JP7002302B2 - 成膜装置 - Google Patents

成膜装置 Download PDF

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Publication number
JP7002302B2
JP7002302B2 JP2017227203A JP2017227203A JP7002302B2 JP 7002302 B2 JP7002302 B2 JP 7002302B2 JP 2017227203 A JP2017227203 A JP 2017227203A JP 2017227203 A JP2017227203 A JP 2017227203A JP 7002302 B2 JP7002302 B2 JP 7002302B2
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JP
Japan
Prior art keywords
adhesive
film
film forming
adhesive surface
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017227203A
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English (en)
Japanese (ja)
Other versions
JP2018095959A (ja
JP2018095959A5 (enrdf_load_stackoverflow
Inventor
昭彦 伊藤
克尚 加茂
繁樹 松中
篤史 藤田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Priority to CN201711281075.1A priority Critical patent/CN108220882B/zh
Priority to KR1020170170254A priority patent/KR102032307B1/ko
Priority to TW106143484A priority patent/TWI656230B/zh
Priority to US15/838,982 priority patent/US10633736B2/en
Publication of JP2018095959A publication Critical patent/JP2018095959A/ja
Publication of JP2018095959A5 publication Critical patent/JP2018095959A5/ja
Application granted granted Critical
Publication of JP7002302B2 publication Critical patent/JP7002302B2/ja
Active legal-status Critical Current
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
    • C23C14/165—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon by cathodic sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3464—Sputtering using more than one target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C23C14/505—Substrate holders for rotation of the substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2017227203A 2016-12-13 2017-11-27 成膜装置 Active JP7002302B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN201711281075.1A CN108220882B (zh) 2016-12-13 2017-12-06 成膜装置
KR1020170170254A KR102032307B1 (ko) 2016-12-13 2017-12-12 성막 장치
TW106143484A TWI656230B (zh) 2016-12-13 2017-12-12 Film forming device
US15/838,982 US10633736B2 (en) 2016-12-13 2017-12-12 Film formation apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016240856 2016-12-13
JP2016240856 2016-12-13

Publications (3)

Publication Number Publication Date
JP2018095959A JP2018095959A (ja) 2018-06-21
JP2018095959A5 JP2018095959A5 (enrdf_load_stackoverflow) 2021-01-14
JP7002302B2 true JP7002302B2 (ja) 2022-02-10

Family

ID=62632166

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017227203A Active JP7002302B2 (ja) 2016-12-13 2017-11-27 成膜装置

Country Status (4)

Country Link
JP (1) JP7002302B2 (enrdf_load_stackoverflow)
KR (1) KR102032307B1 (enrdf_load_stackoverflow)
CN (1) CN108220882B (enrdf_load_stackoverflow)
TW (1) TWI656230B (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7134802B2 (ja) * 2018-09-14 2022-09-12 株式会社アルバック 真空処理装置
JP7141989B2 (ja) * 2018-09-28 2022-09-26 芝浦メカトロニクス株式会社 成膜装置
JP7190386B2 (ja) * 2019-03-28 2022-12-15 芝浦メカトロニクス株式会社 成膜装置
JP7159238B2 (ja) * 2020-03-13 2022-10-24 キヤノントッキ株式会社 基板キャリア、成膜装置、及び成膜方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004006300A (ja) 2002-04-09 2004-01-08 Matsushita Electric Ind Co Ltd プラズマ処理方法及び装置、プラズマ処理用トレー
JP2005116610A (ja) 2003-10-03 2005-04-28 Nitto Denko Corp 半導体ウエハの加工方法および半導体ウエハ加工用粘着シート
JP2006505457A (ja) 2002-09-11 2006-02-16 エンテグリス・インコーポレーテッド 粘着性表面を有するキャリア
JP2016069727A (ja) 2014-09-30 2016-05-09 芝浦メカトロニクス株式会社 成膜装置及び成膜基板製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001003026A (ja) * 1999-06-22 2001-01-09 Bridgestone Corp 粘着剤組成物、粘着剤付きフィルム及び粘着剤付きフィルムの貼着方法
KR100995715B1 (ko) * 2002-04-09 2010-11-19 파나소닉 주식회사 플라즈마 처리 방법 및 장치와 플라즈마 처리용 트레이
US7108899B2 (en) * 2002-09-11 2006-09-19 Entegris, Inc. Chip tray with tacky surface
JP4555032B2 (ja) * 2004-09-03 2010-09-29 シーエステック株式会社 トレイ
WO2009034938A1 (ja) * 2007-09-10 2009-03-19 Ulvac, Inc. 有機材料蒸気発生装置、成膜源、成膜装置
JP5395798B2 (ja) * 2008-08-27 2014-01-22 株式会社アルバック 静電チャック及び真空処理装置
US20120225207A1 (en) * 2011-03-01 2012-09-06 Applied Materials, Inc. Apparatus and Process for Atomic Layer Deposition
JP2013035819A (ja) 2011-08-09 2013-02-21 Norimichi Kawashima 薬剤およびその使用方法
CN105463386B (zh) * 2014-09-30 2018-10-12 芝浦机械电子装置株式会社 成膜装置及成膜基板制造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004006300A (ja) 2002-04-09 2004-01-08 Matsushita Electric Ind Co Ltd プラズマ処理方法及び装置、プラズマ処理用トレー
JP2006505457A (ja) 2002-09-11 2006-02-16 エンテグリス・インコーポレーテッド 粘着性表面を有するキャリア
JP2005116610A (ja) 2003-10-03 2005-04-28 Nitto Denko Corp 半導体ウエハの加工方法および半導体ウエハ加工用粘着シート
JP2016069727A (ja) 2014-09-30 2016-05-09 芝浦メカトロニクス株式会社 成膜装置及び成膜基板製造方法

Also Published As

Publication number Publication date
JP2018095959A (ja) 2018-06-21
TW201833358A (zh) 2018-09-16
KR102032307B1 (ko) 2019-10-15
TWI656230B (zh) 2019-04-11
CN108220882B (zh) 2020-06-30
CN108220882A (zh) 2018-06-29
KR20180068306A (ko) 2018-06-21

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