JP7040864B2 - ナノ構造化物品 - Google Patents

ナノ構造化物品 Download PDF

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Publication number
JP7040864B2
JP7040864B2 JP2019522680A JP2019522680A JP7040864B2 JP 7040864 B2 JP7040864 B2 JP 7040864B2 JP 2019522680 A JP2019522680 A JP 2019522680A JP 2019522680 A JP2019522680 A JP 2019522680A JP 7040864 B2 JP7040864 B2 JP 7040864B2
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JP
Japan
Prior art keywords
layer
nanostructured
pillars
psd
average
Prior art date
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Expired - Fee Related
Application number
JP2019522680A
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English (en)
Japanese (ja)
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JP2020500329A (ja
JP2020500329A5 (https=
Inventor
シー． エリクソン，ニコラス
エム． デイヴィッド，モーゼズ
サン，シャオガン
ニルマル，マノイ
シコーラ，ハエーン
ルオ，ヒュイ
ジェイ． カーペンター，サミュエル
エム． ネルソン，ジリアン
ピー． メイヤー，ジャスティン
ティー． チエン，バート
ジェイ． ローウェ，デイヴィッド
エル． ブロット，ロバート
ジー． フレイアー，デイヴィッド
エル． レチュガ，ヒアシンス
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
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3M Innovative Properties Co
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Publication of JP2020500329A publication Critical patent/JP2020500329A/ja
Publication of JP2020500329A5 publication Critical patent/JP2020500329A5/ja
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Publication of JP7040864B2 publication Critical patent/JP7040864B2/ja
Expired - Fee Related legal-status Critical Current
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
    • B81C1/00031—Regular or irregular arrays of nanoscale structures, e.g. etch mask layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/875—Arrangements for extracting light from the devices
    • H10K59/879—Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
    • B82B1/00—Nanostructures formed by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
    • B82B1/001—Devices without movable or flexible elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/85—Arrangements for extracting light from the devices
    • H10K50/858—Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0147—Film patterning
    • B81C2201/0149—Forming nanoscale microstructures using auto-arranging or self-assembling material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
    • H10K71/231—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers
    • H10K71/233—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers by photolithographic etching

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Manufacturing & Machinery (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Analytical Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biophysics (AREA)
  • Laminated Bodies (AREA)
  • Electroluminescent Light Sources (AREA)
  • Diffracting Gratings Or Hologram Optical Elements (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP2019522680A 2016-10-28 2017-10-17 ナノ構造化物品 Expired - Fee Related JP7040864B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201662414127P 2016-10-28 2016-10-28
US62/414,127 2016-10-28
PCT/US2017/056846 WO2018080830A1 (en) 2016-10-28 2017-10-17 Nanostructured article

Publications (3)

Publication Number Publication Date
JP2020500329A JP2020500329A (ja) 2020-01-09
JP2020500329A5 JP2020500329A5 (https=) 2020-11-26
JP7040864B2 true JP7040864B2 (ja) 2022-03-23

Family

ID=62025438

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019522680A Expired - Fee Related JP7040864B2 (ja) 2016-10-28 2017-10-17 ナノ構造化物品

Country Status (7)

Country Link
US (1) US10756306B2 (https=)
EP (1) EP3533090A1 (https=)
JP (1) JP7040864B2 (https=)
KR (1) KR102402862B1 (https=)
CN (1) CN110178242B (https=)
TW (1) TW201825385A (https=)
WO (1) WO2018080830A1 (https=)

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KR20210073604A (ko) 2018-11-09 2021-06-18 쓰리엠 이노베이티브 프로퍼티즈 컴파니 나노구조화된 광학 필름 및 중간체
US10993318B2 (en) * 2018-11-24 2021-04-27 Nova Engineering Films, Inc. Flexible polymeric film including reinforcement layer
WO2020208671A1 (ja) * 2019-04-08 2020-10-15 シャープ株式会社 表示デバイス
WO2020212777A1 (en) 2019-04-18 2020-10-22 3M Innovative Properties Company Organic light emitting diode display with color-correction component
CN113966357B (zh) 2019-05-08 2023-12-22 3M创新有限公司 纳米结构化制品
CN114391188A (zh) 2019-09-18 2022-04-22 3M创新有限公司 包括纳米结构化表面和封闭空隙的制品及其制备方法
CN114829986B (zh) 2019-12-02 2025-05-16 3M创新有限公司 光学超表面膜
EP4143619A4 (en) * 2020-04-28 2024-05-29 3M Innovative Properties Company ARTICLES WITH NANOSTRUCTURED SURFACES AND ENCLOSED VOIDS
US12461276B2 (en) 2020-05-01 2025-11-04 3M Innovative Properties Company Reflective optical metasurface films
US12297367B2 (en) 2020-08-27 2025-05-13 Applied Materials, Inc. Encapsulation materials for flat optical devices
FR3122523B1 (fr) * 2021-04-30 2023-06-09 Commissariat Energie Atomique Procede de structuration de surface hybride par gravure plasma
WO2023023207A1 (en) * 2021-08-17 2023-02-23 3Dfortify Inc. Thermally conductive dielectric photopolymer formulations compatible with vat polymerization additive manufacturing
WO2023073495A1 (en) * 2021-10-29 2023-05-04 3M Innovative Properties Company Light control film
KR20230086003A (ko) * 2021-12-07 2023-06-15 삼성디스플레이 주식회사 표시 장치 및 그 제조 방법
KR20230099128A (ko) * 2021-12-27 2023-07-04 엘지디스플레이 주식회사 표시장치
JP7835587B2 (ja) * 2022-03-22 2026-03-25 株式会社Ｓｃｒｅｅｎホールディングス 基板乾燥方法と基板処理方法
US12055737B2 (en) * 2022-05-18 2024-08-06 GE Precision Healthcare LLC Aligned and stacked high-aspect ratio metallized structures
CN115185026A (zh) * 2022-07-12 2022-10-14 Tcl华星光电技术有限公司 广视角光学膜及其制作方法、液晶显示装置

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Also Published As

Publication number Publication date
KR20190063470A (ko) 2019-06-07
KR102402862B1 (ko) 2022-05-27
US20190386251A1 (en) 2019-12-19
WO2018080830A1 (en) 2018-05-03
JP2020500329A (ja) 2020-01-09
CN110178242B (zh) 2022-01-11
TW201825385A (zh) 2018-07-16
CN110178242A (zh) 2019-08-27
US10756306B2 (en) 2020-08-25
EP3533090A1 (en) 2019-09-04

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