JP6977063B2 - 被覆された金属基板及び製造方法 - Google Patents
被覆された金属基板及び製造方法 Download PDFInfo
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- JP6977063B2 JP6977063B2 JP2019566207A JP2019566207A JP6977063B2 JP 6977063 B2 JP6977063 B2 JP 6977063B2 JP 2019566207 A JP2019566207 A JP 2019566207A JP 2019566207 A JP2019566207 A JP 2019566207A JP 6977063 B2 JP6977063 B2 JP 6977063B2
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- 229910052751 metal Inorganic materials 0.000 title claims description 103
- 239000002184 metal Substances 0.000 title claims description 103
- 239000000758 substrate Substances 0.000 title claims description 80
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 238000000576 coating method Methods 0.000 claims description 75
- 239000011248 coating agent Substances 0.000 claims description 73
- 239000010410 layer Substances 0.000 claims description 69
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 49
- 229910000831 Steel Inorganic materials 0.000 claims description 47
- 239000010959 steel Substances 0.000 claims description 47
- 239000010936 titanium Substances 0.000 claims description 45
- 239000011247 coating layer Substances 0.000 claims description 41
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 41
- 239000011651 chromium Substances 0.000 claims description 38
- 238000000034 method Methods 0.000 claims description 34
- 229910052742 iron Inorganic materials 0.000 claims description 29
- 229910052759 nickel Inorganic materials 0.000 claims description 23
- 229910052804 chromium Inorganic materials 0.000 claims description 22
- 229910052782 aluminium Inorganic materials 0.000 claims description 20
- 229910052719 titanium Inorganic materials 0.000 claims description 19
- 239000011572 manganese Substances 0.000 claims description 15
- 239000011701 zinc Substances 0.000 claims description 15
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 12
- 229910052710 silicon Inorganic materials 0.000 claims description 12
- 229910052725 zinc Inorganic materials 0.000 claims description 12
- 238000000151 deposition Methods 0.000 claims description 11
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 10
- 230000008021 deposition Effects 0.000 claims description 10
- 238000001771 vacuum deposition Methods 0.000 claims description 10
- 239000011777 magnesium Substances 0.000 claims description 9
- 229910052749 magnesium Inorganic materials 0.000 claims description 9
- 238000004070 electrodeposition Methods 0.000 claims description 7
- 229910052748 manganese Inorganic materials 0.000 claims description 7
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 6
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 6
- 229910045601 alloy Inorganic materials 0.000 claims description 6
- 239000000956 alloy Substances 0.000 claims description 6
- 238000005554 pickling Methods 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 238000007747 plating Methods 0.000 claims description 5
- 238000010298 pulverizing process Methods 0.000 claims description 5
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 4
- 229910001220 stainless steel Inorganic materials 0.000 claims description 4
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 claims description 3
- 238000001912 gas jet deposition Methods 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 2
- 229910017052 cobalt Inorganic materials 0.000 claims description 2
- 239000010941 cobalt Substances 0.000 claims description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 2
- 150000002739 metals Chemical class 0.000 claims description 2
- 239000010703 silicon Substances 0.000 claims description 2
- 238000005260 corrosion Methods 0.000 claims 2
- 230000007797 corrosion Effects 0.000 claims 2
- 238000007740 vapor deposition Methods 0.000 claims 1
- 229910044991 metal oxide Inorganic materials 0.000 description 23
- 150000004706 metal oxides Chemical class 0.000 description 23
- 239000000203 mixture Substances 0.000 description 9
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 8
- 229910001092 metal group alloy Inorganic materials 0.000 description 6
- 229910018125 Al-Si Inorganic materials 0.000 description 5
- 229910018520 Al—Si Inorganic materials 0.000 description 5
- 239000002390 adhesive tape Substances 0.000 description 5
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 5
- 238000004381 surface treatment Methods 0.000 description 5
- 239000012535 impurity Substances 0.000 description 4
- 229910009369 Zn Mg Inorganic materials 0.000 description 3
- 229910007573 Zn-Mg Inorganic materials 0.000 description 3
- 238000000137 annealing Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 229910001338 liquidmetal Inorganic materials 0.000 description 3
- 229910001000 nickel titanium Inorganic materials 0.000 description 3
- 238000005240 physical vapour deposition Methods 0.000 description 3
- 229910018134 Al-Mg Inorganic materials 0.000 description 2
- 229910018467 Al—Mg Inorganic materials 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- -1 Zn-Al Chemical compound 0.000 description 2
- 229910007570 Zn-Al Inorganic materials 0.000 description 2
- 238000005275 alloying Methods 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 229910000423 chromium oxide Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- AMWRITDGCCNYAT-UHFFFAOYSA-L hydroxy(oxo)manganese;manganese Chemical compound [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- 229910000619 316 stainless steel Inorganic materials 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910021364 Al-Si alloy Inorganic materials 0.000 description 1
- 229910000789 Aluminium-silicon alloy Inorganic materials 0.000 description 1
- 229910003023 Mg-Al Inorganic materials 0.000 description 1
- 229910017028 MnSi Inorganic materials 0.000 description 1
- 229910018643 Mn—Si Inorganic materials 0.000 description 1
- 229910000794 TRIP steel Inorganic materials 0.000 description 1
- 229910000937 TWIP steel Inorganic materials 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- 229910007567 Zn-Ni Inorganic materials 0.000 description 1
- 229910007614 Zn—Ni Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052810 boron oxide Inorganic materials 0.000 description 1
- 238000002144 chemical decomposition reaction Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 description 1
- 229910001039 duplex stainless steel Inorganic materials 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 235000014413 iron hydroxide Nutrition 0.000 description 1
- NCNCGGDMXMBVIA-UHFFFAOYSA-L iron(ii) hydroxide Chemical compound [OH-].[OH-].[Fe+2] NCNCGGDMXMBVIA-UHFFFAOYSA-L 0.000 description 1
- 238000001540 jet deposition Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 235000021110 pickles Nutrition 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000002207 thermal evaporation Methods 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
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- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
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- Other Surface Treatments For Metallic Materials (AREA)
- Physical Vapour Deposition (AREA)
- Laminated Bodies (AREA)
Description
−鋼板の表面の酸化を制限するために不活性又は還元雰囲気下で鋼板が炉を通過する際の鋼板の焼鈍、
−板が浴を出るときに板が金属/金属合金で被覆されるように、板が液体状態の金属又は金属合金の浴を通過する際の板の溶融めっき。
−板が液体浴を出た後、金属/金属合金の層の均一で一定な厚さを保証するために、表面上に気体を噴霧することによって、金属/金属合金の層が拭われる。
A.酸化物の少なくとも1つの層を備える金属基板の提供、
B.真空蒸着又は電着法による中間被覆層の堆積、及び
C.防食金属被覆である被覆層の堆積、
を含む、方法にも関する。
<付着>
T曲げ試験を実施した。この試験の目的は、被覆された板を180°の角度で曲げることによって、被覆の付着を測定することである。適用される曲げ半径は、用いられる基板の厚さの2倍に等しい(「2T」曲げに相当する)。被覆の付着は、粘着テープを充てることによって確認する。粘着テープを剥がした後に試験された板上に被覆が残存しており、粘着テープ上に被覆が見られない場合に、試験の結果は良好であると判断する。
−Fe−Ni−Cr−Ti被覆の10nmの層の真空蒸着
−亜鉛の5μmの層の真空蒸着
Claims (25)
- 酸化物の少なくとも1つの層を備える被覆された金属基板であって、かかる層のすぐ上に、Fe、Ni、Cr及びTiを含む中間被覆層が存在し、Tiの量は5重量%以上であり、並びに以下の式:8重量%<Cr+Ti<40重量%が満たされており、残りがFe及びNiであり、かかる中間被覆層のすぐ上に、防食金属被覆層が存在する、被覆された金属基板。
- 中間被覆層が15〜42重量%のNiを含む、請求項1に記載の被覆された金属基板。
- 中間被覆層が22〜40重量%のNiを含む、請求項2に記載の被覆された金属基板。
- 中間被覆層が25〜30重量%のNiを含む、請求項1〜3のいずれか一項に記載の被覆された金属基板。
- 中間被覆層が10〜60%の鉄を含む、請求項1〜4のいずれか一項に記載の被覆された金属基板。
- 中間被覆層が30〜60%の鉄を含む、請求項1〜5のいずれか一項に記載の被覆された金属基板。
- 中間被覆層が5〜30重量%のTiを含む、請求項1〜6のいずれか一項に記載の被覆された金属基板。
- 中間被覆層が5〜20重量%のTiを含む、請求項7に記載の被覆された金属基板。
- 中間被覆層が5〜30重量%のCrを含む、請求項1〜8のいずれか一項に記載の被覆された金属基板。
- 中間被覆が5〜20重量%のCrの層を含む、請求項9に記載の被覆された金属基板。
- 中間被覆層が1〜100nmの厚さを有する、請求項1〜10のいずれか一項に記載の被覆された金属基板。
- 中間被覆層が1〜50nmの厚さを有する、請求項11に記載の被覆された金属基板。
- 中間被覆層が1〜20nmの厚さを有する、請求項12に記載の被覆された金属基板。
- 金属基板が防食金属被覆層で直接被覆されており、かかる防食金属被覆層のすぐ上に酸化物の層が存在する、請求項1〜13のいずれか一項に記載の被覆された金属基板。
- 1又は複数の防食金属被覆層が、亜鉛、アルミニウム、銅、ケイ素、鉄、マグネシウム、チタン、ニッケル、クロム、マンガン及びこれらの合金を含む群の中から選択される金属を含む、請求項1〜14のいずれか一項に記載の被覆された金属基板。
- 防食金属被覆層が、15%未満のSi、5.0%未満のFeを含み、0.1〜8.0%のMgを任意に含み、及び0.1〜30.0%のZnを任意に含み、残りがAlであるアルミニウムをベースとする被覆層である、請求項15に記載の被覆された金属基板。
- 防食金属被覆層が、0.01〜8.0%のAlを含み、0.2〜8.0%のMgを任意に含み、残りがZnである亜鉛をベースとする被覆層である、請求項16に記載の被覆された金属基板。
- 金属基板が、アルミニウム基板、鋼基板、ステンレス鋼基板、銅基板、鉄基板、銅合金基板、チタン基板、コバルト基板又はニッケル基板の中から選択される、請求項1〜17のいずれか一項に記載の被覆された金属基板。
- 金属基板が鋼板である、請求項18に記載の被覆された金属基板。
- 請求項1〜18のいずれか一項に記載の被覆された金属基板の製造方法であって、以下の工程:
A.酸化物の少なくとも1つの層を備える金属基板の提供、
B.真空蒸着又は電着法による請求項1〜13のいずれか一項に記載の中間被覆層の堆積、
C.請求項1〜17のいずれか一項に記載の防食金属被覆層の堆積、
を含む、方法。 - 工程B)において、中間被覆層の堆積が、マグネトロン陰極微粉化法又はジェット蒸着法によって行われる、請求項20に記載の被覆された金属基板の製造方法。
- 工程C)において、被覆層の堆積が、溶融めっきによって、電着法によって、又は真空蒸着によって行われる、請求項20又は21に記載の被覆された金属基板の製造方法。
- 工程C)において、被覆層の堆積が、マグネトロン陰極微粉化法又はジェット蒸着法によって行われる、請求項20〜22のいずれか一項に記載の被覆された金属基板の製造方法。
- 方法が、中間被覆の堆積の前に、金属基板上の酸化物の層を除去するための酸洗を含まない、請求項20〜23のいずれか一項に記載の方法。
- 自動車両の一部の製造のための、請求項1〜19のいずれか一項に記載の、又は請求項20〜24のいずれか一項に記載の方法から得られる被覆された金属基板の使用。
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