JP6987400B2 - ワーク搬送装置およびワーク搬送方法 - Google Patents
ワーク搬送装置およびワーク搬送方法 Download PDFInfo
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- JP6987400B2 JP6987400B2 JP2019175636A JP2019175636A JP6987400B2 JP 6987400 B2 JP6987400 B2 JP 6987400B2 JP 2019175636 A JP2019175636 A JP 2019175636A JP 2019175636 A JP2019175636 A JP 2019175636A JP 6987400 B2 JP6987400 B2 JP 6987400B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
- B65G47/914—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers provided with drive systems incorporating rotary and rectilinear movements
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G43/00—Control devices, e.g. for safety, warning or fault-correcting
- B65G43/08—Control devices operated by article or material being fed, conveyed or discharged
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67715—Changing the direction of the conveying path
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Specific Conveyance Elements (AREA)
- Supply And Installment Of Electrical Components (AREA)
Description
以下、図面を参照して本開示の実施の形態について説明する。図1乃至図8は本開示の実施の形態を示す図である。
次に図9により、本開示の変形例について述べる。図1乃至図8に示す実施の形態において、吸着ノズル装置20により、ワークWを移載テーブル30のワーク収納部31内に収納した例を示したが、これに限らず、図9に示すように、吸着ノズル装置20によりワークWを粘着プレート40上に移載してもよい。図9に示す変形例において、図1乃至図8に示す実施の形態と同一部分には、同一符号を付して詳細な説明は省略する。図9において、吸着ノズル装置20によりワークWが移載される粘着プレート40は、その表面に設けられた粘着層40aを有する。
2 ポケット
5 樹脂製プレート(突出プレート)
5a 開口
8 吸着部
9 ワーク検知部
10 ワーク搬送装置
11 ワークフィーダ
20 吸着ノズル装置
21 装置本体
22 吸着ノズル
25 ノズル
30 移載テーブル
31 ワーク収納部
35 制御部
40 粘着プレート
Claims (7)
- ワークが収納される複数のポケットが外周縁に形成された回転自在の回転テーブルと、
前記回転テーブル上に設けられ、前記回転テーブルと同期して回転する吸着ノズル装置とを備え、
前記吸着ノズル装置は、回転自在の装置本体と、この装置本体に保持されるとともに各ポケットに対応する位置に設けられ、前記ワークを吸着する複数の吸着ノズルとを有し、
各吸着ノズルは上下方向に移動可能となり、前記ポケット内の前記ワークを前記ポケットから下方へ降下させる、ワーク搬送装置。 - 前記回転テーブルの下方に、前記ポケット内の前記ワークを収納する複数のワーク収納部を有する移載テーブル、粘着層を有する粘着プレートまたは実装基板が設けられている、請求項1記載のワーク搬送装置。
- 前記回転テーブルに、前記ワークを前記ポケット内に移載するワークフィーダが接続されている、請求項1または2記載のワーク搬送装置。
- 前記ポケットは前記回転テーブルの外周縁に上下方向に貫通して設けられている、請求項1乃至3のいずれか記載のワーク搬送装置。
- 前記移載テーブル、前記粘着プレートまたは前記実装基板は水平面上において、X−Y方向に移動可能となる、請求項2記載のワーク搬送装置。
- 前記回転テーブルの前記ポケットの上縁端部には、前記ポケット内方へ突出して、前記吸着ノズルとともに前記ポケット内を密閉する突出プレートが設けられている、請求項1乃至5のいずれか記載のワーク搬送装置。
- 請求項1記載のワーク搬送装置を用いたワーク搬送方法において、
前記回転テーブルを停止させて、前記ワークを前記ポケット内に収納する工程と、
前記ポケット内の前記ワークを前記ポケットに対応する前記吸着ノズルにより吸着する工程と、
前記ポケット内の前記ワークを前記吸着ノズルにより吸着させた状態で前記回転テーブルと前記吸着ノズル装置を回転させる工程と、
前記回転テーブルと前記吸着ノズルの回転を停止させた後、前記吸着ノズルを降下させて前記吸着ノズルに吸着された前記ワークを前記ポケットから下方へ降下させる工程と、を備えたワーク搬送方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
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JP2019175636A JP6987400B2 (ja) | 2019-09-26 | 2019-09-26 | ワーク搬送装置およびワーク搬送方法 |
TW108137578A TWI743575B (zh) | 2019-09-26 | 2019-10-18 | 工件搬送裝置及工件搬送方法 |
CN201911088059.XA CN112551152B (zh) | 2019-09-26 | 2019-11-08 | 工件运送装置以及工件运送方法 |
KR1020190143157A KR102364791B1 (ko) | 2019-09-26 | 2019-11-11 | 워크 반송 장치 및 워크 반송 방법 |
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JP2019175636A JP6987400B2 (ja) | 2019-09-26 | 2019-09-26 | ワーク搬送装置およびワーク搬送方法 |
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JP6987400B2 true JP6987400B2 (ja) | 2022-01-05 |
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JP (1) | JP6987400B2 (ja) |
KR (1) | KR102364791B1 (ja) |
CN (1) | CN112551152B (ja) |
TW (1) | TWI743575B (ja) |
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JP7518529B2 (ja) | 2020-10-05 | 2024-07-18 | 株式会社 東京ウエルズ | ワーク搬送装置 |
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Publication number | Priority date | Publication date | Assignee | Title |
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JPH0680943B2 (ja) * | 1984-09-03 | 1994-10-12 | 松下電器産業株式会社 | 電子部品実装装置 |
JPH01254510A (ja) * | 1988-03-29 | 1989-10-11 | Murata Mfg Co Ltd | チップ部品のテーピング装置 |
JP2656861B2 (ja) * | 1991-02-04 | 1997-09-24 | 日本電信電話株式会社 | 着脱移送装置 |
JP2001322715A (ja) * | 2000-05-17 | 2001-11-20 | Tokyo Weld Co Ltd | ワーク搬送装置 |
DE10130533A1 (de) * | 2001-06-25 | 2003-01-09 | Pactec Verpackungsmaschinen Fa | Verfahren und Vorrichtung zur Montage und Verpackung kleinstückiger Artikel |
JP2004010301A (ja) * | 2002-06-10 | 2004-01-15 | Tokyo Weld Co Ltd | ワーク搬送装置およびワーク搬送方法 |
KR20050071862A (ko) * | 2004-01-05 | 2005-07-08 | 가부시키가이샤 도쿄 웰드 | 워크 이재 반송 장치 및 워크 이재 반송 방법 |
JP4124242B2 (ja) * | 2006-05-24 | 2008-07-23 | 株式会社村田製作所 | ワーク搬送装置及び電子部品搬送装置 |
JP2008260594A (ja) * | 2007-04-10 | 2008-10-30 | Okano Denki Kk | 部品搬送装置 |
JP2010070271A (ja) * | 2008-09-16 | 2010-04-02 | Hyuu Brain:Kk | 出荷トレイ装填装置 |
JP5294204B2 (ja) * | 2009-04-23 | 2013-09-18 | 株式会社 東京ウエルズ | ワーク挿入機構及びワーク挿入方法 |
KR101253112B1 (ko) * | 2011-09-28 | 2013-04-10 | 가부시키가이샤 도쿄 웰드 | 워크 반송 장치 |
JP5870752B2 (ja) * | 2012-02-27 | 2016-03-01 | シンフォニアテクノロジー株式会社 | ワーク供給装置 |
JP6529170B2 (ja) * | 2015-08-26 | 2019-06-12 | 株式会社 東京ウエルズ | ワークの外観検査装置およびワークの外観検査方法 |
CN109415354B (zh) * | 2016-08-19 | 2023-11-14 | 九州有机光材股份有限公司 | 电荷传输材料、化合物、延迟荧光材料及有机发光元件 |
CN208775853U (zh) * | 2018-08-31 | 2019-04-23 | 浙江浩通机械有限公司 | 铝塑枕包装盒自动生产线的旋转式送料机构 |
CN108817908B (zh) * | 2018-09-04 | 2024-01-26 | 常熟市天银机电股份有限公司 | Ptc自动安装装置 |
CN110052828A (zh) * | 2019-05-18 | 2019-07-26 | 深圳市科睿达自动化设备有限公司 | 一种电子元器件环形装配线的方法 |
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- 2019-09-26 JP JP2019175636A patent/JP6987400B2/ja active Active
- 2019-10-18 TW TW108137578A patent/TWI743575B/zh active
- 2019-11-08 CN CN201911088059.XA patent/CN112551152B/zh active Active
- 2019-11-11 KR KR1020190143157A patent/KR102364791B1/ko active IP Right Grant
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KR20210036771A (ko) | 2021-04-05 |
CN112551152B (zh) | 2023-04-14 |
KR102364791B1 (ko) | 2022-02-18 |
JP2021050091A (ja) | 2021-04-01 |
TW202112634A (zh) | 2021-04-01 |
TWI743575B (zh) | 2021-10-21 |
CN112551152A (zh) | 2021-03-26 |
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