JP7016817B2 - 部品実装装置 - Google Patents

部品実装装置 Download PDF

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Publication number
JP7016817B2
JP7016817B2 JP2018566677A JP2018566677A JP7016817B2 JP 7016817 B2 JP7016817 B2 JP 7016817B2 JP 2018566677 A JP2018566677 A JP 2018566677A JP 2018566677 A JP2018566677 A JP 2018566677A JP 7016817 B2 JP7016817 B2 JP 7016817B2
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JP
Japan
Prior art keywords
component
component supply
supply position
unit
image pickup
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018566677A
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English (en)
Japanese (ja)
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JPWO2018146732A1 (ja
Inventor
和志 高間
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaha Motor Co Ltd
Original Assignee
Yamaha Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaha Motor Co Ltd filed Critical Yamaha Motor Co Ltd
Publication of JPWO2018146732A1 publication Critical patent/JPWO2018146732A1/ja
Application granted granted Critical
Publication of JP7016817B2 publication Critical patent/JP7016817B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0452—Mounting machines or lines comprising a plurality of tools for guiding different components to the same mounting place
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2018566677A 2017-02-07 2017-02-07 部品実装装置 Active JP7016817B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2017/004454 WO2018146732A1 (ja) 2017-02-07 2017-02-07 部品実装装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2020178383A Division JP7008118B2 (ja) 2020-10-23 2020-10-23 部品実装装置

Publications (2)

Publication Number Publication Date
JPWO2018146732A1 JPWO2018146732A1 (ja) 2019-11-07
JP7016817B2 true JP7016817B2 (ja) 2022-02-07

Family

ID=63107960

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018566677A Active JP7016817B2 (ja) 2017-02-07 2017-02-07 部品実装装置

Country Status (5)

Country Link
US (1) US11266050B2 (de)
JP (1) JP7016817B2 (de)
CN (1) CN110199588B (de)
DE (1) DE112017007006T5 (de)
WO (1) WO2018146732A1 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022185957A1 (ja) 2021-03-03 2022-09-09 パナソニックＩｐマネジメント株式会社 撮像装置および実装機

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005537630A (ja) 2001-11-13 2005-12-08 サイバーオプティクス コーポレーション 部品の配置を検査するピックアンドプレース機械
JP5198999B2 (ja) 2007-09-20 2013-05-15 株式会社シンク・ラボラトリー クッション性を有するグラビア版の製造方法
JP2015230912A (ja) 2014-06-03 2015-12-21 ヤマハ発動機株式会社 部品装着装置

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05198999A (ja) * 1992-01-20 1993-08-06 Sony Corp 基板検査装置
JPH07115296A (ja) * 1993-10-15 1995-05-02 Sanyo Electric Co Ltd 部品実装機の制御装置
JP3339213B2 (ja) * 1994-11-01 2002-10-28 松下電器産業株式会社 電子部品実装装置
JP3691888B2 (ja) 1995-12-27 2005-09-07 ジューキ株式会社 電子部品搭載方法
JPH11204992A (ja) 1998-01-13 1999-07-30 Matsushita Electric Ind Co Ltd 電子部品装着方法及び装置
US20010055069A1 (en) * 2000-03-10 2001-12-27 Hudson Edison T. One camera system for component to substrate registration
CN100518487C (zh) * 2001-11-13 2009-07-22 赛博光学公司 一种获取抓取式设备中多个图像的方法
JP3989728B2 (ja) * 2001-12-28 2007-10-10 富士機械製造株式会社 吸着ノズル先端位置検出方法および吸着ノズル先端位置検出用補助器具セット
US7239199B1 (en) * 2003-05-22 2007-07-03 Marvell International Ltd. Amplifier calibration
US20060096086A1 (en) * 2004-11-05 2006-05-11 Coots Charles A Real-time monitoring of machine performance
JP5524495B2 (ja) * 2009-03-10 2014-06-18 富士機械製造株式会社 撮像システムおよび電子回路部品装着機
JP5385010B2 (ja) * 2009-05-29 2014-01-08 Ｊｕｋｉ株式会社 電子部品実装装置
JP2011066041A (ja) 2009-09-15 2011-03-31 Juki Corp 電子部品実装装置
JP5545737B2 (ja) * 2010-08-03 2014-07-09 富士機械製造株式会社 部品実装機及び画像処理方法
JP5338773B2 (ja) * 2010-08-26 2013-11-13 パナソニック株式会社 部品実装用装置および撮像用の照明装置ならびに照明方法
JP5715881B2 (ja) * 2011-05-26 2015-05-13 Juki株式会社 電子部品実装装置
JP6103800B2 (ja) * 2011-07-01 2017-03-29 富士機械製造株式会社 部品実装機
US9265186B2 (en) * 2011-11-10 2016-02-16 Delaware Capital Formation, Inc. Camera system for aligning components of a PCB
EP2881226A4 (de) * 2012-08-02 2017-01-11 Fuji Machine Mfg. Co., Ltd. Arbeitsmaschine mit einem gelenkroboter und maschine zur montage elektrischer komponenten
EP2975921B1 (de) * 2013-03-12 2019-12-18 FUJI Corporation Komponentenerkennungssystem für eine komponentenmontagemaschine
JP6159124B2 (ja) * 2013-04-04 2017-07-05 ヤマハ発動機株式会社 部品実装装置
JP2014216621A (ja) 2013-04-30 2014-11-17 株式会社日立製作所 基板処理装置および基板処理方法
JP6190229B2 (ja) 2013-09-30 2017-08-30 ヤマハ発動機株式会社 部品実装装置
JP6199798B2 (ja) * 2014-04-30 2017-09-20 ヤマハ発動機株式会社 電子部品装着装置
JP6043367B2 (ja) * 2014-05-28 2016-12-14 ヤマハ発動機株式会社 部品実装装置および部品実装方法
JP6439142B2 (ja) * 2015-03-13 2018-12-19 パナソニックＩｐマネジメント株式会社 部品実装装置および部品実装方法
JP6378839B2 (ja) * 2015-06-19 2018-08-22 ヤマハ発動機株式会社 部品実装装置および部品実装装置における部品実装判定方法
WO2016203638A1 (ja) * 2015-06-19 2016-12-22 ヤマハ発動機株式会社 部品実装装置および部品実装方法
WO2017064774A1 (ja) * 2015-10-14 2017-04-20 ヤマハ発動機株式会社 基板作業システムおよび部品実装装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005537630A (ja) 2001-11-13 2005-12-08 サイバーオプティクス コーポレーション 部品の配置を検査するピックアンドプレース機械
JP5198999B2 (ja) 2007-09-20 2013-05-15 株式会社シンク・ラボラトリー クッション性を有するグラビア版の製造方法
JP2015230912A (ja) 2014-06-03 2015-12-21 ヤマハ発動機株式会社 部品装着装置

Also Published As

Publication number Publication date
CN110199588A (zh) 2019-09-03
CN110199588B (zh) 2020-12-29
US20200008332A1 (en) 2020-01-02
JPWO2018146732A1 (ja) 2019-11-07
DE112017007006T5 (de) 2019-10-31
US11266050B2 (en) 2022-03-01
WO2018146732A1 (ja) 2018-08-16

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