JP6998139B2 - 蒸着マスク - Google Patents

蒸着マスク Download PDF

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Publication number
JP6998139B2
JP6998139B2 JP2017126165A JP2017126165A JP6998139B2 JP 6998139 B2 JP6998139 B2 JP 6998139B2 JP 2017126165 A JP2017126165 A JP 2017126165A JP 2017126165 A JP2017126165 A JP 2017126165A JP 6998139 B2 JP6998139 B2 JP 6998139B2
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JP
Japan
Prior art keywords
opening
openings
vapor deposition
deposition mask
metal film
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JP2017126165A
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English (en)
Japanese (ja)
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JP2019007069A5 (enExample
JP2019007069A (ja
Inventor
康克 觀田
健 大河原
貢 為川
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Japan Display Inc
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Japan Display Inc
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Publication date
Application filed by Japan Display Inc filed Critical Japan Display Inc
Priority to JP2017126165A priority Critical patent/JP6998139B2/ja
Priority to CN201880039459.9A priority patent/CN110741105A/zh
Priority to PCT/JP2018/013198 priority patent/WO2019003534A1/ja
Publication of JP2019007069A publication Critical patent/JP2019007069A/ja
Priority to US16/693,454 priority patent/US11111572B2/en
Publication of JP2019007069A5 publication Critical patent/JP2019007069A5/ja
Application granted granted Critical
Publication of JP6998139B2 publication Critical patent/JP6998139B2/ja
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04Coating on selected surface areas, e.g. using masks
    • C23C14/042Coating on selected surface areas, e.g. using masks using masks
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/10Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10Deposition of organic active material
    • H10K71/16Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
JP2017126165A 2017-06-28 2017-06-28 蒸着マスク Active JP6998139B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2017126165A JP6998139B2 (ja) 2017-06-28 2017-06-28 蒸着マスク
CN201880039459.9A CN110741105A (zh) 2017-06-28 2018-03-29 蒸镀掩模
PCT/JP2018/013198 WO2019003534A1 (ja) 2017-06-28 2018-03-29 蒸着マスク
US16/693,454 US11111572B2 (en) 2017-06-28 2019-11-25 Vapor deposition mask

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017126165A JP6998139B2 (ja) 2017-06-28 2017-06-28 蒸着マスク

Publications (3)

Publication Number Publication Date
JP2019007069A JP2019007069A (ja) 2019-01-17
JP2019007069A5 JP2019007069A5 (enExample) 2020-08-20
JP6998139B2 true JP6998139B2 (ja) 2022-01-18

Family

ID=64741357

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017126165A Active JP6998139B2 (ja) 2017-06-28 2017-06-28 蒸着マスク

Country Status (4)

Country Link
US (1) US11111572B2 (enExample)
JP (1) JP6998139B2 (enExample)
CN (1) CN110741105A (enExample)
WO (1) WO2019003534A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6704540B1 (ja) * 2018-09-27 2020-06-03 日鉄ケミカル&マテリアル株式会社 メタルマスク材料及びその製造方法とメタルマスク
CN114446190B (zh) 2022-02-08 2023-07-25 武汉华星光电半导体显示技术有限公司 支撑板及显示装置

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002060927A (ja) 2000-08-10 2002-02-28 Toray Ind Inc 薄膜パターン成膜用マスク
JP2006152396A (ja) 2004-11-30 2006-06-15 Sony Corp メタルマスク、電鋳用マスク原版及びマスター原版の製造方法
JP2006241547A (ja) 2005-03-04 2006-09-14 Kyocera Corp メタルマスクの製造方法およびメタルマスク
JP2008293798A (ja) 2007-05-24 2008-12-04 Toyota Industries Corp 有機el素子の製造方法
JP2009221535A (ja) 2008-03-17 2009-10-01 Univ Of Tsukuba 微細構造素子製造装置及び微細構造素子生産方法
JP2012134043A (ja) 2010-12-22 2012-07-12 Nitto Denko Corp 有機el素子の製造方法及び製造装置
JP2012522891A (ja) 2009-04-03 2012-09-27 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング 材料堆積装置において基板を保持する装置
JP2016009673A (ja) 2014-06-26 2016-01-18 シャープ株式会社 有機エレクトロルミネッセンス素子製造用マスク、有機エレクトロルミネッセンス素子の製造装置、及び、有機エレクトロルミネッセンス素子の製造方法
JP2017014582A (ja) 2015-07-02 2017-01-19 株式会社ブイ・テクノロジー 成膜マスクの製造方法及びその製造装置
JP6120039B1 (ja) 2015-07-17 2017-04-26 凸版印刷株式会社 メタルマスク用基材の製造方法、および、蒸着用メタルマスクの製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003017254A (ja) * 2001-06-29 2003-01-17 Sanyo Electric Co Ltd エレクトロルミネッセンス表示装置の製造方法
JP3596502B2 (ja) * 2001-09-25 2004-12-02 セイコーエプソン株式会社 マスク及びその製造方法、エレクトロルミネッセンス装置及びその製造方法並びに電子機器
JP2005042133A (ja) * 2003-07-22 2005-02-17 Seiko Epson Corp 蒸着マスク及びその製造方法、表示装置及びその製造方法、表示装置を備えた電子機器
JP4608874B2 (ja) * 2003-12-02 2011-01-12 ソニー株式会社 蒸着マスクおよびその製造方法
JP5297046B2 (ja) * 2008-01-16 2013-09-25 キヤノントッキ株式会社 成膜装置
JP2010106358A (ja) * 2008-09-30 2010-05-13 Canon Inc 成膜用マスク及びそれを用いた成膜方法
KR101135544B1 (ko) * 2009-09-22 2012-04-17 삼성모바일디스플레이주식회사 마스크 조립체, 이의 제조 방법 및 이를 이용한 평판표시장치용 증착 장치
US8786054B2 (en) * 2009-11-16 2014-07-22 Taiwan Semiconductor Manufacturing Company, Ltd. Structure for integrated circuit alignment
JP5259886B2 (ja) * 2010-12-20 2013-08-07 シャープ株式会社 蒸着方法及び蒸着装置
US20160043319A1 (en) * 2013-04-22 2016-02-11 Applied Materials, Inc. Actively-aligned fine metal mask
CN204125520U (zh) * 2014-08-14 2015-01-28 昆山萬豐電子有限公司 一种用于磁控溅射工艺的立式掩膜夹具

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002060927A (ja) 2000-08-10 2002-02-28 Toray Ind Inc 薄膜パターン成膜用マスク
JP2006152396A (ja) 2004-11-30 2006-06-15 Sony Corp メタルマスク、電鋳用マスク原版及びマスター原版の製造方法
JP2006241547A (ja) 2005-03-04 2006-09-14 Kyocera Corp メタルマスクの製造方法およびメタルマスク
JP2008293798A (ja) 2007-05-24 2008-12-04 Toyota Industries Corp 有機el素子の製造方法
JP2009221535A (ja) 2008-03-17 2009-10-01 Univ Of Tsukuba 微細構造素子製造装置及び微細構造素子生産方法
JP2012522891A (ja) 2009-04-03 2012-09-27 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング 材料堆積装置において基板を保持する装置
JP2012134043A (ja) 2010-12-22 2012-07-12 Nitto Denko Corp 有機el素子の製造方法及び製造装置
JP2016009673A (ja) 2014-06-26 2016-01-18 シャープ株式会社 有機エレクトロルミネッセンス素子製造用マスク、有機エレクトロルミネッセンス素子の製造装置、及び、有機エレクトロルミネッセンス素子の製造方法
JP2017014582A (ja) 2015-07-02 2017-01-19 株式会社ブイ・テクノロジー 成膜マスクの製造方法及びその製造装置
JP6120039B1 (ja) 2015-07-17 2017-04-26 凸版印刷株式会社 メタルマスク用基材の製造方法、および、蒸着用メタルマスクの製造方法

Also Published As

Publication number Publication date
WO2019003534A1 (ja) 2019-01-03
CN110741105A (zh) 2020-01-31
US20200095668A1 (en) 2020-03-26
US11111572B2 (en) 2021-09-07
JP2019007069A (ja) 2019-01-17

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