JP6848953B2 - 圧電振動デバイス - Google Patents
圧電振動デバイス Download PDFInfo
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- JP6848953B2 JP6848953B2 JP2018219893A JP2018219893A JP6848953B2 JP 6848953 B2 JP6848953 B2 JP 6848953B2 JP 2018219893 A JP2018219893 A JP 2018219893A JP 2018219893 A JP2018219893 A JP 2018219893A JP 6848953 B2 JP6848953 B2 JP 6848953B2
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- 239000013078 crystal Substances 0.000 description 96
- 238000005304 joining Methods 0.000 description 56
- 238000005260 corrosion Methods 0.000 description 17
- 230000007797 corrosion Effects 0.000 description 17
- 239000010453 quartz Substances 0.000 description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 11
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- 230000012447 hatching Effects 0.000 description 2
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02086—Means for compensation or elimination of undesirable effects
- H03H9/02133—Means for compensation or elimination of undesirable effects of stress
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
- H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
- H03B5/30—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator
- H03B5/32—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
- H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
- H03B5/30—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator
- H03B5/32—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
- H03B5/34—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator active element in amplifier being vacuum tube
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1035—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by two sealing substrates sandwiching the piezoelectric layer of the BAW device
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/13—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
- H03H9/131—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials consisting of a multilayered structure
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
- H03H9/172—Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
- H10N30/206—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using only longitudinal or thickness displacement, e.g. d33 or d31 type devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/88—Mounts; Supports; Enclosures; Casings
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- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Oscillators With Electromechanical Resonators (AREA)
Description
2 水晶振動板(圧電振動板)
22 振動部
23 外枠部
24 保持部
211 第1主面
212 第2主面
221 第1励振電極
222 第2励振電極
223 第1引出配線
224 第2引出配線
251 振動側第1接合パターン(封止用パターン層の一部)
252 振動側第2接合パターン(封止用パターン層の一部)
253 接続用接合パターン(導電用パターン層の一部)
254 接続用接合パターン(導電用パターン層の一部)
27 接続用接合パターン(導電用パターン層の一部)
28 接続用接合パターン(導電用パターン層の一部)
3 第1封止部材
311 第1主面
312 第2主面
321 封止側第1接合パターン(封止用パターン層の一部)
34 接続用接合パターン(導電用パターン層の一部)
351 接続用接合パターン(導電用パターン層の一部)
352 接続用接合パターン(導電用パターン層の一部)
353 接続用接合パターン(導電用パターン層の一部)
4 第2封止部材
411 第1主面
412 第2主面
421 封止側第2接合パターン(封止用パターン層の一部)
45 接続用接合パターン(導電用パターン層の一部)
5 ICチップ
12 パッケージ
Claims (2)
- 基板の一主面に第1励振電極が形成され、前記基板の他主面に前記第1励振電極と対になる第2励振電極が形成された圧電振動板と、
前記圧電振動板の前記第1励振電極を覆う第1封止部材と、
前記圧電振動板の前記第2励振電極を覆う第2封止部材と、が設けられ、
前記第1封止部材と前記圧電振動板とが接合され、前記第2封止部材と前記圧電振動板とが接合されて、前記第1励振電極と前記第2励振電極とを含む前記圧電振動板の振動部を気密封止した内部空間が形成されており、
前記第2封止部材における前記圧電振動板との接合面と反対側の主面に外部に電気的に接続するための外部電極端子が設けられ、前記第1封止部材における前記圧電振動板との接合面と反対側の主面にICチップが搭載された圧電振動デバイスにおいて、
前記第1封止部材と前記圧電振動板との間、および前記第2封止部材と前記圧電振動板との間が、少なくともTiからなる下地膜と当該下地膜の上層に形成されるAuからなる接合膜とを含む積層膜からなる接合パターン層によって接合されており、
前記接合パターン層は、平面視で前記振動部を囲うように環状に形成されることで前記内部空間を気密封止する封止用パターン層と、配線および電極の導通を図るための導電用パターン層とを含んでおり、
前記導電用パターン層の少なくとも一部は、前記封止用パターン層によって形成される前記内部空間の外であって、かつ、周囲を前記封止用パターン層によって囲まれた閉空間内に配置されており、
前記導電用パターン層のうち、当該圧電振動デバイスの動作時に変動する電位が与えられる全ての前記導電用パターン層は、周囲を前記封止用パターン層によって囲まれた閉空間内に配置されており、
全ての前記封止用パターン層は、当該圧電振動デバイスの動作時にGND電位が与えられることを特徴とする圧電振動デバイス。 - 請求項1に記載の圧電振動デバイスであって、
前記封止用パターン層は、当該圧電振動デバイスの動作時にGND電位が与えられる導電用パターン層を兼用していることを特徴とする圧電振動デバイス。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018219893A JP6848953B2 (ja) | 2018-11-26 | 2018-11-26 | 圧電振動デバイス |
PCT/JP2019/042285 WO2020110557A1 (ja) | 2018-11-26 | 2019-10-29 | 圧電振動デバイス |
US17/289,261 US11411550B2 (en) | 2018-11-26 | 2019-10-29 | Piezoelectric resonator device |
CN201980069848.0A CN113228505B (zh) | 2018-11-26 | 2019-10-29 | 压电振动器件 |
TW108140377A TWI707538B (zh) | 2018-11-26 | 2019-11-07 | 壓電振動器件 |
Applications Claiming Priority (1)
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---|---|---|---|
JP2018219893A JP6848953B2 (ja) | 2018-11-26 | 2018-11-26 | 圧電振動デバイス |
Publications (2)
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JP2020088589A JP2020088589A (ja) | 2020-06-04 |
JP6848953B2 true JP6848953B2 (ja) | 2021-03-24 |
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JP2018219893A Active JP6848953B2 (ja) | 2018-11-26 | 2018-11-26 | 圧電振動デバイス |
Country Status (5)
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US (1) | US11411550B2 (ja) |
JP (1) | JP6848953B2 (ja) |
CN (1) | CN113228505B (ja) |
TW (1) | TWI707538B (ja) |
WO (1) | WO2020110557A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2022131213A1 (ja) * | 2020-12-16 | 2022-06-23 | 株式会社大真空 | 圧電振動デバイス |
TWI785935B (zh) * | 2021-12-17 | 2022-12-01 | 台灣晶技股份有限公司 | 諧振器封裝結構 |
JPWO2023140070A1 (ja) * | 2022-01-21 | 2023-07-27 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
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JP3860364B2 (ja) * | 1999-08-11 | 2006-12-20 | 富士通メディアデバイス株式会社 | 弾性表面波装置 |
WO2006001125A1 (ja) * | 2004-06-25 | 2006-01-05 | Murata Manufacturing Co., Ltd. | 圧電デバイス |
JP2008066921A (ja) * | 2006-09-06 | 2008-03-21 | Epson Toyocom Corp | 圧電振動子 |
JP5262946B2 (ja) * | 2009-04-15 | 2013-08-14 | セイコーエプソン株式会社 | 電子デバイス |
JP2012034086A (ja) * | 2010-07-29 | 2012-02-16 | Nippon Dempa Kogyo Co Ltd | 圧電デバイスの製造方法及び圧電デバイス |
CN106416066B (zh) * | 2013-12-20 | 2019-04-19 | 株式会社大真空 | 压电振动器件 |
WO2015102080A1 (ja) * | 2014-01-06 | 2015-07-09 | 株式会社大真空 | 圧電振動デバイス、及び圧電振動デバイスと回路基板との接合構造 |
JP6330370B2 (ja) * | 2014-03-03 | 2018-05-30 | 株式会社大真空 | 圧電振動デバイスの製造方法 |
CN107210723B (zh) | 2015-01-29 | 2020-10-20 | 株式会社大真空 | 晶体振动片及晶体振动器件 |
JP6725208B2 (ja) * | 2015-03-25 | 2020-07-15 | 株式会社大真空 | 圧電振動デバイス |
JP6358293B2 (ja) * | 2016-07-27 | 2018-07-18 | 株式会社大真空 | 圧電振動デバイスの製造方法 |
US10778183B2 (en) | 2016-07-18 | 2020-09-15 | Skyworks Filter Solutions Japan Co., Ltd. | Saw-based electronic elements and filter devices |
JP6696378B2 (ja) * | 2016-09-16 | 2020-05-20 | 株式会社大真空 | 圧電振動デバイス |
CN109075761B (zh) | 2016-09-16 | 2022-06-24 | 株式会社大真空 | 压电振动器件 |
CN109937533B (zh) | 2016-11-16 | 2023-06-23 | 株式会社大真空 | 晶体振动器件 |
US11152910B2 (en) | 2016-11-17 | 2021-10-19 | Daishinku Corporation | Piezoelectric resonator device |
US11637544B2 (en) * | 2016-11-24 | 2023-04-25 | Daishinku Corporation | Piezoelectric resonator device and system-in-package module including the same |
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- 2018-11-26 JP JP2018219893A patent/JP6848953B2/ja active Active
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2019
- 2019-10-29 US US17/289,261 patent/US11411550B2/en active Active
- 2019-10-29 WO PCT/JP2019/042285 patent/WO2020110557A1/ja active Application Filing
- 2019-10-29 CN CN201980069848.0A patent/CN113228505B/zh active Active
- 2019-11-07 TW TW108140377A patent/TWI707538B/zh active
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Publication number | Publication date |
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US20210399715A1 (en) | 2021-12-23 |
US11411550B2 (en) | 2022-08-09 |
JP2020088589A (ja) | 2020-06-04 |
CN113228505A (zh) | 2021-08-06 |
WO2020110557A1 (ja) | 2020-06-04 |
TW202021270A (zh) | 2020-06-01 |
TWI707538B (zh) | 2020-10-11 |
CN113228505B (zh) | 2024-08-16 |
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