JP7029267B2 - 感光性樹脂組成物及び樹脂膜付き基板の製造方法 - Google Patents

感光性樹脂組成物及び樹脂膜付き基板の製造方法 Download PDF

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JP7029267B2
JP7029267B2 JP2017196326A JP2017196326A JP7029267B2 JP 7029267 B2 JP7029267 B2 JP 7029267B2 JP 2017196326 A JP2017196326 A JP 2017196326A JP 2017196326 A JP2017196326 A JP 2017196326A JP 7029267 B2 JP7029267 B2 JP 7029267B2
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group
resin composition
acid
photosensitive resin
substrate
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JP2019070720A (ja
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悠樹 小野
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Nippon Steel Chemical and Materials Co Ltd
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Nippon Steel Chemical and Materials Co Ltd
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Priority to JP2017196326A priority Critical patent/JP7029267B2/ja
Priority to CN201811122358.6A priority patent/CN109634056A/zh
Priority to TW107134420A priority patent/TWI782104B/zh
Priority to TW111137496A priority patent/TW202302682A/zh
Priority to KR1020180116089A priority patent/KR102646464B1/ko
Publication of JP2019070720A publication Critical patent/JP2019070720A/ja
Priority to JP2022023782A priority patent/JP2022063336A/ja
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Publication of JP7029267B2 publication Critical patent/JP7029267B2/ja
Priority to KR1020240031309A priority patent/KR20240032813A/ko
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0048—Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials For Photolithography (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Optical Filters (AREA)
  • Epoxy Resins (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
JP2017196326A 2017-10-06 2017-10-06 感光性樹脂組成物及び樹脂膜付き基板の製造方法 Active JP7029267B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2017196326A JP7029267B2 (ja) 2017-10-06 2017-10-06 感光性樹脂組成物及び樹脂膜付き基板の製造方法
CN201811122358.6A CN109634056A (zh) 2017-10-06 2018-09-26 感光性树脂组合物及附带树脂膜的基板的制造方法
TW111137496A TW202302682A (zh) 2017-10-06 2018-09-28 感光性樹脂組成物及附帶樹脂膜的基板的製造方法
KR1020180116089A KR102646464B1 (ko) 2017-10-06 2018-09-28 감광성 수지 조성물 및 수지막이 형성된 기판의 제조 방법
TW107134420A TWI782104B (zh) 2017-10-06 2018-09-28 感光性樹脂組成物及附帶樹脂膜的基板的製造方法
JP2022023782A JP2022063336A (ja) 2017-10-06 2022-02-18 感光性樹脂組成物及び樹脂膜付き基板の製造方法
KR1020240031309A KR20240032813A (ko) 2017-10-06 2024-03-05 감광성 수지 조성물 및 수지막이 형성된 기판의 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017196326A JP7029267B2 (ja) 2017-10-06 2017-10-06 感光性樹脂組成物及び樹脂膜付き基板の製造方法

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JP2022023782A Division JP2022063336A (ja) 2017-10-06 2022-02-18 感光性樹脂組成物及び樹脂膜付き基板の製造方法

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JP2019070720A JP2019070720A (ja) 2019-05-09
JP7029267B2 true JP7029267B2 (ja) 2022-03-03

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JP2022023782A Pending JP2022063336A (ja) 2017-10-06 2022-02-18 感光性樹脂組成物及び樹脂膜付き基板の製造方法

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JP (2) JP7029267B2 (zh)
KR (2) KR102646464B1 (zh)
CN (1) CN109634056A (zh)
TW (2) TWI782104B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190106906A (ko) * 2019-08-29 2019-09-18 엘지전자 주식회사 툴 체인저 및 이를 포함하는 툴 체인지 시스템

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CN114174351A (zh) * 2019-08-07 2022-03-11 日产化学株式会社 树脂组合物
JPWO2021153213A1 (zh) * 2020-01-30 2021-08-05
CN115551915A (zh) * 2020-05-19 2022-12-30 日铁化学材料株式会社 含有聚合性不饱和基的碱可溶性树脂及其制造方法、以及感光性树脂组合物及其硬化物
EP4186939A1 (en) * 2020-07-21 2023-05-31 Nippon Shokubai Co., Ltd. Resin composition
US20230303750A1 (en) * 2020-08-04 2023-09-28 Showa Denko Materials Co., Ltd. Photosensitive resin composition, photosensitive resin film, multilayered printed wiring board, semiconductor package, and method for producing multilayered printed wiring board
CN115145114A (zh) 2021-03-31 2022-10-04 日铁化学材料株式会社 遮光膜用感光性树脂组合物以及使用其的遮光膜、彩色滤光片及显示装置
KR20230099670A (ko) 2021-12-27 2023-07-04 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 감광성 수지 조성물 및 그것을 사용한 경화막, 컬러 필터 및 표시 장치
KR20230099669A (ko) 2021-12-27 2023-07-04 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 레지스트 조성물, 그것을 사용한 경화물 및 매트릭스 패턴, 착색 분산액, 및 레지스트 조성물의 제조 방법
KR20230103406A (ko) * 2021-12-31 2023-07-07 주식회사 동진쎄미켐 감광성 수지 조성물, 표시장치 및 패턴 형성 방법

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JP2014106458A (ja) 2012-11-29 2014-06-09 Hitachi Chemical Co Ltd 感光性樹脂組成物及びこれを用いた感光性エレメント
JP2016065942A (ja) 2014-09-24 2016-04-28 太陽インキ製造株式会社 硬化性組成物、ドライフィルム、硬化物、プリント配線板およびプリント配線板の製造方法
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JP2011070108A (ja) 2009-09-28 2011-04-07 Tamura Seisakusho Co Ltd 感光性樹脂組成物、プリント配線板用のソルダーレジスト組成物およびプリント配線板
JP2014106458A (ja) 2012-11-29 2014-06-09 Hitachi Chemical Co Ltd 感光性樹脂組成物及びこれを用いた感光性エレメント
JP2016065942A (ja) 2014-09-24 2016-04-28 太陽インキ製造株式会社 硬化性組成物、ドライフィルム、硬化物、プリント配線板およびプリント配線板の製造方法
WO2017057143A1 (ja) 2015-09-30 2017-04-06 東レ株式会社 ネガ型着色感光性樹脂組成物、硬化膜、素子および表示装置
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Publication number Priority date Publication date Assignee Title
KR20190106906A (ko) * 2019-08-29 2019-09-18 엘지전자 주식회사 툴 체인저 및 이를 포함하는 툴 체인지 시스템

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Publication number Publication date
CN109634056A (zh) 2019-04-16
TWI782104B (zh) 2022-11-01
JP2022063336A (ja) 2022-04-21
TW201915040A (zh) 2019-04-16
TW202302682A (zh) 2023-01-16
JP2019070720A (ja) 2019-05-09
KR20190039858A (ko) 2019-04-16
KR102646464B1 (ko) 2024-03-11
KR20240032813A (ko) 2024-03-12

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