239000008096 xylene Substances 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- SCYULBFZEHDVBN-UHFFFAOYSA-N 1,1-Dichloroethane Chemical compound CC(Cl)Cl SCYULBFZEHDVBN-UHFFFAOYSA-N 0.000 description 2
- WSLDOOZREJYCGB-UHFFFAOYSA-N 1,2-Dichloroethane Chemical group ClCCCl WSLDOOZREJYCGB-UHFFFAOYSA-N 0.000 description 2
- RFFLAFLAYFXFSW-UHFFFAOYSA-N 1,2-dichlorobenzene Chemical compound ClC1=CC=CC=C1Cl RFFLAFLAYFXFSW-UHFFFAOYSA-N 0.000 description 2
- CYSGHNMQYZDMIA-UHFFFAOYSA-N 1,3-Dimethyl-2-imidazolidinon Chemical compound CN1CCN(C)C1=O CYSGHNMQYZDMIA-UHFFFAOYSA-N 0.000 description 2
- OCJBOOLMMGQPQU-UHFFFAOYSA-N 1,4-dichlorobenzene Chemical compound ClC1=CC=C(Cl)C=C1 OCJBOOLMMGQPQU-UHFFFAOYSA-N 0.000 description 2
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 description 2
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 2
- QPUYECUOLPXSFR-UHFFFAOYSA-N 1-methylnaphthalene Chemical compound C1=CC=C2C(C)=CC=CC2=C1 QPUYECUOLPXSFR-UHFFFAOYSA-N 0.000 description 2
- QWBBPBRQALCEIZ-UHFFFAOYSA-N 2,3-dimethylphenol Chemical compound CC1=CC=CC(O)=C1C QWBBPBRQALCEIZ-UHFFFAOYSA-N 0.000 description 2
- JYYNAJVZFGKDEQ-UHFFFAOYSA-N 2,4-Dimethylpyridine Chemical compound CC1=CC=NC(C)=C1 JYYNAJVZFGKDEQ-UHFFFAOYSA-N 0.000 description 2
- NKTOLZVEWDHZMU-UHFFFAOYSA-N 2,5-xylenol Chemical compound CC1=CC=C(C)C(O)=C1 NKTOLZVEWDHZMU-UHFFFAOYSA-N 0.000 description 2
- NXXYKOUNUYWIHA-UHFFFAOYSA-N 2,6-Dimethylphenol Chemical compound CC1=CC=CC(C)=C1O NXXYKOUNUYWIHA-UHFFFAOYSA-N 0.000 description 2
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 2
- YCOXTKKNXUZSKD-UHFFFAOYSA-N 3,4-xylenol Chemical compound CC1=CC=C(O)C=C1C YCOXTKKNXUZSKD-UHFFFAOYSA-N 0.000 description 2
- TUAMRELNJMMDMT-UHFFFAOYSA-N 3,5-xylenol Chemical compound CC1=CC(C)=CC(O)=C1 TUAMRELNJMMDMT-UHFFFAOYSA-N 0.000 description 2
- QQGYZOYWNCKGEK-UHFFFAOYSA-N 5-[(1,3-dioxo-2-benzofuran-5-yl)oxy]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(OC=2C=C3C(=O)OC(C3=CC=2)=O)=C1 QQGYZOYWNCKGEK-UHFFFAOYSA-N 0.000 description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- 229920008347 Cellulose acetate propionate Polymers 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 2
- OHLUUHNLEMFGTQ-UHFFFAOYSA-N N-methylacetamide Chemical compound CNC(C)=O OHLUUHNLEMFGTQ-UHFFFAOYSA-N 0.000 description 2
- ZWXPDGCFMMFNRW-UHFFFAOYSA-N N-methylcaprolactam Chemical compound CN1CCCCCC1=O ZWXPDGCFMMFNRW-UHFFFAOYSA-N 0.000 description 2
- URLKBWYHVLBVBO-UHFFFAOYSA-N Para-Xylene Chemical group CC1=CC=C(C)C=C1 URLKBWYHVLBVBO-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- NQRYJNQNLNOLGT-UHFFFAOYSA-N Piperidine Chemical compound C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 description 2
- 241000543375 Sideroxylon Species 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- KEUCYUPOICDBOG-UHFFFAOYSA-N [2-(aminomethyl)-5-bicyclo[2.2.1]heptanyl]methanamine Chemical compound C1C2C(CN)CC1C(CN)C2 KEUCYUPOICDBOG-UHFFFAOYSA-N 0.000 description 2
- OTKFKCIRTBTDKK-UHFFFAOYSA-N [3-(aminomethyl)-5-bicyclo[2.2.1]heptanyl]methanamine Chemical compound C1C(CN)C2C(CN)CC1C2 OTKFKCIRTBTDKK-UHFFFAOYSA-N 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 2
- 150000001408 amides Chemical class 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 2
- XMSVKICKONKVNM-UHFFFAOYSA-N bicyclo[2.2.1]heptane-3,4-diamine Chemical class C1CC2(N)C(N)CC1C2 XMSVKICKONKVNM-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- QARVLSVVCXYDNA-UHFFFAOYSA-N bromobenzene Chemical compound BrC1=CC=CC=C1 QARVLSVVCXYDNA-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- BGTOWKSIORTVQH-UHFFFAOYSA-N cyclopentanone Chemical compound O=C1CCCC1 BGTOWKSIORTVQH-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 description 2
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
- KZTYYGOKRVBIMI-UHFFFAOYSA-N diphenyl sulfone Chemical compound C=1C=CC=CC=1S(=O)(=O)C1=CC=CC=C1 KZTYYGOKRVBIMI-UHFFFAOYSA-N 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- 239000012776 electronic material Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 150000002170 ethers Chemical class 0.000 description 2
- 230000001747 exhibiting effect Effects 0.000 description 2
- 230000005621 ferroelectricity Effects 0.000 description 2
- 230000005669 field effect Effects 0.000 description 2
- 125000001153 fluoro group Chemical group F* 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- DMEGYFMYUHOHGS-UHFFFAOYSA-N heptamethylene Natural products C1CCCCCC1 DMEGYFMYUHOHGS-UHFFFAOYSA-N 0.000 description 2
- GNOIPBMMFNIUFM-UHFFFAOYSA-N hexamethylphosphoric triamide Chemical compound CN(C)P(=O)(N(C)C)N(C)C GNOIPBMMFNIUFM-UHFFFAOYSA-N 0.000 description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-M hexanoate Chemical compound CCCCCC([O-])=O FUZZWVXGSFPDMH-UHFFFAOYSA-M 0.000 description 2
- HJOVHMDZYOCNQW-UHFFFAOYSA-N isophorone Chemical compound CC1=CC(=O)CC(C)(C)C1 HJOVHMDZYOCNQW-UHFFFAOYSA-N 0.000 description 2
- AWJUIBRHMBBTKR-UHFFFAOYSA-N isoquinoline Chemical compound C1=NC=CC2=CC=CC=C21 AWJUIBRHMBBTKR-UHFFFAOYSA-N 0.000 description 2
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 2
- IVSZLXZYQVIEFR-UHFFFAOYSA-N m-xylene Chemical group CC1=CC=CC(C)=C1 IVSZLXZYQVIEFR-UHFFFAOYSA-N 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- UZKWTJUDCOPSNM-UHFFFAOYSA-N methoxybenzene Substances CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 description 2
- TZIHFWKZFHZASV-UHFFFAOYSA-N methyl formate Chemical compound COC=O TZIHFWKZFHZASV-UHFFFAOYSA-N 0.000 description 2
- GYNNXHKOJHMOHS-UHFFFAOYSA-N methyl-cycloheptane Natural products CC1CCCCCC1 GYNNXHKOJHMOHS-UHFFFAOYSA-N 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- AJFDBNQQDYLMJN-UHFFFAOYSA-N n,n-diethylacetamide Chemical compound CCN(CC)C(C)=O AJFDBNQQDYLMJN-UHFFFAOYSA-N 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052756 noble gas Inorganic materials 0.000 description 2
- 230000000474 nursing effect Effects 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 2
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000000275 quality assurance Methods 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 230000015541 sensory perception of touch Effects 0.000 description 2
- NDVLTYZPCACLMA-UHFFFAOYSA-N silver oxide Chemical compound [O-2].[Ag+].[Ag+] NDVLTYZPCACLMA-UHFFFAOYSA-N 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 125000001424 substituent group Chemical group 0.000 description 2
- HHVIBTZHLRERCL-UHFFFAOYSA-N sulfonyldimethane Chemical compound CS(C)(=O)=O HHVIBTZHLRERCL-UHFFFAOYSA-N 0.000 description 2
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 2
- ZUHZGEOKBKGPSW-UHFFFAOYSA-N tetraglyme Chemical compound COCCOCCOCCOCCOC ZUHZGEOKBKGPSW-UHFFFAOYSA-N 0.000 description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 2
- PXXNTAGJWPJAGM-UHFFFAOYSA-N vertaline Natural products C1C2C=3C=C(OC)C(OC)=CC=3OC(C=C3)=CC=C3CCC(=O)OC1CC1N2CCCC1 PXXNTAGJWPJAGM-UHFFFAOYSA-N 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 239000013585 weight reducing agent Substances 0.000 description 2
- 229910052724 xenon Inorganic materials 0.000 description 2
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 2
- DNIAPMSPPWPWGF-VKHMYHEASA-N (+)-propylene glycol Chemical compound C[C@H](O)CO DNIAPMSPPWPWGF-VKHMYHEASA-N 0.000 description 1
- UGCMFUQMPWJOON-UHFFFAOYSA-N (1-cycloheptylcycloheptyl)methanediamine Chemical compound C1CCCCCC1C1(C(N)N)CCCCCC1 UGCMFUQMPWJOON-UHFFFAOYSA-N 0.000 description 1
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical compound C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 description 1
- ORTVZLZNOYNASJ-UPHRSURJSA-N (z)-but-2-ene-1,4-diol Chemical compound OC\C=C/CO ORTVZLZNOYNASJ-UPHRSURJSA-N 0.000 description 1
- AVQQQNCBBIEMEU-UHFFFAOYSA-N 1,1,3,3-tetramethylurea Chemical compound CN(C)C(=O)N(C)C AVQQQNCBBIEMEU-UHFFFAOYSA-N 0.000 description 1
- ZWVMLYRJXORSEP-UHFFFAOYSA-N 1,2,6-Hexanetriol Chemical compound OCCCCC(O)CO ZWVMLYRJXORSEP-UHFFFAOYSA-N 0.000 description 1
- WQONPSCCEXUXTQ-UHFFFAOYSA-N 1,2-dibromobenzene Chemical compound BrC1=CC=CC=C1Br WQONPSCCEXUXTQ-UHFFFAOYSA-N 0.000 description 1
- JSRLURSZEMLAFO-UHFFFAOYSA-N 1,3-dibromobenzene Chemical compound BrC1=CC=CC(Br)=C1 JSRLURSZEMLAFO-UHFFFAOYSA-N 0.000 description 1
- ZPQOPVIELGIULI-UHFFFAOYSA-N 1,3-dichlorobenzene Chemical compound ClC1=CC=CC(Cl)=C1 ZPQOPVIELGIULI-UHFFFAOYSA-N 0.000 description 1
- YPFDHNVEDLHUCE-UHFFFAOYSA-N 1,3-propanediol Substances OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 1
- SPPWGCYEYAMHDT-UHFFFAOYSA-N 1,4-di(propan-2-yl)benzene Chemical compound CC(C)C1=CC=C(C(C)C)C=C1 SPPWGCYEYAMHDT-UHFFFAOYSA-N 0.000 description 1
- SWJPEBQEEAHIGZ-UHFFFAOYSA-N 1,4-dibromobenzene Chemical compound BrC1=CC=C(Br)C=C1 SWJPEBQEEAHIGZ-UHFFFAOYSA-N 0.000 description 1
- MNKDMOZTFOSBSA-UHFFFAOYSA-N 1-(1-aminocycloheptyl)cycloheptan-1-amine Chemical compound C1CCCCCC1(N)C1(N)CCCCCC1 MNKDMOZTFOSBSA-UHFFFAOYSA-N 0.000 description 1
- QWOZZTWBWQMEPD-UHFFFAOYSA-N 1-(2-ethoxypropoxy)propan-2-ol Chemical compound CCOC(C)COCC(C)O QWOZZTWBWQMEPD-UHFFFAOYSA-N 0.000 description 1
- SPJXZYLLLWOSLQ-UHFFFAOYSA-N 1-[(1-aminocyclohexyl)methyl]cyclohexan-1-amine Chemical compound C1CCCCC1(N)CC1(N)CCCCC1 SPJXZYLLLWOSLQ-UHFFFAOYSA-N 0.000 description 1
- QSSXJPIWXQTSIX-UHFFFAOYSA-N 1-bromo-2-methylbenzene Chemical compound CC1=CC=CC=C1Br QSSXJPIWXQTSIX-UHFFFAOYSA-N 0.000 description 1
- WJIFKOVZNJTSGO-UHFFFAOYSA-N 1-bromo-3-methylbenzene Chemical compound CC1=CC=CC(Br)=C1 WJIFKOVZNJTSGO-UHFFFAOYSA-N 0.000 description 1
- ZBTMRBYMKUEVEU-UHFFFAOYSA-N 1-bromo-4-methylbenzene Chemical compound CC1=CC=C(Br)C=C1 ZBTMRBYMKUEVEU-UHFFFAOYSA-N 0.000 description 1
- IBSQPLPBRSHTTG-UHFFFAOYSA-N 1-chloro-2-methylbenzene Chemical compound CC1=CC=CC=C1Cl IBSQPLPBRSHTTG-UHFFFAOYSA-N 0.000 description 1
- OSOUNOBYRMOXQQ-UHFFFAOYSA-N 1-chloro-3-methylbenzene Chemical compound CC1=CC=CC(Cl)=C1 OSOUNOBYRMOXQQ-UHFFFAOYSA-N 0.000 description 1
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 description 1
- JOLQKTGDSGKSKJ-UHFFFAOYSA-N 1-ethoxypropan-2-ol Chemical compound CCOCC(C)O JOLQKTGDSGKSKJ-UHFFFAOYSA-N 0.000 description 1
- KUFFULVDNCHOFZ-UHFFFAOYSA-N 2,4-xylenol Chemical compound CC1=CC=C(O)C(C)=C1 KUFFULVDNCHOFZ-UHFFFAOYSA-N 0.000 description 1
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- WFSMVVDJSNMRAR-UHFFFAOYSA-N 2-[2-(2-ethoxyethoxy)ethoxy]ethanol Chemical compound CCOCCOCCOCCO WFSMVVDJSNMRAR-UHFFFAOYSA-N 0.000 description 1
- WAEVWDZKMBQDEJ-UHFFFAOYSA-N 2-[2-(2-methoxypropoxy)propoxy]propan-1-ol Chemical compound COC(C)COC(C)COC(C)CO WAEVWDZKMBQDEJ-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- ISPYQTSUDJAMAB-UHFFFAOYSA-N 2-chlorophenol Chemical compound OC1=CC=CC=C1Cl ISPYQTSUDJAMAB-UHFFFAOYSA-N 0.000 description 1
- 229940093475 2-ethoxyethanol Drugs 0.000 description 1
- XWKFPIODWVPXLX-UHFFFAOYSA-N 2-methyl-5-methylpyridine Natural products CC1=CC=C(C)N=C1 XWKFPIODWVPXLX-UHFFFAOYSA-N 0.000 description 1
- BSKHPKMHTQYZBB-UHFFFAOYSA-N 2-methylpyridine Chemical compound CC1=CC=CC=N1 BSKHPKMHTQYZBB-UHFFFAOYSA-N 0.000 description 1
- DOYCGPYUOIXUFZ-UHFFFAOYSA-N 2-oxabicyclo[2.2.1]heptane-3,4-diamine Chemical compound C1CC2(N)C(N)OC1C2 DOYCGPYUOIXUFZ-UHFFFAOYSA-N 0.000 description 1
- HCGFUIQPSOCUHI-UHFFFAOYSA-N 2-propan-2-yloxyethanol Chemical compound CC(C)OCCO HCGFUIQPSOCUHI-UHFFFAOYSA-N 0.000 description 1
- SMDGQEQWSSYZKX-UHFFFAOYSA-N 3-(2,3-dicarboxyphenoxy)phthalic acid Chemical compound OC(=O)C1=CC=CC(OC=2C(=C(C(O)=O)C=CC=2)C(O)=O)=C1C(O)=O SMDGQEQWSSYZKX-UHFFFAOYSA-N 0.000 description 1
- GWHLJVMSZRKEAQ-UHFFFAOYSA-N 3-(2,3-dicarboxyphenyl)phthalic acid Chemical compound OC(=O)C1=CC=CC(C=2C(=C(C(O)=O)C=CC=2)C(O)=O)=C1C(O)=O GWHLJVMSZRKEAQ-UHFFFAOYSA-N 0.000 description 1
- JPOCTPGABIRZFY-UHFFFAOYSA-N 3-(2,3-dicarboxyphenyl)sulfanylphthalic acid Chemical compound OC(=O)C1=CC=CC(SC=2C(=C(C(O)=O)C=CC=2)C(O)=O)=C1C(O)=O JPOCTPGABIRZFY-UHFFFAOYSA-N 0.000 description 1
- QCAHUFWKIQLBNB-UHFFFAOYSA-N 3-(3-methoxypropoxy)propan-1-ol Chemical compound COCCCOCCCO QCAHUFWKIQLBNB-UHFFFAOYSA-N 0.000 description 1
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 1
- FUJGQJMITCJTFA-UHFFFAOYSA-N 3-[3-(2,3-dicarboxyphenoxy)phenoxy]phthalic acid Chemical compound OC(=O)C1=CC=CC(OC=2C=C(OC=3C(=C(C(O)=O)C=CC=3)C(O)=O)C=CC=2)=C1C(O)=O FUJGQJMITCJTFA-UHFFFAOYSA-N 0.000 description 1
- KHDSXXRHWXXXBY-UHFFFAOYSA-N 3-[4-(2,3-dicarboxyphenoxy)phenoxy]phthalic acid Chemical compound OC(=O)C1=CC=CC(OC=2C=CC(OC=3C(=C(C(O)=O)C=CC=3)C(O)=O)=CC=2)=C1C(O)=O KHDSXXRHWXXXBY-UHFFFAOYSA-N 0.000 description 1
- HORNXRXVQWOLPJ-UHFFFAOYSA-N 3-chlorophenol Chemical compound OC1=CC=CC(Cl)=C1 HORNXRXVQWOLPJ-UHFFFAOYSA-N 0.000 description 1
- ITQTTZVARXURQS-UHFFFAOYSA-N 3-methylpyridine Chemical compound CC1=CC=CN=C1 ITQTTZVARXURQS-UHFFFAOYSA-N 0.000 description 1
- LFBALUPVVFCEPA-UHFFFAOYSA-N 4-(3,4-dicarboxyphenyl)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)C(C(O)=O)=C1 LFBALUPVVFCEPA-UHFFFAOYSA-N 0.000 description 1
- NPDACUSDTOMAMK-UHFFFAOYSA-N 4-Chlorotoluene Chemical compound CC1=CC=C(Cl)C=C1 NPDACUSDTOMAMK-UHFFFAOYSA-N 0.000 description 1
- GEYAGBVEAJGCFB-UHFFFAOYSA-N 4-[2-(3,4-dicarboxyphenyl)propan-2-yl]phthalic acid Chemical compound C=1C=C(C(O)=O)C(C(O)=O)=CC=1C(C)(C)C1=CC=C(C(O)=O)C(C(O)=O)=C1 GEYAGBVEAJGCFB-UHFFFAOYSA-N 0.000 description 1
- FOCQMELIWLXNGL-UHFFFAOYSA-N 4-[3-(3,4-dicarboxybenzoyl)benzoyl]phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C(=O)C1=CC=CC(C(=O)C=2C=C(C(C(O)=O)=CC=2)C(O)=O)=C1 FOCQMELIWLXNGL-UHFFFAOYSA-N 0.000 description 1
- FOMRNNDDNMWZFO-UHFFFAOYSA-N 4-[4-(3,4-dicarboxybenzoyl)benzoyl]phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C(=O)C1=CC=C(C(=O)C=2C=C(C(C(O)=O)=CC=2)C(O)=O)C=C1 FOMRNNDDNMWZFO-UHFFFAOYSA-N 0.000 description 1
- WXNZTHHGJRFXKQ-UHFFFAOYSA-N 4-chlorophenol Chemical compound OC1=CC=C(Cl)C=C1 WXNZTHHGJRFXKQ-UHFFFAOYSA-N 0.000 description 1
- UTPHVTOEOCZQJU-UHFFFAOYSA-N 4-methylbicyclo[2.2.1]heptane Chemical compound C1CC2CCC1(C)C2 UTPHVTOEOCZQJU-UHFFFAOYSA-N 0.000 description 1
- FKNQCJSGGFJEIZ-UHFFFAOYSA-N 4-methylpyridine Chemical compound CC1=CC=NC=C1 FKNQCJSGGFJEIZ-UHFFFAOYSA-N 0.000 description 1
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 description 1
- QHHKLPCQTTWFSS-UHFFFAOYSA-N 5-[2-(1,3-dioxo-2-benzofuran-5-yl)-1,1,1,3,3,3-hexafluoropropan-2-yl]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)(C(F)(F)F)C(F)(F)F)=C1 QHHKLPCQTTWFSS-UHFFFAOYSA-N 0.000 description 1
- BBTGUNMUUYNPLH-UHFFFAOYSA-N 5-[4-[(1,3-dioxo-2-benzofuran-5-yl)oxy]phenoxy]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(OC2=CC=C(C=C2)OC=2C=C3C(=O)OC(C3=CC=2)=O)=C1 BBTGUNMUUYNPLH-UHFFFAOYSA-N 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 229920002284 Cellulose triacetate Polymers 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- IKGATDHNNVEMQB-UHFFFAOYSA-N O-[1-(1-aminooxycycloheptyl)cycloheptyl]hydroxylamine Chemical compound NOC1(CCCCCC1)C1(CCCCCC1)ON IKGATDHNNVEMQB-UHFFFAOYSA-N 0.000 description 1
- ALQSHHUCVQOPAS-UHFFFAOYSA-N Pentane-1,5-diol Chemical compound OCCCCCO ALQSHHUCVQOPAS-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N Tetraethylene glycol, Natural products OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 1
- 239000001089 [(2R)-oxolan-2-yl]methanol Substances 0.000 description 1
- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 description 1
- XZAHJRZBUWYCBM-UHFFFAOYSA-N [1-(aminomethyl)cyclohexyl]methanamine Chemical compound NCC1(CN)CCCCC1 XZAHJRZBUWYCBM-UHFFFAOYSA-N 0.000 description 1
- 239000006230 acetylene black Substances 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000005456 alcohol based solvent Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 230000019552 anatomical structure morphogenesis Effects 0.000 description 1
- 238000010009 beating Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- OWBTYPJTUOEWEK-UHFFFAOYSA-N butane-2,3-diol Chemical compound CC(O)C(C)O OWBTYPJTUOEWEK-UHFFFAOYSA-N 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 150000001722 carbon compounds Chemical class 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- XRLHAJCIEMOBLT-UHFFFAOYSA-N cyclobutane-1,1-diamine Chemical compound NC1(N)CCC1 XRLHAJCIEMOBLT-UHFFFAOYSA-N 0.000 description 1
- ARUKYTASOALXFG-UHFFFAOYSA-N cycloheptylcycloheptane Chemical compound C1CCCCCC1C1CCCCCC1 ARUKYTASOALXFG-UHFFFAOYSA-N 0.000 description 1
- YMHQVDAATAEZLO-UHFFFAOYSA-N cyclohexane-1,1-diamine Chemical compound NC1(N)CCCCC1 YMHQVDAATAEZLO-UHFFFAOYSA-N 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 125000006159 dianhydride group Chemical group 0.000 description 1
- 229940117389 dichlorobenzene Drugs 0.000 description 1
- 229940019778 diethylene glycol diethyl ether Drugs 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 1
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 125000002573 ethenylidene group Chemical group [*]=C=C([H])[H] 0.000 description 1
- 239000004210 ether based solvent Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000003203 everyday effect Effects 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- WBJINCZRORDGAQ-UHFFFAOYSA-N formic acid ethyl ester Natural products CCOC=O WBJINCZRORDGAQ-UHFFFAOYSA-N 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical group C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 150000008282 halocarbons Chemical class 0.000 description 1
- 230000003862 health status Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- TXGJTWACJNYNOJ-UHFFFAOYSA-N hexane-2,4-diol Chemical compound CCC(O)CC(C)O TXGJTWACJNYNOJ-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- AUHZEENZYGFFBQ-UHFFFAOYSA-N mesitylene Substances CC1=CC(C)=CC(C)=C1 AUHZEENZYGFFBQ-UHFFFAOYSA-N 0.000 description 1
- 125000001827 mesitylenyl group Chemical group [H]C1=C(C(*)=C(C([H])=C1C([H])([H])[H])C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229940043265 methyl isobutyl ketone Drugs 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- PYLWMHQQBFSUBP-UHFFFAOYSA-N monofluorobenzene Chemical compound FC1=CC=CC=C1 PYLWMHQQBFSUBP-UHFFFAOYSA-N 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- DNIAPMSPPWPWGF-UHFFFAOYSA-N monopropylene glycol Natural products CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 1
- YZOISHTVEWVNHA-UHFFFAOYSA-N n,n'-dicyclohexylmethanediamine Chemical compound C1CCCCC1NCNC1CCCCC1 YZOISHTVEWVNHA-UHFFFAOYSA-N 0.000 description 1
- DOBFTMLCEYUAQC-UHFFFAOYSA-N naphthalene-2,3,6,7-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C=C2C=C(C(O)=O)C(C(=O)O)=CC2=C1 DOBFTMLCEYUAQC-UHFFFAOYSA-N 0.000 description 1
- YTVNOVQHSGMMOV-UHFFFAOYSA-N naphthalenetetracarboxylic dianhydride Chemical compound C1=CC(C(=O)OC2=O)=C3C2=CC=C2C(=O)OC(=O)C1=C32 YTVNOVQHSGMMOV-UHFFFAOYSA-N 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 229940078552 o-xylene Drugs 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 239000006072 paste Substances 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920000172 poly(styrenesulfonic acid) Polymers 0.000 description 1
- 229920001197 polyacetylene Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920000128 polypyrrole Polymers 0.000 description 1
- 229940005642 polystyrene sulfonic acid Drugs 0.000 description 1
- 229920000166 polytrimethylene carbonate Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 229960004063 propylene glycol Drugs 0.000 description 1
- 235000013772 propylene glycol Nutrition 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 230000010349 pulsation Effects 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 230000005616 pyroelectricity Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910001923 silver oxide Inorganic materials 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- HXJUTPCZVOIRIF-UHFFFAOYSA-N sulfolane Chemical compound O=S1(=O)CCCC1 HXJUTPCZVOIRIF-UHFFFAOYSA-N 0.000 description 1
- 235000019640 taste Nutrition 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- BSYVTEYKTMYBMK-UHFFFAOYSA-N tetrahydrofurfuryl alcohol Chemical compound OCC1CCCO1 BSYVTEYKTMYBMK-UHFFFAOYSA-N 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- YFNKIDBQEZZDLK-UHFFFAOYSA-N triglyme Chemical compound COCCOCCOCCOC YFNKIDBQEZZDLK-UHFFFAOYSA-N 0.000 description 1
- YFTHZRPMJXBUME-UHFFFAOYSA-N tripropylamine Chemical compound CCCN(CCC)CCC YFTHZRPMJXBUME-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1075—Partially aromatic polyimides
- C08G73/1082—Partially aromatic polyimides wholly aromatic in the tetracarboxylic moiety
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
- H03K17/96—Touch switches
- H03K17/964—Piezoelectric touch switches
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/042—Coating with two or more layers, where at least one layer of a composition contains a polymer binder
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
- C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/16—Measuring force or stress, in general using properties of piezoelectric devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
- H10N30/302—Sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/704—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
- H10N30/706—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings characterised by the underlying bases, e.g. substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/802—Circuitry or processes for operating piezoelectric or electrostrictive devices not otherwise provided for, e.g. drive circuits
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/857—Macromolecular compositions
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2427/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers
- C08J2427/02—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment
- C08J2427/12—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
- C08J2427/16—Homopolymers or copolymers of vinylidene fluoride
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2465/00—Characterised by the use of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Derivatives of such polymers
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Laminated Bodies (AREA)
Description
ガラス転移温度が280℃、引っ張り強度が190MPa、伸び率が15%、全光線透過率が88%、水とジヨードメタンの接触角から求めた表面自由エネルギーの総量値が、43.2mJ/m2であり、そのうちの極性成分が2.7mJ/m2のポリイミドフィルム(商品名エクリオス(登録商標) VICT-C、三井化学株式会社製)(ガウス曲率0cm-2)をアルカリガラスの平面支持体に固定し、直径1cmの円形のスクリーン版で導電性高分子材料であるPEDOT/PSS(Heraeus社製)の水/アルコール溶液をスクリーン印刷で平滑塗工し、150℃、30分間焼成することで水/アルコールを蒸発させ、1cm直径の円形(面積が0.79cm2)での第一電極を形成した。電極の厚みは2.0μmであり、体積抵抗率は4.0Ω・cmであった。
実施例1で用いたポリイミドフィルム(ガウス曲率0cm-2)に実施例1の導電性高分子材料溶液を実施例1と同様にスクリーン印刷で平滑塗工し、焼成し1cm直径の円形(面積が0.79cm2)で2.0μmの厚みの第一電極を形成した。
実施例1で用いたポリイミドフィルム(ガウス曲率0cm-2)と導電性高分子材料の溶液を実施例1と同様にスクリーン印刷で平滑塗工し、150℃、30分間焼成することで水/アルコールを蒸発させ、1cm直径の円形で2.0μmの厚みの第一電極を形成した。
ガラス転移温度が305℃、引っ張り強度が220MPa、伸び率が7%、全光線透過率が88%、実施例1と同様に求めた表面自由エネルギーの総量値が、43.8mJ/m2であり、そのうちの極性成分が4.7mJ/m2のポリイミドフィルム(商品名エクリオス(登録商標) VICT-Cz、三井化学株式会社製)(ガウス曲率0cm-2)に実施例1で用いた導電性高分子材料の溶液を実施例1と同様にスクリーン印刷により塗工し、150℃、30分間焼成することで水/アルコールを蒸発させ、1cm直径の円形(面積が0.79cm2)で1.8μmの厚みの第一電極を形成した。
ガラス転移温度が265℃、引っ張り強度が130MPa、伸び率が18%、全光線透過率が90%、実施例1と同様に求めた表面自由エネルギーの総量値が、44.0mJ/m2であり、そのうちの極性成分が5.2mJ/m2のポリイミドフィルム(商品名エクリオス(登録商標) VICT-Bnp、三井化学株式会社製)(ガウス曲率0cm-2
)に実施例1で用いた導電性高分子材料の溶液を実施例1と同様にスクリーン印刷により塗工し、焼成し1cm直径の円形(面積が0.79cm2)で2.5μmの厚みの第一電極を形成した。
実施例1で用いたポリイミドフィルム(ガウス曲率0cm-2)と導電性高分子材料の溶液を一片が4cmの正方形のスクリーン版に代えたこと以外は実施例1と同様にスクリーン印刷し、焼成し一片が3.8cmの正方形(面積が14cm2)で平均2.1μmの厚みの第一電極を形成した。
実施例2から6で作製したスイッチングデバイスのLED端子部分に並列にマブチモーター製のFA-130RA(定格電圧1.5V)の振動子を接続した。触覚センサを指でタッチすると赤色LEDが点灯すると同時に該振動子が駆動し、再度指でタッチするとLEDが消灯すると同時に該振動子が停止することを確認した。これにより、これらのスイッチングデバイスが、他のデバイスの駆動機能を有するスイッチングデバイスであることを確認した。
ガラス転移温度が118℃、引っ張り強度が110MPa、伸び率が65%、全光線透過率が87%、実施例1と同様に求めた表面自由エネルギーの総量値が、40.5mJ/m2であり、そのうちの極性成分が表面自由エネルギーの極性成分が0.92mJ/m2であるPEN(商品名テオネックス(登録商標)、帝人フィルムソリューション株式会社製)フィルム(ガウス曲率0cm-2)に実施例1で使用した導電性高分子材料であるPEDOT/PSS(Heraeus社製)の水/アルコール溶液を実施例1と同様にスクリーン印刷で平滑塗工し、焼成し1cm直径の円形(面積が0.79cm2)で2.0μmの厚みの第一電極を形成した。
ガラス転移温度が410℃、引っ張り強度が330MPa、伸び率が80%、実施例1と同様に求めた表面自由エネルギーの総量値が、57.1mJ/m2であり、そのうちの極性成分が36mJ/m2の茶褐色(全光線透過率50%以下)のポリイミドフィルム(商品名カプトン(登録商標)、東レデュポン株式会社製)(ガウス曲率0cm-2)に実施例1で使用した導電性高分子材料であるPEDOT/PSS(Heraeus社製)の水/アルコール溶液を実施例1と同様にスクリーン印刷で平滑塗工し、焼成し1cm直径の円形(面積が0.79cm2)で2.1μmの厚みの第一電極を形成した。
ガラス転移温度が355℃、引っ張り強度が360MPa、伸び率が50%、実施例1と同様に求めた表面自由エネルギーの総量値が、44.6mJ/m2であり、そのうちの極性成分が15.6mJ/m2の茶褐色(全光線透過率50%以下)のポリイミドフィルム(商品名ユーピレックス(登録商標)、宇部興産株式会社製)(ガウス曲率0cm-2)のフィルムに実施例1で使用した導電性高分子材料の水/アルコール溶液を実施例1と同様にスクリーン印刷で平滑塗工し、焼成し1cm直径の円形(面積が0.79cm2)で1.8μmの厚みの第一電極を形成した。
ガラス転移温度が75℃、引っ張り強度が215MPa、伸び率が170%、全光線透過率85%、実施例1と同様に求めた表面自由エネルギーの総量値が、44.0mJ/m2であり、そのうちの極性成分が2.0mJ/m2のPET(商品名ルミラー(登録商標)、東レ株式会社製)(ガウス曲率0cm-2)に実施例1と同様の導電性高分子材料の水/アルコール溶液をスクリーン印刷により塗工し、150℃、30分間焼成し、1cm直径の円形(面積が0.79cm2)で2μmの厚みの第一電極の形成を試みたが、収縮を起こし、シワが発生し、平滑な電極を作成できなかった。
比較例4で用いたPETフィルムと導電性高分子材料の溶液を比較例4と同様にスクリーン印刷により塗工し、焼成温度を100℃、5時間で焼成し、1cm直径の円形(面積が0.79cm2)で2μmの厚みの第一電極を形成した。
実施例1で作製した触覚センサを図8に示す電子回路のオペアンプ、Delay-フリップフロップから作ったToggle-フリップフロップに赤色LEDを接続し、該触覚センサに指でタッチすると電圧のオン状態であるが、離すとオフ状態に切り替わり、オンの状態が続かない(図9に示す)、その結果、LEDの点灯し続けることはなく消灯してしまう。
曲率半径10cm(ガウス曲率0.01cm-2)のホウケイ酸ガラスでできた凸の球面を立体支持体上に、実施例4のポリイミド薄膜(商品名エクリオス(登録商標) VICT-Cz、三井化学株式会社製)をつくるポリアミド酸ワニス液膜をソフトブランケットグラビアオフセット印刷で塗工し、不活性ガス下で320℃2時間の加熱による脱水・環化反応によってポリイミド薄膜を形成した。
実施例8で得られた積層体を触覚センサとして第一電極をグランド電極とした上で、指を第二電極にタッチさせたところ、電圧信号の発生がオシロスコープにて確認された。この電圧信号には50Hzの商用電源由来のノイズが重畳したが、第二電極を図4の回路図に示すSallen-Key低域通過フィルタに通したところ、該ノイズは減衰し、図5に示すように、指でタッチすると電圧信号が選択的に取り出されることが確認された。
実施例8と同様に、曲率半径10cm(ガウス曲率0.01cm-2)のホウケイ酸ガラスでできた凸の球面をもつ立体支持体上にポリイミド薄膜を形成し、さらに、実施例8と同様にポリイミド薄膜上に、幅0.5cm、長さ6cm(面積が3.0cm2)の銀を主成分とするストレッチャブル性のペーストXA-9521(藤倉化成株式会社製)の第一電極をグラビアオフセット印刷法で印刷した。この積層体を150℃1時間焼成して、電極の厚みが6.0μm、体積抵抗率が5.0×10-5Ω・cmの第一電極を作製した。
実施例10で得られた積層体を触覚センサとして第一電極をグランド電極とした上で、指を第二電極にタッチさせたところ、電圧信号の発生がオシロスコープにて確認された。この電圧信号には50Hzの商用電源由来のノイズが重畳したが、第二電極を図4の回路図に示すSallen-Key低域通過フィルタに通したところ、該ノイズは減衰し、指でタッチすると電圧信号が選択的に取り出されることが確認された。
5cm(ガウス曲率0.04cm-2)のホウケイ酸ガラスでできた凸の球面を立体支持体上に、実施例4のポリイミド薄膜(商品名エクリオス(登録商標)、VICT-Cz、三井化学株式会社製)をつくるポリアミド酸ワニス液膜をソフトブランケットグラビアオフセット印刷で塗工し、不活性ガス下で320℃2時間の加熱による脱水・環化反応によってポリイミド薄膜を形成した。
実施例12で得られた積層体を触覚センサとして第一電極をグランド電極とした上で、指を第二電極にタッチさせたところ、電圧信号の発生がオシロスコープにて確認された。この電圧信号には50Hzの商用電源由来のノイズが重畳したが、第二電極を図4の回路図に示すSallen-Key低域通過フィルタに通したところ、該ノイズは減衰し、指でタッチに由来する電圧信号が選択的に取り出されることが確認された。
実施例8と同様に、曲率半径10cm(ガウス曲率0.01cm-2)のホウケイ酸ガラスでできた凸の球面をもつ立体支持体上にポリイミド薄膜を形成し、さらに、このポリイミド薄膜上に、幅0.5cm、長さ6cm(面積が3.0cm2)の銀粒子インクNPS-L(ハリマ化成グループ株式会社製)の第一電極を立体物に印刷可能なインクジェット装置で印刷した。この積層体を150℃1時間焼成して、第一電極が形成された積層体を作製した。電極の厚みは0.50μmであり、体積抵抗率は1.0×10-5Ω・cmであった。
実施例14で得られた積層体を触覚センサとして第一電極をグランド電極とした上で、指を第二電極にタッチさせたところ、電圧信号の発生がオシロスコープにて確認された。この電圧信号には50Hzの商用電源由来のノイズが重畳したが、第二電極を図4の回路図に示すSallen-Key低域通過フィルタに通したところ、該ノイズは減衰し、指でタッチすると電圧信号が選択的に取り出されることが確認された。
実施例8と同様に、曲率半径10cm(ガウス曲率0.01cm-2)のホウケイ酸ガラスでできた凸の球面をもつ立体支持体上にポリイミド薄膜を形成し、次に該ポリイミド薄膜上に、幅0.5cm、長さ6cm(面積が3.0cm2)のPEDOT/PSSのエタノール中分散液の第一電極を立体物に印刷可能なディスペンサー装置で印刷し、この積層体を150℃1時間焼成して、電極の厚みが10μm、体積抵抗率が4.0Ω・cmの第一電極が形成された積層体を作製した。
実施例9で得られた積層体を触覚センサとして第一電極をグランド電極とした上で、指を第二電極にタッチさせたところ、電圧信号の発生がオシロスコープにて確認された。この電圧信号には50Hzの商用電源由来のノイズが重畳したが、第二電極を図4の回路図に示すSallen-Key低域通過フィルタに通したところ、該ノイズは減衰し、指でタッチすると電圧信号が選択的に取り出されることが確認された。
実施例8と同様に、曲率半径10cm(ガウス曲率0.01cm-2)のホウケイ酸ガラスでできた凸の球面をもつ立体支持体上にポリイミド薄膜を形成し、さらに、実施例8と同様にポリイミド薄膜上に、幅0.5cm、長さ6cm(面積が3.0cm2)の銀を主成分とするストレッチャブル性のペーストXA-9521(藤倉化成株式会社製)の第一電極をグラビアオフセット印刷法で印刷した。この積層体を150℃1時間焼成して、電極の厚みが5.4μm、体積抵抗率が4.5×10-4Ω・cmの第一電極を作製した。
以上によって得られた積層体を触覚センサとして第一電極をグランド電極とした上で、指を第二電極にタッチさせたところ、電圧信号の発生がオシロスコープにて確認された。この電圧信号には50Hzの商用電源由来のノイズが重畳したが、第二電極を図4の回路図に示すSallen-Key低域通過フィルタに通したところ、該ノイズは減衰し、指でタッチすると電圧信号が選択的に取り出されることが確認された。
実施例8と同様に、曲率半径10cm(ガウス曲率0.01cm-2)のホウケイ酸ガラスでできた凸の球面をもつ立体支持体上にポリイミド薄膜を形成し、さらに、実施例8と同様にポリイミド薄膜上に、幅0.5cm、長さ6cm(面積が3.0cm2)の銀を主成分とするストレッチャブル性のペーストXA-9521(藤倉化成株式会社製)の第一電極を実施例8と同様にグラビアオフセット印刷法で印刷した。この積層体を150℃1時間焼成して、電極の厚みが5.4μmであり、体積抵抗率が4.5×10-4Ω・cmの第一電極を作製した。
実施例13で得られた積層体を触覚センサとして第一電極をグランド電極とした上で、指を第二電極にタッチさせたところ、電圧信号の発生がオシロスコープにて確認された。この電圧信号には50Hzの商用電源由来のノイズが重畳したが、第二電極を図4の回路図に示すSallen-Key低域通過フィルタに通したところ、該ノイズは減衰し、指でタッチすると電圧信号が選択的に取り出されることが確認された。
曲率半径10cm(ガウス曲率0.01cm-2)のホウケイ酸ガラスでできた凸の球面を立体支持体とし、これにポリアミド酸ワニス、ユピア(登録商標)-AT(商品名ユピア(登録商標)、宇部興産株式会社製)をソフトブランケットグラビアオフセット印刷によって形成し、不活性ガス下で340℃2時間の加熱による脱水・環化反応によってポリイミド薄膜を形成した。この全光線透過率は、40%であった。透明性がない。
曲率半径4.5cm(ガウス曲率0.050cm-1)のホウケイ酸ガラスでできた凸の球面を立体支持体とし、実施例4のポリイミド薄膜をつくるポリアミド酸ワニス(商品名エクリオス(登録商標) VICT-Cz、三井化学製)をソフトブランケットグラビアオフセット印刷によって形成し、320℃2時間の加熱による脱水・環化反応によってポリイミド薄膜を形成し、さらに実施例8と同様に銀を主成分とするストレッチャブル性の導電ペーストXA-9521(藤倉化成株式会社製)による第一電極を形成後、Piezotech FC25(Arkema社製)の12重量%のN-メチル-2-ピロリドン溶液を滴下塗布したが、強誘電体層の形成ができなかった。
Claims (14)
- 前記ポリイミド薄膜を、ガウス曲率0cm-2の支持体の表面に形成することを特徴とする請求項1に記載の触覚センサ。
- 前記ポリイミド薄膜を、絶対値0.04cm-2以下のガウス曲率を有する支持体の表面に形成することを特徴とする請求項1に記載の触覚センサ。
- 前記触覚センサの製品良品率が、99.9%以上であることを特徴とする請求項1~3のいずれか1項に記載の触覚センサ。
- 前記第一電極及び第二電極は、主成分が銀またはポリチオフェン系導電性高分子であることを特徴とする請求項1~5のいずれか1項に記載の触覚センサ。
- 前記第一電極及び第二電極の面積は、それぞれ1.0×10-2~15cm2である請求項1~6のいずれか1項に記載の触覚センサ。
- 前記強誘電体層は、フッ化ビニリデン/トリフルオロエチレン共重合体(P(VDF-TrFE))を含み、前記P(VDF-TrFE)のフッ化ビニリデン(VDF)とトリフルオロエチレン(TrFE)のモル比は80/20~70/30の範囲であることを特徴とする請求項1~7のいずれか1項に記載の触覚センサ。
- 前記第一電極または第二電極のいずれか一方をグランド電極とし、前記グランド電極と対向する他方の電極を、ノイズを制御する電子回路に接続する請求項1~8のいずれか1項に記載の触覚センサ。
- 前記ノイズを制御する電子回路が、アクティブ型の低域通過フィルタであることを特徴とする請求項9に記載の触覚センサ。
- 前記ノイズを制御する電子回路が、比較器であることを特徴とする請求項9または10に記載の触覚センサ。
- 請求項1~11のいずれか1項に記載の触覚センサにノイズを制御する電子回路をつなぎ、他のデバイスの駆動を促すスイッチングデバイス。
- 請求項1~11のいずれか1項に記載の触覚センサと、
前記電子回路に接続されたToggle-フリップフロップと、を有し、
前記強誘電体層に圧力による変形が加わることによりオン状態、オフ状態が切り替わることを特徴とする請求項12に記載のスイッチングデバイス。 - 電圧のオン状態とオフ状態とを感覚的に認知させる認知部を有することを特徴とする請求項12または13に記載のスイッチングデバイス。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019113906 | 2019-06-19 | ||
JP2019113906 | 2019-06-19 | ||
PCT/JP2020/023394 WO2020255920A1 (ja) | 2019-06-19 | 2020-06-15 | 高い全光線透過率を持つポリイミド薄膜上に形成された触覚センサとそれを用いたスイッチングデバイス |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2020255920A1 JPWO2020255920A1 (ja) | 2020-12-24 |
JP7064054B2 true JP7064054B2 (ja) | 2022-05-09 |
Family
ID=74040206
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021528215A Active JP7064054B2 (ja) | 2019-06-19 | 2020-06-15 | 高い全光線透過率を持つポリイミド薄膜上に形成された触覚センサとそれを用いたスイッチングデバイス |
Country Status (7)
Country | Link |
---|---|
US (1) | US12003235B2 (ja) |
EP (1) | EP3988914A4 (ja) |
JP (1) | JP7064054B2 (ja) |
KR (1) | KR102551416B1 (ja) |
CN (1) | CN114008424A (ja) |
TW (1) | TWI829937B (ja) |
WO (1) | WO2020255920A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3988914A4 (en) * | 2019-06-19 | 2023-07-19 | Mitsui Chemicals, Inc. | TACTILE SENSOR WITH HIGH TOTAL LIGHT TRANSMISSION MOLDED ON A POLYIMIDE FILM AND SWITCHING DEVICE THEREFOR |
CN113858238B (zh) * | 2021-09-13 | 2023-07-21 | 苏州大学 | 机器人仿生手及抓取方法和系统 |
TWI840013B (zh) * | 2022-03-10 | 2024-04-21 | 日商阿爾卑斯阿爾派股份有限公司 | 輸入裝置 |
WO2023223879A1 (ja) * | 2022-05-19 | 2023-11-23 | 株式会社村田製作所 | 変形量検知装置 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013021176A (ja) | 2011-07-12 | 2013-01-31 | Fujifilm Corp | 圧電素子 |
JP2014034590A (ja) | 2012-08-07 | 2014-02-24 | Mitsui Chemicals Inc | ポリイミドフィルム及びその製造方法 |
US20140060210A1 (en) | 2012-09-05 | 2014-03-06 | Sungkyunkwan University Foundation For Corporate Collaboration | Pressure sensor and pressure sensing method |
JP2015190863A (ja) | 2014-03-28 | 2015-11-02 | 日本写真印刷株式会社 | 圧力検出装置 |
WO2016010003A1 (ja) | 2014-07-17 | 2016-01-21 | 旭化成イーマテリアルズ株式会社 | 樹脂前駆体及びそれを含有する樹脂組成物、ポリイミド樹脂膜、樹脂フィルム及びその製造方法 |
WO2017183678A1 (ja) | 2016-04-22 | 2017-10-26 | 株式会社村田製作所 | モニタリングシステム |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5674862A (en) | 1979-11-20 | 1981-06-20 | Nec Corp | Floating head slider using negative pressure |
NL7908964A (nl) | 1979-12-13 | 1981-07-16 | Akzo Nv | Werkwijze ter bereiding van masterbatches van peroxyden in polymeren. |
JPS608970B2 (ja) | 1980-09-19 | 1985-03-07 | 日本化学工業株式会社 | 顆粒状水和けい酸の製法 |
JPS59196414A (ja) | 1983-04-22 | 1984-11-07 | Hitachi Ltd | 電子式オドメ−タ |
JPS608970U (ja) | 1983-06-29 | 1985-01-22 | 富士ゼロックス株式会社 | 電子複写機の現像剤回収装置 |
JPS6259390U (ja) | 1985-10-03 | 1987-04-13 | ||
JP4965274B2 (ja) | 2007-02-05 | 2012-07-04 | 三菱電機株式会社 | 圧力センサ |
JP2011181866A (ja) | 2010-03-04 | 2011-09-15 | Fujifilm Corp | 積層構造体及びそれを用いた圧電デバイス |
JP5721126B2 (ja) * | 2010-03-05 | 2015-05-20 | 国立研究開発法人産業技術総合研究所 | 圧電センサ |
JP5224011B2 (ja) * | 2011-04-15 | 2013-07-03 | 東洋紡株式会社 | 積層体とその製造方法及びそれを用いたデバイス構造体の製造方法 |
FR2979991B1 (fr) | 2011-09-14 | 2014-04-25 | Commissariat Energie Atomique | Capteur de pression piezoelectrique |
JP2013178241A (ja) | 2012-02-07 | 2013-09-09 | Sumitomo Electric Ind Ltd | 圧力感知センサ搭載配線板 |
CN105073851B (zh) * | 2013-04-03 | 2018-08-28 | 三井化学株式会社 | 聚酰胺酸、包含该聚酰胺酸的清漆、以及聚酰亚胺膜 |
JP6495165B2 (ja) | 2013-05-13 | 2019-04-03 | ヘルスセンシング株式会社 | 人の健康状態検出装置 |
JP2015069267A (ja) | 2013-09-27 | 2015-04-13 | デクセリアルズ株式会社 | 静電容量型曲面形状タッチパネル及びその製造方法 |
CN203965077U (zh) * | 2013-10-22 | 2014-11-26 | 中国石油大学(华东) | 一种柔性薄膜触觉传感器 |
JP6259390B2 (ja) | 2014-12-11 | 2018-01-10 | 富士フイルム株式会社 | 有機トランジスタの製造方法、有機トランジスタ |
JP6517058B2 (ja) | 2015-03-26 | 2019-05-22 | 国立大学法人山形大学 | 印刷装置 |
JP6447492B2 (ja) | 2015-12-25 | 2019-01-09 | オムロン株式会社 | 押しボタンスイッチ、押しボタンスイッチユニット |
US10442091B2 (en) | 2016-01-29 | 2019-10-15 | Ricoh Company, Ltd. | Pressure-sensitive sensor, gripping device, and robot |
JP6879826B2 (ja) * | 2016-05-30 | 2021-06-02 | 日東電工株式会社 | タッチセンサ |
TW201800729A (zh) * | 2016-05-30 | 2018-01-01 | 日東電工股份有限公司 | 壓電感測器及使用其之顯示器 |
US20200362113A1 (en) * | 2017-03-22 | 2020-11-19 | Toray Industries, Inc. | Resin composition |
JPWO2019039209A1 (ja) | 2017-08-24 | 2020-08-06 | 東洋紡株式会社 | 導電性ペースト、立体印刷回路、タッチセンサーおよびそれらの製法 |
JP2019113906A (ja) | 2017-12-21 | 2019-07-11 | 富士通フロンテック株式会社 | 会計済商品判定方法、会計済商品判定システム、その精算装置、判定装置 |
JP2018136954A (ja) | 2018-03-14 | 2018-08-30 | ヨアノイム リサーチ フォルシュングスゲゼルシャフト エムベーハーJoanneum Research Forschungsgesellschaft Mbh | 印刷された圧電性圧力検知箔 |
EP3988914A4 (en) * | 2019-06-19 | 2023-07-19 | Mitsui Chemicals, Inc. | TACTILE SENSOR WITH HIGH TOTAL LIGHT TRANSMISSION MOLDED ON A POLYIMIDE FILM AND SWITCHING DEVICE THEREFOR |
-
2020
- 2020-06-15 EP EP20827660.0A patent/EP3988914A4/en active Pending
- 2020-06-15 JP JP2021528215A patent/JP7064054B2/ja active Active
- 2020-06-15 US US17/613,647 patent/US12003235B2/en active Active
- 2020-06-15 CN CN202080044446.8A patent/CN114008424A/zh active Pending
- 2020-06-15 KR KR1020217037945A patent/KR102551416B1/ko active IP Right Grant
- 2020-06-15 WO PCT/JP2020/023394 patent/WO2020255920A1/ja unknown
- 2020-06-18 TW TW109120628A patent/TWI829937B/zh active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013021176A (ja) | 2011-07-12 | 2013-01-31 | Fujifilm Corp | 圧電素子 |
JP2014034590A (ja) | 2012-08-07 | 2014-02-24 | Mitsui Chemicals Inc | ポリイミドフィルム及びその製造方法 |
US20140060210A1 (en) | 2012-09-05 | 2014-03-06 | Sungkyunkwan University Foundation For Corporate Collaboration | Pressure sensor and pressure sensing method |
JP2015190863A (ja) | 2014-03-28 | 2015-11-02 | 日本写真印刷株式会社 | 圧力検出装置 |
WO2016010003A1 (ja) | 2014-07-17 | 2016-01-21 | 旭化成イーマテリアルズ株式会社 | 樹脂前駆体及びそれを含有する樹脂組成物、ポリイミド樹脂膜、樹脂フィルム及びその製造方法 |
WO2017183678A1 (ja) | 2016-04-22 | 2017-10-26 | 株式会社村田製作所 | モニタリングシステム |
Also Published As
Publication number | Publication date |
---|---|
KR20210154233A (ko) | 2021-12-20 |
EP3988914A4 (en) | 2023-07-19 |
KR102551416B1 (ko) | 2023-07-04 |
US12003235B2 (en) | 2024-06-04 |
CN114008424A (zh) | 2022-02-01 |
TW202107491A (zh) | 2021-02-16 |
JPWO2020255920A1 (ja) | 2020-12-24 |
TWI829937B (zh) | 2024-01-21 |
EP3988914A1 (en) | 2022-04-27 |
WO2020255920A1 (ja) | 2020-12-24 |
US20220239296A1 (en) | 2022-07-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP7064054B2 (ja) | 高い全光線透過率を持つポリイミド薄膜上に形成された触覚センサとそれを用いたスイッチングデバイス | |
US20210263615A1 (en) | Film touch sensor and manufacturing method therefor | |
Shen et al. | High‐stretchability, ultralow‐hysteresis conductingpolymer hydrogel strain sensors for soft machines | |
Vuorinen et al. | Printable, transparent, and flexible touch panels working in sunlight and moist environments | |
KR101273221B1 (ko) | 터치 패널 및 투명 압전 시트 및 디스플레이 장치 | |
Yoon et al. | Highly stretchable metal-polymer hybrid conductors for wearable and self-cleaning sensors | |
Cao et al. | Imperceptible and ultraflexible p-type transistors and macroelectronics based on carbon nanotubes | |
US20180210570A1 (en) | Touch sensor and preparation method thereof | |
KR102111534B1 (ko) | 유연 전기 소자 및 이를 포함하는 압력 및 온도 측정 센서 | |
WO2020090634A1 (ja) | ベンダブル配線基板、伸縮できる配線基板およびそれらによる電子デバイス | |
CN110716667A (zh) | 具有定位和压力检测功能的柔性传感器及其制作方法 | |
CN107946369B (zh) | 薄膜晶体管、制备方法、检测器件、阵列基板及显示装置 | |
CN105103098B (zh) | 触控面板、其制备方法以及用于触控面板的银‑钯‑钕合金 | |
Han et al. | Smart MXene‐based bioelectronic devices as wearable health monitor for sensing human physiological signals | |
Sim et al. | Super-stretchable polymer-AgPdCu superlattice electrodes for high-performance wearable electronics | |
Tran et al. | Copper nanowire-sealed titanium dioxide/poly (dimethylsiloxane) electrode with an in-plane wavy structure for a stretchable capacitive strain sensor | |
KR20180060802A (ko) | 접촉 감응 소자 및 그를 포함하는 표시 장치 | |
JP2017169791A (ja) | 電位測定デバイス | |
CN109817722A (zh) | 基于碳纳米管薄膜晶体管的驱动器件及其制备方法 | |
CN110413142A (zh) | 触控面板传感器结构及其制作方法 | |
KR102381748B1 (ko) | 다층 가변 소자 및 이를 포함하는 표시 장치 | |
JP2017169790A (ja) | 粘着性電極及び体表面電位測定デバイス | |
KR20180072953A (ko) | 정전용량형 압력센서 및 그의 제조방법 | |
Alique et al. | Multiplex Sensing Electronic Skin Based on Seamless Fully Printed Stretchable Piezoelectric Devices | |
TWM462404U (zh) | 觸控裝置結構 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20210820 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20220329 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20220405 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20220419 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20220421 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7064054 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |