JP6981933B2 - 硬化性組成物、該組成物の硬化物、及び該硬化物を用いた半導体装置 - Google Patents

硬化性組成物、該組成物の硬化物、及び該硬化物を用いた半導体装置 Download PDF

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JP6981933B2
JP6981933B2 JP2018152932A JP2018152932A JP6981933B2 JP 6981933 B2 JP6981933 B2 JP 6981933B2 JP 2018152932 A JP2018152932 A JP 2018152932A JP 2018152932 A JP2018152932 A JP 2018152932A JP 6981933 B2 JP6981933 B2 JP 6981933B2
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cured product
curable composition
present
formula
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JP2020026502A (ja
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大輔 平野
中 小林
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Shin Etsu Chemical Co Ltd
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Shin Etsu Chemical Co Ltd
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Priority to JP2018152932A priority Critical patent/JP6981933B2/ja
Priority to KR1020190097948A priority patent/KR20200019827A/ko
Priority to TW108128890A priority patent/TWI767135B/zh
Priority to CN201910753559.4A priority patent/CN110835516B/zh
Publication of JP2020026502A publication Critical patent/JP2020026502A/ja
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Materials For Photolithography (AREA)
JP2018152932A 2018-08-15 2018-08-15 硬化性組成物、該組成物の硬化物、及び該硬化物を用いた半導体装置 Active JP6981933B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2018152932A JP6981933B2 (ja) 2018-08-15 2018-08-15 硬化性組成物、該組成物の硬化物、及び該硬化物を用いた半導体装置
KR1020190097948A KR20200019827A (ko) 2018-08-15 2019-08-12 경화성 조성물, 해당 조성물의 경화물, 및 해당 경화물을 사용한 반도체 장치
TW108128890A TWI767135B (zh) 2018-08-15 2019-08-14 硬化性組成物、該組成物之硬化物，及使用該硬化物之半導體裝置
CN201910753559.4A CN110835516B (zh) 2018-08-15 2019-08-15 固化性组合物、该组合物的固化物及使用了该固化物的半导体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018152932A JP6981933B2 (ja) 2018-08-15 2018-08-15 硬化性組成物、該組成物の硬化物、及び該硬化物を用いた半導体装置

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JP2020026502A JP2020026502A (ja) 2020-02-20
JP6981933B2 true JP6981933B2 (ja) 2021-12-17

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JP2018152932A Active JP6981933B2 (ja) 2018-08-15 2018-08-15 硬化性組成物、該組成物の硬化物、及び該硬化物を用いた半導体装置

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JP (1) JP6981933B2 (ko)
KR (1) KR20200019827A (ko)
CN (1) CN110835516B (ko)
TW (1) TWI767135B (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7388865B2 (ja) * 2019-10-08 2023-11-29 信越化学工業株式会社 付加硬化型シリコーン組成物、その硬化物、及び半導体装置
JP7401247B2 (ja) * 2019-10-08 2023-12-19 信越化学工業株式会社 硬化性組成物、その硬化物、及び半導体装置
JP7436175B2 (ja) * 2019-10-08 2024-02-21 信越化学工業株式会社 硬化性組成物、その硬化物、及び半導体装置
JP2024020089A (ja) * 2022-08-01 2024-02-14 信越化学工業株式会社 低誘電率絶縁性コーティング組成物、その硬化物および表示装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5239035A (en) * 1992-04-09 1993-08-24 Dow Corning Corporation Curable organosiloxane gel compositions
JP2927279B2 (ja) 1996-07-29 1999-07-28 日亜化学工業株式会社 発光ダイオード
JPH10139784A (ja) * 1996-11-06 1998-05-26 Kanegafuchi Chem Ind Co Ltd ビニルシリル基含有ケイ素化合物の製造方法
JPH10228249A (ja) 1996-12-12 1998-08-25 Nichia Chem Ind Ltd 発光ダイオード及びそれを用いたｌｅｄ表示装置
JP4286935B2 (ja) 1998-10-14 2009-07-01 株式会社朝日ラバー 調色照明装置
JP2000143676A (ja) * 1998-11-09 2000-05-26 Kanegafuchi Chem Ind Co Ltd トリビニルシリル置換多芳香環含有ケイ素化合物および その製造方法
JP4220232B2 (ja) * 2002-12-26 2009-02-04 Ｈｏｙａ株式会社 反射防止膜を有する光学部材
JP4520251B2 (ja) * 2003-10-10 2010-08-04 信越化学工業株式会社 硬化性組成物
JP2008069210A (ja) * 2006-09-12 2008-03-27 Shin Etsu Chem Co Ltd 多環式炭化水素基含有シリコーン系硬化性組成物
JP5186668B2 (ja) * 2008-03-07 2013-04-17 ナガセケムテックス株式会社 硬化性シルセスキオキサン組成物
JP2012046604A (ja) * 2010-08-26 2012-03-08 Shin-Etsu Chemical Co Ltd 多環式炭化水素骨格含有成分を含む硬化性シリコーン系組成物
WO2015012141A1 (ja) * 2013-07-24 2015-01-29 株式会社Adeka 硬化性樹脂組成物
JP6038824B2 (ja) * 2014-02-07 2016-12-07 信越化学工業株式会社 硬化性組成物、半導体装置、及びエステル結合含有有機ケイ素化合物
JP6148204B2 (ja) * 2014-06-03 2017-06-14 信越化学工業株式会社 硬化性組成物及び半導体装置
JP2017210520A (ja) * 2016-05-24 2017-11-30 株式会社Adeka 硬化性組成物

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Publication number Publication date
KR20200019827A (ko) 2020-02-25
CN110835516B (zh) 2023-02-17
CN110835516A (zh) 2020-02-25
TWI767135B (zh) 2022-06-11
JP2020026502A (ja) 2020-02-20
TW202014450A (zh) 2020-04-16

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