JP7060052B2 - 水晶振動デバイス - Google Patents
水晶振動デバイス Download PDFInfo
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- JP7060052B2 JP7060052B2 JP2020180508A JP2020180508A JP7060052B2 JP 7060052 B2 JP7060052 B2 JP 7060052B2 JP 2020180508 A JP2020180508 A JP 2020180508A JP 2020180508 A JP2020180508 A JP 2020180508A JP 7060052 B2 JP7060052 B2 JP 7060052B2
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- 239000013078 crystal Substances 0.000 title claims description 290
- 238000007789 sealing Methods 0.000 claims description 133
- 230000005284 excitation Effects 0.000 claims description 44
- 239000010453 quartz Substances 0.000 claims description 28
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 28
- 230000010355 oscillation Effects 0.000 claims description 12
- 239000011810 insulating material Substances 0.000 claims description 4
- 239000012298 atmosphere Substances 0.000 claims description 3
- 239000011261 inert gas Substances 0.000 claims description 3
- 238000005240 physical vapour deposition Methods 0.000 description 57
- 238000005304 joining Methods 0.000 description 50
- 239000010408 film Substances 0.000 description 43
- 239000000463 material Substances 0.000 description 39
- 239000010410 layer Substances 0.000 description 20
- 238000000605 extraction Methods 0.000 description 16
- 239000000853 adhesive Substances 0.000 description 15
- 230000001070 adhesive effect Effects 0.000 description 15
- 230000002093 peripheral effect Effects 0.000 description 14
- 238000010030 laminating Methods 0.000 description 10
- 230000004048 modification Effects 0.000 description 10
- 238000012986 modification Methods 0.000 description 10
- 239000000919 ceramic Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 238000009792 diffusion process Methods 0.000 description 6
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- 238000005452 bending Methods 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 238000000427 thin-film deposition Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000001451 molecular beam epitaxy Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
- H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0595—Holders; Supports the holder support and resonator being formed in one body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
- H01L23/08—Containers; Seals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02086—Means for compensation or elimination of undesirable effects
- H03H9/02102—Means for compensation or elimination of undesirable effects of temperature influence
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0504—Holders; Supports for bulk acoustic wave devices
- H03H9/0509—Holders; Supports for bulk acoustic wave devices consisting of adhesive elements
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
- H03H9/0557—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement the other elements being buried in the substrate
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1035—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by two sealing substrates sandwiching the piezoelectric layer of the BAW device
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
- H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
- H03B5/30—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator
- H03B5/32—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
- H03B5/36—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator active element in amplifier being semiconductor device
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- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Oscillators With Electromechanical Resonators (AREA)
Description
101 水晶振動子
12 振動子パッケージ
13 内部空間
2 水晶振動板
22 振動部
221 第1励振電極
222 第2励振電極
23 外枠部
24 連結部
3 第1封止部材
4 第2封止部材
102 ICチップ(回路素子)
103 パッケージ
104 パッケージ本体
105 蓋
Claims (5)
- 水晶振動子が、絶縁性材料により形成されたパッケージ内に気密封止された水晶振動デバイスであって、
前記水晶振動子は、
一主面に第1励振電極が形成され、他主面に前記第1励振電極と対になる第2励振電極が形成された水晶振動板と、
前記水晶振動板の前記第1励振電極を覆う第1封止部材と、
前記水晶振動板の前記第2励振電極を覆う第2封止部材とを備え、
前記第1封止部材と前記水晶振動板とが接合され、前記第2封止部材と前記水晶振動板とが接合されて、前記第1励振電極と前記第2励振電極とを含む前記水晶振動板の振動部が気密封止される構成になっており、
前記水晶振動子の内部は、前記パッケージの内部よりも真空度が高い状態とされていることを特徴とする水晶振動デバイス。 - 請求項1に記載の水晶振動デバイスにおいて、
前記パッケージの内部は、大気圧よりも減圧された真空状態、あるいは、不活性ガスが封入されている不活性雰囲気とされており、
前記水晶振動子の内部は、前記パッケージの内部よりも真空度が高い状態とされていることを特徴とする水晶振動デバイス。 - 請求項1または2に記載の水晶振動デバイスにおいて、
前記水晶振動子には、センサ素子、または発振回路を構成する回路素子が一体的に設けられていることを特徴とする水晶振動デバイス。 - 請求項1~3のいずれか1つに記載の水晶振動デバイスにおいて、
前記水晶振動子と、センサ素子または発振回路を構成する回路素子とが、前記パッケージに設けられた同一の空間に収容され、気密封止されていることを特徴とする水晶振動デバイス。 - 請求項1または2に記載の水晶振動デバイスにおいて、
前記パッケージの一主面側に形成された第1凹部に前記水晶振動子が収容され、気密封止されるとともに、
前記パッケージの他主面側に形成された第2凹部に、センサ素子または発振回路を構成する回路素子が収容されていることを特徴とする水晶振動デバイス。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016223303 | 2016-11-16 | ||
JP2016223303 | 2016-11-16 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2018551558A Division JPWO2018092572A1 (ja) | 2016-11-16 | 2017-10-30 | 水晶振動デバイス |
Publications (2)
Publication Number | Publication Date |
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JP2021036689A JP2021036689A (ja) | 2021-03-04 |
JP7060052B2 true JP7060052B2 (ja) | 2022-04-26 |
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Application Number | Title | Priority Date | Filing Date |
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JP2018551558A Pending JPWO2018092572A1 (ja) | 2016-11-16 | 2017-10-30 | 水晶振動デバイス |
JP2020180510A Active JP7060053B2 (ja) | 2016-11-16 | 2020-10-28 | 水晶振動デバイス |
JP2020180508A Active JP7060052B2 (ja) | 2016-11-16 | 2020-10-28 | 水晶振動デバイス |
JP2020213465A Pending JP2021057914A (ja) | 2016-11-16 | 2020-12-23 | 水晶振動デバイス |
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JP2018551558A Pending JPWO2018092572A1 (ja) | 2016-11-16 | 2017-10-30 | 水晶振動デバイス |
JP2020180510A Active JP7060053B2 (ja) | 2016-11-16 | 2020-10-28 | 水晶振動デバイス |
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JP2020213465A Pending JP2021057914A (ja) | 2016-11-16 | 2020-12-23 | 水晶振動デバイス |
Country Status (5)
Country | Link |
---|---|
US (1) | US11342899B2 (ja) |
JP (4) | JPWO2018092572A1 (ja) |
CN (1) | CN109937533B (ja) |
TW (1) | TWI649963B (ja) |
WO (1) | WO2018092572A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6848953B2 (ja) * | 2018-11-26 | 2021-03-24 | 株式会社大真空 | 圧電振動デバイス |
JP7413682B2 (ja) * | 2019-08-29 | 2024-01-16 | セイコーエプソン株式会社 | 振動デバイス、電子機器および移動体 |
JP7523271B2 (ja) | 2020-07-29 | 2024-07-26 | 京セラ株式会社 | 圧電デバイス |
US20240072727A1 (en) * | 2021-02-25 | 2024-02-29 | Daishinku Corporation | Oven-controlled crystal oscillator |
US11509311B1 (en) | 2021-08-10 | 2022-11-22 | Txc Corporation | Temperature-controlled oscillating device |
WO2023074616A1 (ja) * | 2021-11-01 | 2023-05-04 | 株式会社大真空 | サーミスタ搭載型圧電振動デバイス |
TW202332197A (zh) * | 2022-01-12 | 2023-08-01 | 日商大真空股份有限公司 | 壓電振動元件 |
Citations (3)
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JP2000134058A (ja) | 1998-10-21 | 2000-05-12 | Toyo Commun Equip Co Ltd | 圧電発振器 |
JP2015122608A (ja) | 2013-12-24 | 2015-07-02 | セイコーエプソン株式会社 | 電子部品、電子機器および移動体 |
WO2016136283A1 (ja) | 2015-02-26 | 2016-09-01 | 株式会社大真空 | 圧電振動デバイス |
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2017
- 2017-10-30 WO PCT/JP2017/039112 patent/WO2018092572A1/ja active Application Filing
- 2017-10-30 JP JP2018551558A patent/JPWO2018092572A1/ja active Pending
- 2017-10-30 US US16/348,492 patent/US11342899B2/en active Active
- 2017-10-30 CN CN201780070139.5A patent/CN109937533B/zh active Active
- 2017-11-14 TW TW106139255A patent/TWI649963B/zh active
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2020
- 2020-10-28 JP JP2020180510A patent/JP7060053B2/ja active Active
- 2020-10-28 JP JP2020180508A patent/JP7060052B2/ja active Active
- 2020-12-23 JP JP2020213465A patent/JP2021057914A/ja active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2000134058A (ja) | 1998-10-21 | 2000-05-12 | Toyo Commun Equip Co Ltd | 圧電発振器 |
JP2015122608A (ja) | 2013-12-24 | 2015-07-02 | セイコーエプソン株式会社 | 電子部品、電子機器および移動体 |
WO2016136283A1 (ja) | 2015-02-26 | 2016-09-01 | 株式会社大真空 | 圧電振動デバイス |
Also Published As
Publication number | Publication date |
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JP2021057914A (ja) | 2021-04-08 |
US11342899B2 (en) | 2022-05-24 |
JP7060053B2 (ja) | 2022-04-26 |
TW201832467A (zh) | 2018-09-01 |
CN109937533B (zh) | 2023-06-23 |
TWI649963B (zh) | 2019-02-01 |
WO2018092572A1 (ja) | 2018-05-24 |
JPWO2018092572A1 (ja) | 2019-10-17 |
CN109937533A (zh) | 2019-06-25 |
JP2021036689A (ja) | 2021-03-04 |
US20190312565A1 (en) | 2019-10-10 |
JP2021016184A (ja) | 2021-02-12 |
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