JP6986623B2 - 基板処理装置、空調方法及び記憶媒体 - Google Patents

基板処理装置、空調方法及び記憶媒体 Download PDF

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Publication number
JP6986623B2
JP6986623B2 JP2020510674A JP2020510674A JP6986623B2 JP 6986623 B2 JP6986623 B2 JP 6986623B2 JP 2020510674 A JP2020510674 A JP 2020510674A JP 2020510674 A JP2020510674 A JP 2020510674A JP 6986623 B2 JP6986623 B2 JP 6986623B2
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gas
duct
accommodation
chambers
individual air
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Japanese (ja)
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JPWO2019188453A1 (ja
Inventor
真任 田所
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
    • F26B21/06—Controlling, e.g. regulating, parameters of gas supply
    • F26B21/10—Temperature; Pressure
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67225—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber

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  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • Air Bags (AREA)
  • Drying Of Solid Materials (AREA)
JP2020510674A 2018-03-26 2019-03-15 基板処理装置、空調方法及び記憶媒体 Active JP6986623B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018057924 2018-03-26
JP2018057924 2018-03-26
PCT/JP2019/010977 WO2019188453A1 (ja) 2018-03-26 2019-03-15 基板処理装置、空調方法及び記憶媒体

Publications (2)

Publication Number Publication Date
JPWO2019188453A1 JPWO2019188453A1 (ja) 2021-04-01
JP6986623B2 true JP6986623B2 (ja) 2021-12-22

Family

ID=68058810

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020510674A Active JP6986623B2 (ja) 2018-03-26 2019-03-15 基板処理装置、空調方法及び記憶媒体

Country Status (5)

Country Link
JP (1) JP6986623B2 (zh)
KR (1) KR102674916B1 (zh)
CN (1) CN111868883A (zh)
TW (1) TWI788540B (zh)
WO (1) WO2019188453A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI739201B (zh) * 2019-11-08 2021-09-11 辛耘企業股份有限公司 基板濕處理裝置及基板清洗方法
CN111076498B (zh) * 2019-12-25 2021-06-11 广东利元亨智能装备股份有限公司 电芯的干燥方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3225344B2 (ja) * 1996-01-26 2001-11-05 東京エレクトロン株式会社 処理装置
JPH11135429A (ja) * 1997-08-29 1999-05-21 Nikon Corp 温度制御方法及び該方法を使用する露光装置
JP3388706B2 (ja) * 1998-11-12 2003-03-24 東京エレクトロン株式会社 処理装置及び処理方法
JP3552600B2 (ja) * 1998-07-13 2004-08-11 東京エレクトロン株式会社 基板処理装置
JP3888836B2 (ja) * 1999-05-25 2007-03-07 東京エレクトロン株式会社 レジスト塗布現像処理装置
JP4381909B2 (ja) * 2004-07-06 2009-12-09 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
US20100033694A1 (en) * 2008-08-01 2010-02-11 Nikon Corporation Exposure method, exposure apparatus and device manufacturing method
JP5067432B2 (ja) * 2010-02-15 2012-11-07 東京エレクトロン株式会社 塗布、現像装置、現像方法及び記憶媒体
JP6503281B2 (ja) * 2015-11-13 2019-04-17 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置

Also Published As

Publication number Publication date
KR20200136940A (ko) 2020-12-08
TWI788540B (zh) 2023-01-01
KR102674916B1 (ko) 2024-06-12
TW201941262A (zh) 2019-10-16
JPWO2019188453A1 (ja) 2021-04-01
CN111868883A (zh) 2020-10-30
WO2019188453A1 (ja) 2019-10-03

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