JP6981933B2 - 硬化性組成物、該組成物の硬化物、及び該硬化物を用いた半導体装置 - Google Patents
硬化性組成物、該組成物の硬化物、及び該硬化物を用いた半導体装置 Download PDFInfo
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- JP6981933B2 JP6981933B2 JP2018152932A JP2018152932A JP6981933B2 JP 6981933 B2 JP6981933 B2 JP 6981933B2 JP 2018152932 A JP2018152932 A JP 2018152932A JP 2018152932 A JP2018152932 A JP 2018152932A JP 6981933 B2 JP6981933 B2 JP 6981933B2
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
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- H—ELECTRICITY
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- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- C—CHEMISTRY; METALLURGY
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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JP2018152932A JP6981933B2 (ja) | 2018-08-15 | 2018-08-15 | 硬化性組成物、該組成物の硬化物、及び該硬化物を用いた半導体装置 |
KR1020190097948A KR20200019827A (ko) | 2018-08-15 | 2019-08-12 | 경화성 조성물, 해당 조성물의 경화물, 및 해당 경화물을 사용한 반도체 장치 |
TW108128890A TWI767135B (zh) | 2018-08-15 | 2019-08-14 | 硬化性組成物、該組成物之硬化物,及使用該硬化物之半導體裝置 |
CN201910753559.4A CN110835516B (zh) | 2018-08-15 | 2019-08-15 | 固化性组合物、该组合物的固化物及使用了该固化物的半导体装置 |
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JP7388865B2 (ja) * | 2019-10-08 | 2023-11-29 | 信越化学工業株式会社 | 付加硬化型シリコーン組成物、その硬化物、及び半導体装置 |
JP7436175B2 (ja) * | 2019-10-08 | 2024-02-21 | 信越化学工業株式会社 | 硬化性組成物、その硬化物、及び半導体装置 |
JP2024020089A (ja) * | 2022-08-01 | 2024-02-14 | 信越化学工業株式会社 | 低誘電率絶縁性コーティング組成物、その硬化物および表示装置 |
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US5239035A (en) * | 1992-04-09 | 1993-08-24 | Dow Corning Corporation | Curable organosiloxane gel compositions |
JP2927279B2 (ja) | 1996-07-29 | 1999-07-28 | 日亜化学工業株式会社 | 発光ダイオード |
JPH10139784A (ja) * | 1996-11-06 | 1998-05-26 | Kanegafuchi Chem Ind Co Ltd | ビニルシリル基含有ケイ素化合物の製造方法 |
JPH10228249A (ja) | 1996-12-12 | 1998-08-25 | Nichia Chem Ind Ltd | 発光ダイオード及びそれを用いたled表示装置 |
JP4286935B2 (ja) | 1998-10-14 | 2009-07-01 | 株式会社朝日ラバー | 調色照明装置 |
JP2000143676A (ja) * | 1998-11-09 | 2000-05-26 | Kanegafuchi Chem Ind Co Ltd | トリビニルシリル置換多芳香環含有ケイ素化合物および その製造方法 |
JP4220232B2 (ja) * | 2002-12-26 | 2009-02-04 | Hoya株式会社 | 反射防止膜を有する光学部材 |
JP4520251B2 (ja) * | 2003-10-10 | 2010-08-04 | 信越化学工業株式会社 | 硬化性組成物 |
JP2008069210A (ja) * | 2006-09-12 | 2008-03-27 | Shin Etsu Chem Co Ltd | 多環式炭化水素基含有シリコーン系硬化性組成物 |
JP5186668B2 (ja) * | 2008-03-07 | 2013-04-17 | ナガセケムテックス株式会社 | 硬化性シルセスキオキサン組成物 |
JP2012046604A (ja) * | 2010-08-26 | 2012-03-08 | Shin-Etsu Chemical Co Ltd | 多環式炭化水素骨格含有成分を含む硬化性シリコーン系組成物 |
KR102215439B1 (ko) * | 2013-07-24 | 2021-02-16 | 가부시키가이샤 아데카 | 경화성 수지 조성물 |
JP6038824B2 (ja) * | 2014-02-07 | 2016-12-07 | 信越化学工業株式会社 | 硬化性組成物、半導体装置、及びエステル結合含有有機ケイ素化合物 |
JP6148204B2 (ja) * | 2014-06-03 | 2017-06-14 | 信越化学工業株式会社 | 硬化性組成物及び半導体装置 |
JP2017210520A (ja) * | 2016-05-24 | 2017-11-30 | 株式会社Adeka | 硬化性組成物 |
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CN110835516A (zh) | 2020-02-25 |
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