JP6996548B2 - インクジェット用インク組成物、硬化膜、硬化膜付き基板および電子部品 - Google Patents

インクジェット用インク組成物、硬化膜、硬化膜付き基板および電子部品 Download PDF

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Publication number
JP6996548B2
JP6996548B2 JP2019503060A JP2019503060A JP6996548B2 JP 6996548 B2 JP6996548 B2 JP 6996548B2 JP 2019503060 A JP2019503060 A JP 2019503060A JP 2019503060 A JP2019503060 A JP 2019503060A JP 6996548 B2 JP6996548 B2 JP 6996548B2
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Japan
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weight
parts
cured film
ink composition
acid
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JP2019503060A
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Japanese (ja)
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JPWO2018159674A1 (ja
Inventor
敏行 高橋
智嗣 古田
信太 諸越
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JNC Corp
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JNC Corp
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/062—Copolymers with monomers not covered by C08L33/06
    • C08L33/068—Copolymers with monomers not covered by C08L33/06 containing glycidyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur, or oxygen atoms in addition to the carboxy oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
JP2019503060A 2017-03-02 2018-02-28 インクジェット用インク組成物、硬化膜、硬化膜付き基板および電子部品 Active JP6996548B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017039665 2017-03-02
JP2017039665 2017-03-02
PCT/JP2018/007498 WO2018159674A1 (ja) 2017-03-02 2018-02-28 熱硬化性樹脂組成物、硬化膜、硬化膜付き基板、電子部品およびインクジェット用インク組成物

Publications (2)

Publication Number Publication Date
JPWO2018159674A1 JPWO2018159674A1 (ja) 2019-12-26
JP6996548B2 true JP6996548B2 (ja) 2022-01-17

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JP2019503060A Active JP6996548B2 (ja) 2017-03-02 2018-02-28 インクジェット用インク組成物、硬化膜、硬化膜付き基板および電子部品

Country Status (5)

Country Link
JP (1) JP6996548B2 (zh)
KR (1) KR20190121804A (zh)
CN (1) CN110382588A (zh)
TW (1) TW201842064A (zh)
WO (1) WO2018159674A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115052934B (zh) * 2020-02-07 2024-01-30 三菱瓦斯化学株式会社 树脂组合物、预浸料、层叠板、覆金属箔层叠板和印刷电路板
TWI747607B (zh) * 2020-11-12 2021-11-21 大陸商宸鴻科技（廈門）有限公司 形成絕緣層的墨水組成物、方法和觸控面板

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996011239A1 (fr) 1994-10-05 1996-04-18 Goo Chemical Co., Ltd. Encre resist de photosoudure, carte a circuit imprime et procede de fabrication
JP2014169353A (ja) 2013-03-01 2014-09-18 Jnc Corp 熱硬化性組成物
JP2015081336A (ja) 2013-10-24 2015-04-27 Jnc株式会社 熱硬化性樹脂組成物
WO2015068703A1 (ja) 2013-11-05 2015-05-14 太陽インキ製造株式会社 硬化型組成物、これを用いた硬化塗膜及びプリント配線板
JP2015163685A (ja) 2014-01-28 2015-09-10 Jnc株式会社 熱硬化性組成物及びそれを用いた硬化物

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60188482A (ja) 1984-03-09 1985-09-25 Hitachi Chem Co Ltd スクリーン印刷用レジストインク
JPS61272A (ja) 1984-06-12 1986-01-06 Taiyo Ink Seizo Kk インキ組成物
TWI288142B (en) 2003-05-09 2007-10-11 Taiyo Ink Mfg Co Ltd Photocuring/thermosetting ink jet composition and printed wiring board using same
JP4994923B2 (ja) 2007-04-06 2012-08-08 太陽ホールディングス株式会社 黒色ソルダーレジスト組成物およびその硬化物
JP5488175B2 (ja) 2010-04-28 2014-05-14 Ｊｎｃ株式会社 インクジェット用インク
KR101813845B1 (ko) 2015-02-12 2017-12-29 세키스이가가쿠 고교가부시키가이샤 잉크젯용 경화성 조성물 및 전자 부품의 제조 방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996011239A1 (fr) 1994-10-05 1996-04-18 Goo Chemical Co., Ltd. Encre resist de photosoudure, carte a circuit imprime et procede de fabrication
JP2014169353A (ja) 2013-03-01 2014-09-18 Jnc Corp 熱硬化性組成物
JP2015081336A (ja) 2013-10-24 2015-04-27 Jnc株式会社 熱硬化性樹脂組成物
WO2015068703A1 (ja) 2013-11-05 2015-05-14 太陽インキ製造株式会社 硬化型組成物、これを用いた硬化塗膜及びプリント配線板
JP2015163685A (ja) 2014-01-28 2015-09-10 Jnc株式会社 熱硬化性組成物及びそれを用いた硬化物

Also Published As

Publication number Publication date
CN110382588A (zh) 2019-10-25
WO2018159674A1 (ja) 2018-09-07
JPWO2018159674A1 (ja) 2019-12-26
TW201842064A (zh) 2018-12-01
KR20190121804A (ko) 2019-10-28

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