JP6984602B2 - 低誘電接着剤層を含有する積層体 - Google Patents
低誘電接着剤層を含有する積層体 Download PDFInfo
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- JP6984602B2 JP6984602B2 JP2018532870A JP2018532870A JP6984602B2 JP 6984602 B2 JP6984602 B2 JP 6984602B2 JP 2018532870 A JP2018532870 A JP 2018532870A JP 2018532870 A JP2018532870 A JP 2018532870A JP 6984602 B2 JP6984602 B2 JP 6984602B2
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- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
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- Chemical & Material Sciences (AREA)
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CN110072961B (zh) | 2016-12-22 | 2022-02-08 | 东亚合成株式会社 | 粘合剂组合物以及使用其的覆盖膜、粘合片、覆铜层压板和电磁波屏蔽材料 |
CN115558442A (zh) * | 2018-03-30 | 2023-01-03 | 东洋纺株式会社 | 聚烯烃类粘接剂组合物 |
CN112440532A (zh) * | 2019-08-27 | 2021-03-05 | 康宁股份有限公司 | 用于高频印刷电路板应用的有机/无机层叠体 |
WO2021045125A1 (ja) * | 2019-09-06 | 2021-03-11 | 東洋紡株式会社 | ポリオレフィン系接着剤組成物 |
TWI724563B (zh) * | 2019-09-26 | 2021-04-11 | 盟鑫金屬股份有限公司 | 金屬材料的膠合方法 |
JP2021077716A (ja) * | 2019-11-06 | 2021-05-20 | 古河電気工業株式会社 | プリント基板およびプリント基板の製造方法 |
WO2021106847A1 (ja) * | 2019-11-28 | 2021-06-03 | 東洋紡株式会社 | 接着フィルム、積層体およびプリント配線板 |
KR102254212B1 (ko) | 2019-12-20 | 2021-05-21 | 율촌화학 주식회사 | 저유전 특성이 우수한 폴리올레핀계 접착제 조성물, 이를 이용한 본딩 시트, 인쇄회로기판 및 그 제조 방법 |
JPWO2021132058A1 (zh) * | 2019-12-23 | 2021-07-01 | ||
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CN113355032B (zh) * | 2020-03-03 | 2023-02-28 | 利诺士尖端材料有限公司 | 粘结膜、包括其的粘结膜附着层叠体及金属箔层叠体 |
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WO2015133497A1 (ja) * | 2014-03-05 | 2015-09-11 | デクセリアルズ株式会社 | 両面黒色粘着テープ |
CN107109055B (zh) * | 2015-01-16 | 2020-11-24 | 昭和电工材料株式会社 | 热固性树脂组合物、层间绝缘用树脂膜、复合膜、印刷布线板及其制造方法 |
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JP6791163B2 (ja) * | 2015-11-02 | 2020-11-25 | 東洋紡株式会社 | 低誘電難燃性接着剤組成物 |
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- 2017-07-28 TW TW106125381A patent/TWI749038B/zh active
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CN109476124A (zh) | 2019-03-15 |
WO2018030026A1 (ja) | 2018-02-15 |
TWI749038B (zh) | 2021-12-11 |
JPWO2018030026A1 (ja) | 2019-06-06 |
KR20190039392A (ko) | 2019-04-11 |
KR102340014B1 (ko) | 2021-12-16 |
TW201829176A (zh) | 2018-08-16 |
CN109476124B (zh) | 2021-06-22 |
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