JP7029114B2 - 高q mems共振子 - Google Patents
高q mems共振子 Download PDFInfo
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- JP7029114B2 JP7029114B2 JP2019204095A JP2019204095A JP7029114B2 JP 7029114 B2 JP7029114 B2 JP 7029114B2 JP 2019204095 A JP2019204095 A JP 2019204095A JP 2019204095 A JP2019204095 A JP 2019204095A JP 7029114 B2 JP7029114 B2 JP 7029114B2
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 74
- 229910052710 silicon Inorganic materials 0.000 claims description 74
- 239000010703 silicon Substances 0.000 claims description 74
- 229910052751 metal Inorganic materials 0.000 claims description 73
- 239000002184 metal Substances 0.000 claims description 73
- 239000010410 layer Substances 0.000 description 175
- 239000010408 film Substances 0.000 description 18
- 238000004519 manufacturing process Methods 0.000 description 15
- 239000010409 thin film Substances 0.000 description 10
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 7
- 239000012528 membrane Substances 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 5
- 229910052750 molybdenum Inorganic materials 0.000 description 5
- 239000011733 molybdenum Substances 0.000 description 5
- 235000012239 silicon dioxide Nutrition 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000151 deposition Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02228—Guided bulk acoustic wave devices or Lamb wave devices having interdigital transducers situated in parallel planes on either side of a piezoelectric layer
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02244—Details of microelectro-mechanical resonators
- H03H9/02433—Means for compensation or elimination of undesired effects
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02244—Details of microelectro-mechanical resonators
- H03H9/02433—Means for compensation or elimination of undesired effects
- H03H2009/0244—Anchor loss
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02244—Details of microelectro-mechanical resonators
- H03H2009/02488—Vibration modes
- H03H2009/02496—Horizontal, i.e. parallel to the substrate plane
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H2009/155—Constructional features of resonators consisting of piezoelectric or electrostrictive material using MEMS techniques
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
- H03H9/2405—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
- H03H2009/241—Bulk-mode MEMS resonators
Description
本出願は、引用をもってその全体が本願明細書に明確に組み込まれるものとする「高Q MEMS共振子(MEMS RESONATOR WITH HIGH QUALITY FACTOR)」と題する、2015年5月27日に出願された米国特許出願第14/722,323号の利益を主張する。
に配設することもできる。
によると、好ましくは5マイクロメートル以上10マイクロメートル以下の厚さを有する。これに対して、従来のMEMS共振子設計は、特定用途のために十分に高いQを有する共振子を得るために、シリコン層の厚さを、例えば、50マイクロメートル以上に増やす必要がある。シリコン層のサイズのこのような増大は、当業者には理解されるように、製造コストを大幅に増加させることになる。
.EN*hNとして算出可能であり、式中、Eiは、各膜i=1~N(本例示的実施形態
においては、金属膜または圧電層のどちらかとすることができる)の弾性係数であり、hiは各膜のそれぞれの膜厚である。例えば、シリコン層210の上に、E1=E3=329GPaおよびh1=h3=200nmの値を有する2つの金属膜#1および#3を存在させ、その間にE2=308GPaおよびh2=800nmの値を有する圧電膜を配設できる。その結果、シリコン層210の上側の組み合わされた複数の膜の剛性の合計は、この例によると、K=0.378MPa*mという値を有することになる。更に、製造プロ
セス中に、E1=308GPaおよびh1=1227nmの単一膜(例えば、圧電膜)によって同様の膜剛性をシリコン層210の下側に選択できる。換言すると、シリコンの下側の組み合わされた層(この場合は単一層)の総剛性もK=0.378MPa*mになり
、弾性係数および/または厚さを相応に選択できる。
210 シリコン層
212、216、416 圧電層(単数または複数)
214A、214B 第1金属層(単数または複数)
218A、218B 第2金属層(単数または複数)
220 電源
Claims (2)
- 面内振動モードで振動するMEMS共振子であって、
第1表面と前記第1表面の反対側の第2表面とを有するシリコン層と、
前記シリコン層の前記第1表面の上方に配設された一対の第1金属層と、
前記一対の第1金属層の間に配設された、第1の厚さを有する第1圧電層と、
前記シリコン層の前記第2表面の下方に配設された第2圧電層と、
を備え、
前記第2圧電層は、前記第1圧電層の前記第1の厚さより大きい第2の厚さを備え、
前記一対の第1金属層および前記第1圧電層は、前記第2圧電層の剛性に等しい、組み合わされた剛性を有する、
MEMS共振子。 - 面内振動モードで振動するMEMS共振子であって、
第1表面と前記第1表面の反対側の第2表面とを有するシリコン層と、
前記シリコン層の前記第1表面の上方に配設された一対の第1金属層と、
前記一対の第1金属層の間に配設された、第1の厚さを有する第1圧電層と、
前記シリコン層の前記第2表面の下方に配設された第2圧電層と、
を備え、
前記第2圧電層は、前記第1圧電層の前記第1の厚さより大きい第2の厚さを備え、
前記一対の第1金属層および前記第1圧電層の組み合わされた剛性は、前記第2圧電層の剛性との差が、前記第2圧電層の前記剛性に対して、±10%以内である、
MEMS共振子。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/722,323 | 2015-05-27 | ||
US14/722,323 US20160352307A1 (en) | 2015-05-27 | 2015-05-27 | Mems resonator with high quality factor |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018509738A Division JP6617902B2 (ja) | 2015-05-27 | 2016-05-24 | 高q mems共振子 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020022209A JP2020022209A (ja) | 2020-02-06 |
JP7029114B2 true JP7029114B2 (ja) | 2022-03-03 |
Family
ID=57393635
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018509738A Active JP6617902B2 (ja) | 2015-05-27 | 2016-05-24 | 高q mems共振子 |
JP2019204095A Active JP7029114B2 (ja) | 2015-05-27 | 2019-11-11 | 高q mems共振子 |
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JP2018509738A Active JP6617902B2 (ja) | 2015-05-27 | 2016-05-24 | 高q mems共振子 |
Country Status (4)
Country | Link |
---|---|
US (2) | US20160352307A1 (ja) |
JP (2) | JP6617902B2 (ja) |
CN (1) | CN107534430B (ja) |
WO (1) | WO2016191425A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022266783A1 (zh) * | 2021-06-21 | 2022-12-29 | 天津大学 | 压电mems执行器及其形成方法和运行方法 |
Citations (5)
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JP2001016068A (ja) | 1999-06-30 | 2001-01-19 | Kyocera Corp | 圧電共振子 |
WO2007088696A1 (ja) | 2006-01-31 | 2007-08-09 | Murata Manufacturing Co., Ltd. | 圧電振動装置 |
JP2008022408A (ja) | 2006-07-14 | 2008-01-31 | Epson Toyocom Corp | 圧電薄膜共振子 |
JP2008048315A (ja) | 2006-08-21 | 2008-02-28 | Seiko Epson Corp | 圧電振動片およびその製造方法 |
JP2015088521A (ja) | 2013-10-28 | 2015-05-07 | 富士フイルム株式会社 | 圧電体素子及び圧電体素子の製造方法 |
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JPS60126907A (ja) * | 1983-12-12 | 1985-07-06 | Nippon Telegr & Teleph Corp <Ntt> | 単一応答複合圧電振動素子 |
JP3531522B2 (ja) * | 1999-04-19 | 2004-05-31 | 株式会社村田製作所 | 圧電共振子 |
JP2006203304A (ja) * | 2005-01-18 | 2006-08-03 | Hitachi Media Electoronics Co Ltd | 圧電薄膜共振器及びそれを用いた発振器並びにそれを内蔵した半導体集積回路 |
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2015
- 2015-05-27 US US14/722,323 patent/US20160352307A1/en not_active Abandoned
-
2016
- 2016-05-24 WO PCT/US2016/033929 patent/WO2016191425A1/en active Application Filing
- 2016-05-24 JP JP2018509738A patent/JP6617902B2/ja active Active
- 2016-05-24 CN CN201680025459.4A patent/CN107534430B/zh active Active
-
2017
- 2017-11-09 US US15/807,778 patent/US10778184B2/en active Active
-
2019
- 2019-11-11 JP JP2019204095A patent/JP7029114B2/ja active Active
Patent Citations (5)
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JP2001016068A (ja) | 1999-06-30 | 2001-01-19 | Kyocera Corp | 圧電共振子 |
WO2007088696A1 (ja) | 2006-01-31 | 2007-08-09 | Murata Manufacturing Co., Ltd. | 圧電振動装置 |
JP2008022408A (ja) | 2006-07-14 | 2008-01-31 | Epson Toyocom Corp | 圧電薄膜共振子 |
JP2008048315A (ja) | 2006-08-21 | 2008-02-28 | Seiko Epson Corp | 圧電振動片およびその製造方法 |
JP2015088521A (ja) | 2013-10-28 | 2015-05-07 | 富士フイルム株式会社 | 圧電体素子及び圧電体素子の製造方法 |
Also Published As
Publication number | Publication date |
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US10778184B2 (en) | 2020-09-15 |
CN107534430B (zh) | 2020-10-09 |
US20160352307A1 (en) | 2016-12-01 |
WO2016191425A1 (en) | 2016-12-01 |
CN107534430A (zh) | 2018-01-02 |
US20180069527A1 (en) | 2018-03-08 |
JP2020022209A (ja) | 2020-02-06 |
JP6617902B2 (ja) | 2019-12-11 |
JP2018516028A (ja) | 2018-06-14 |
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