JP6984602B2 - 低誘電接着剤層を含有する積層体 - Google Patents

低誘電接着剤層を含有する積層体 Download PDF

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Publication number
JP6984602B2
JP6984602B2 JP2018532870A JP2018532870A JP6984602B2 JP 6984602 B2 JP6984602 B2 JP 6984602B2 JP 2018532870 A JP2018532870 A JP 2018532870A JP 2018532870 A JP2018532870 A JP 2018532870A JP 6984602 B2 JP6984602 B2 JP 6984602B2
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JP
Japan
Prior art keywords
base material
resin
laminate
adhesive layer
laminated body
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JP2018532870A
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English (en)
Japanese (ja)
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JPWO2018030026A1 (ja
Inventor
忠彦 三上
武 伊藤
遼 薗田
秀行 坂田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyobo Co Ltd
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Toyobo Co Ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/12Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/085Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/08PCBs, i.e. printed circuit boards

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
JP2018532870A 2016-08-09 2017-06-30 低誘電接着剤層を含有する積層体 Active JP6984602B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016156204 2016-08-09
JP2016156204 2016-08-09
PCT/JP2017/024168 WO2018030026A1 (ja) 2016-08-09 2017-06-30 低誘電接着剤層を含有する積層体

Publications (2)

Publication Number Publication Date
JPWO2018030026A1 JPWO2018030026A1 (ja) 2019-06-06
JP6984602B2 true JP6984602B2 (ja) 2021-12-22

Family

ID=61161946

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018532870A Active JP6984602B2 (ja) 2016-08-09 2017-06-30 低誘電接着剤層を含有する積層体

Country Status (5)

Country Link
JP (1) JP6984602B2 (zh)
KR (1) KR102340014B1 (zh)
CN (1) CN109476124B (zh)
TW (1) TWI749038B (zh)
WO (1) WO2018030026A1 (zh)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110072961B (zh) 2016-12-22 2022-02-08 东亚合成株式会社 粘合剂组合物以及使用其的覆盖膜、粘合片、覆铜层压板和电磁波屏蔽材料
CN115558442A (zh) * 2018-03-30 2023-01-03 东洋纺株式会社 聚烯烃类粘接剂组合物
CN112440532A (zh) * 2019-08-27 2021-03-05 康宁股份有限公司 用于高频印刷电路板应用的有机/无机层叠体
WO2021045125A1 (ja) * 2019-09-06 2021-03-11 東洋紡株式会社 ポリオレフィン系接着剤組成物
TWI724563B (zh) * 2019-09-26 2021-04-11 盟鑫金屬股份有限公司 金屬材料的膠合方法
JP2021077716A (ja) * 2019-11-06 2021-05-20 古河電気工業株式会社 プリント基板およびプリント基板の製造方法
WO2021106847A1 (ja) * 2019-11-28 2021-06-03 東洋紡株式会社 接着フィルム、積層体およびプリント配線板
KR102254212B1 (ko) 2019-12-20 2021-05-21 율촌화학 주식회사 저유전 특성이 우수한 폴리올레핀계 접착제 조성물, 이를 이용한 본딩 시트, 인쇄회로기판 및 그 제조 방법
JPWO2021132058A1 (zh) * 2019-12-23 2021-07-01
KR102259097B1 (ko) * 2020-02-28 2021-06-02 (주)이녹스첨단소재 접착 필름, 이를 포함하는 접착 필름 부착 적층체 및 이를 포함하는 금속박 적층체
CN113355032B (zh) * 2020-03-03 2023-02-28 利诺士尖端材料有限公司 粘结膜、包括其的粘结膜附着层叠体及金属箔层叠体
JP6981581B1 (ja) * 2020-03-30 2021-12-15 東洋紡株式会社 接着剤組成物、ならびに接着シート、積層体およびプリント配線板
JPWO2022091960A1 (zh) * 2020-10-29 2022-05-05
JPWO2023127890A1 (zh) * 2021-12-28 2023-07-06
KR20240103489A (ko) 2022-12-27 2024-07-04 율촌화학 주식회사 금속 이온 마이그레이션 방지용 접착제 조성물, 이를 포함하는 본딩 시트 및 인쇄회로기판

Family Cites Families (12)

* Cited by examiner, † Cited by third party
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US3639353A (en) * 1970-03-20 1972-02-01 Goodrich Co B F Polymers crosslinked with polycarbodiimides
JP4067144B2 (ja) * 1996-08-20 2008-03-26 三井化学株式会社 接着剤組成物
JP2000104025A (ja) * 1998-09-29 2000-04-11 Nisshinbo Ind Inc フレキシブルプリント配線板用フィルム
JP2000345132A (ja) * 1999-06-01 2000-12-12 Nisshinbo Ind Inc Lcp接合方法
JP3621351B2 (ja) * 2001-02-08 2005-02-16 日東電工株式会社 熱反応性接着剤組成物および熱反応性接着フィルム
JP5141071B2 (ja) * 2007-03-29 2013-02-13 住友電気工業株式会社 フレキシブルフラットケーブル用絶縁テープおよびその製法
JP4911252B1 (ja) * 2010-11-30 2012-04-04 東洋インキScホールディングス株式会社 カルボキシル基含有変性エステル樹脂を含む熱硬化性樹脂組成物
WO2014147903A1 (ja) * 2013-03-22 2014-09-25 東亞合成株式会社 接着剤組成物並びにこれを用いたカバーレイフィルム及びフレキシブル銅張積層板
WO2015133497A1 (ja) * 2014-03-05 2015-09-11 デクセリアルズ株式会社 両面黒色粘着テープ
CN107109055B (zh) * 2015-01-16 2020-11-24 昭和电工材料株式会社 热固性树脂组合物、层间绝缘用树脂膜、复合膜、印刷布线板及其制造方法
KR102160499B1 (ko) * 2015-05-15 2020-09-28 도요보 가부시키가이샤 저유전 접착제층을 함유하는 적층체
JP6791163B2 (ja) * 2015-11-02 2020-11-25 東洋紡株式会社 低誘電難燃性接着剤組成物

Also Published As

Publication number Publication date
CN109476124A (zh) 2019-03-15
WO2018030026A1 (ja) 2018-02-15
TWI749038B (zh) 2021-12-11
JPWO2018030026A1 (ja) 2019-06-06
KR20190039392A (ko) 2019-04-11
KR102340014B1 (ko) 2021-12-16
TW201829176A (zh) 2018-08-16
CN109476124B (zh) 2021-06-22

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