JP7010800B2 - 成膜装置、成膜方法、及び有機ｅｌ表示装置の製造方法 - Google Patents

成膜装置、成膜方法、及び有機ｅｌ表示装置の製造方法 Download PDF

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Publication number
JP7010800B2
JP7010800B2 JP2018200127A JP2018200127A JP7010800B2 JP 7010800 B2 JP7010800 B2 JP 7010800B2 JP 2018200127 A JP2018200127 A JP 2018200127A JP 2018200127 A JP2018200127 A JP 2018200127A JP 7010800 B2 JP7010800 B2 JP 7010800B2
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substrate
voltage
electrostatic chuck
film forming
mask
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JP2019099912A (ja
Inventor
博 石井
一史 柏倉
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Canon Tokki Corp
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Canon Tokki Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/02631—Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2018200127A 2017-11-29 2018-10-24 成膜装置、成膜方法、及び有機ｅｌ表示装置の製造方法 Active JP7010800B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020170161925A KR101960194B1 (ko) 2017-11-29 2017-11-29 성막장치, 성막방법, 및 유기 el 표시장치의 제조방법
KR10-2017-0161925 2017-11-29

Publications (2)

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JP2019099912A JP2019099912A (ja) 2019-06-24
JP7010800B2 true JP7010800B2 (ja) 2022-01-26

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JP2018200127A Active JP7010800B2 (ja) 2017-11-29 2018-10-24 成膜装置、成膜方法、及び有機ｅｌ表示装置の製造方法

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JP (1) JP7010800B2 (zh)
KR (1) KR101960194B1 (zh)
CN (1) CN109837506B (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210053760A (ko) * 2019-11-04 2021-05-12 캐논 톡키 가부시키가이샤 성막 장치 및 성막 방법
KR20210053761A (ko) * 2019-11-04 2021-05-12 캐논 톡키 가부시키가이샤 성막 장치 및 성막 방법
CN113005403B (zh) * 2019-12-20 2023-06-20 佳能特机株式会社 成膜装置、使用其的成膜方法及电子器件的制造方法
CN113005398B (zh) * 2019-12-20 2023-04-07 佳能特机株式会社 成膜装置、成膜方法及电子器件的制造方法
KR20210080776A (ko) * 2019-12-23 2021-07-01 캐논 톡키 가부시키가이샤 성막 시스템 및 기판 반송 시스템
KR20210080802A (ko) * 2019-12-23 2021-07-01 캐논 톡키 가부시키가이샤 성막 장치, 성막 방법, 및 전자 디바이스의 제조방법
KR20210081589A (ko) * 2019-12-24 2021-07-02 캐논 톡키 가부시키가이샤 성막장치, 전자 디바이스 제조장치, 성막방법, 및 전자 디바이스 제조방법
JP7390328B2 (ja) * 2021-03-30 2023-12-01 キヤノントッキ株式会社 制御装置、基板吸着方法及び電子デバイスの製造方法
CN113628958B (zh) * 2021-07-29 2024-04-23 华虹半导体(无锡)有限公司 半导体器件的制备方法
CN115369358B (zh) * 2021-09-08 2023-12-05 广东聚华印刷显示技术有限公司 蒸镀装置以及蒸镀基板分离方法
KR102651394B1 (ko) * 2022-10-19 2024-03-29 엘지디스플레이 주식회사 대면적 디스플레이 제조를 위한 수평 고정형 유기 증착 장비용 기판 처리 장치

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002280438A (ja) 2001-03-19 2002-09-27 Ulvac Japan Ltd 真空処理方法
JP2007251083A (ja) 2006-03-20 2007-09-27 Mitsubishi Heavy Ind Ltd ガラス基板の静電吸着装置及びその吸着離脱方法
JP2014065959A (ja) 2012-09-27 2014-04-17 Hitachi High-Technologies Corp 蒸着装置、および、蒸着装置における基板設置方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1014266A (ja) * 1996-06-21 1998-01-16 Sony Corp 静電チャック装置及び静電チャックを用いたウエハの保持方法及び静電チャックからのウエハの脱着方法
JP4226101B2 (ja) * 1998-05-12 2009-02-18 株式会社アルバック 静電チャックプレート表面からの基板離脱方法
JP2003060018A (ja) * 2001-08-13 2003-02-28 Nissin Electric Co Ltd 基板吸着方法およびその装置
JP4387642B2 (ja) * 2002-07-30 2009-12-16 株式会社アルバック 残留電荷除去方法及び残留電荷除去装置
JP2014075372A (ja) * 2010-12-27 2014-04-24 Canon Anelva Corp 静電吸着装置
KR102398067B1 (ko) * 2014-11-05 2022-05-13 삼성디스플레이 주식회사 정전 척
KR102490641B1 (ko) * 2015-11-25 2023-01-20 삼성디스플레이 주식회사 증착 장치 및 증착 방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002280438A (ja) 2001-03-19 2002-09-27 Ulvac Japan Ltd 真空処理方法
JP2007251083A (ja) 2006-03-20 2007-09-27 Mitsubishi Heavy Ind Ltd ガラス基板の静電吸着装置及びその吸着離脱方法
JP2014065959A (ja) 2012-09-27 2014-04-17 Hitachi High-Technologies Corp 蒸着装置、および、蒸着装置における基板設置方法

Also Published As

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CN109837506B (zh) 2022-10-11
JP2019099912A (ja) 2019-06-24
CN109837506A (zh) 2019-06-04
KR101960194B1 (ko) 2019-03-19

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