JP6976798B2 - 撮像装置、撮像システム、移動体、回路チップ - Google Patents

撮像装置、撮像システム、移動体、回路チップ Download PDF

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JP6976798B2
JP6976798B2 JP2017192052A JP2017192052A JP6976798B2 JP 6976798 B2 JP6976798 B2 JP 6976798B2 JP 2017192052 A JP2017192052 A JP 2017192052A JP 2017192052 A JP2017192052 A JP 2017192052A JP 6976798 B2 JP6976798 B2 JP 6976798B2
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pixel
signal
row
chip
circuit
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JP2019068266A (ja
JP2019068266A5 (enExample
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秀央 小林
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Canon Inc
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Canon Inc
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Priority to JP2017192052A priority Critical patent/JP6976798B2/ja
Priority to US16/143,279 priority patent/US11388358B2/en
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Publication of JP2019068266A5 publication Critical patent/JP2019068266A5/ja
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    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/50Depth or shape recovery
    • G06T7/55Depth or shape recovery from multiple images
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/60Noise processing, e.g. detecting, correcting, reducing or removing noise
    • H04N25/63Noise processing, e.g. detecting, correcting, reducing or removing noise applied to dark current
    • H04N25/633Noise processing, e.g. detecting, correcting, reducing or removing noise applied to dark current by using optical black pixels
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/60Noise processing, e.g. detecting, correcting, reducing or removing noise
    • H04N25/67Noise processing, e.g. detecting, correcting, reducing or removing noise applied to fixed-pattern noise, e.g. non-uniformity of response
    • H04N25/671Noise processing, e.g. detecting, correcting, reducing or removing noise applied to fixed-pattern noise, e.g. non-uniformity of response for non-uniformity detection or correction
    • H04N25/677Noise processing, e.g. detecting, correcting, reducing or removing noise applied to fixed-pattern noise, e.g. non-uniformity of response for non-uniformity detection or correction for reducing the column or line fixed pattern noise
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • H04N25/76Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/78Readout circuits for addressed sensors, e.g. output amplifiers or A/D converters
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/809Constructional details of image sensors of hybrid image sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/811Interconnections
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00Indexing scheme for image analysis or image enhancement
    • G06T2207/10Image acquisition modality
    • G06T2207/10028Range image; Depth image; 3D point clouds
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00Indexing scheme for image analysis or image enhancement
    • G06T2207/30Subject of image; Context of image processing
    • G06T2207/30248Vehicle exterior or interior
    • G06T2207/30252Vehicle exterior; Vicinity of vehicle
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/802Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
JP2017192052A 2017-09-29 2017-09-29 撮像装置、撮像システム、移動体、回路チップ Active JP6976798B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2017192052A JP6976798B2 (ja) 2017-09-29 2017-09-29 撮像装置、撮像システム、移動体、回路チップ
US16/143,279 US11388358B2 (en) 2017-09-29 2018-09-26 Image capturing apparatus, image capturing system, moving object, and circuit chip

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Application Number Priority Date Filing Date Title
JP2017192052A JP6976798B2 (ja) 2017-09-29 2017-09-29 撮像装置、撮像システム、移動体、回路チップ

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JP2019068266A JP2019068266A (ja) 2019-04-25
JP2019068266A5 JP2019068266A5 (enExample) 2020-11-12
JP6976798B2 true JP6976798B2 (ja) 2021-12-08

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JP (1) JP6976798B2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7102119B2 (ja) * 2017-09-29 2022-07-19 キヤノン株式会社 半導体装置および機器
US10863122B2 (en) * 2018-06-04 2020-12-08 Apple Inc. Clock feedthrough compensation in image sensor systems
EP3595292B1 (en) * 2018-07-13 2021-06-23 Teledyne Dalsa B.V. Image sensor system
JP7407416B2 (ja) 2019-11-26 2024-01-04 パナソニックIpマネジメント株式会社 撮像装置およびカメラ
US11682745B2 (en) * 2020-05-27 2023-06-20 Texas Instruments Incorporated Photon detector array assembly
JP7654415B2 (ja) * 2021-02-04 2025-04-01 キヤノン株式会社 光電変換装置、機器
JPWO2023132232A1 (enExample) * 2022-01-05 2023-07-13

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Publication number Priority date Publication date Assignee Title
DE69913560T2 (de) 1998-10-07 2004-09-30 Hamamatsu Photonics K.K., Hamamatsu Sehr schneller bildaufnehmer
KR20090050252A (ko) * 2007-11-15 2009-05-20 삼성전자주식회사 이미지 센서
JP4743243B2 (ja) * 2008-09-08 2011-08-10 ソニー株式会社 撮像装置、黒レベルの調整方法およびプログラム
JP5302644B2 (ja) * 2008-12-03 2013-10-02 キヤノン株式会社 撮像装置、及び撮像システム
JP5633323B2 (ja) * 2010-11-11 2014-12-03 ソニー株式会社 固体撮像装置及び電子機器
JP5820627B2 (ja) 2011-06-09 2015-11-24 オリンパス株式会社 固体撮像装置、撮像装置、および信号読み出し方法
JP5953028B2 (ja) * 2011-11-02 2016-07-13 オリンパス株式会社 固体撮像装置、撮像装置、および信号読み出し方法
JP5893601B2 (ja) * 2013-10-31 2016-03-23 富士重工業株式会社 車両制御システム
JP6230395B2 (ja) * 2013-12-06 2017-11-15 キヤノン株式会社 撮像装置およびその駆動方法
JP6314477B2 (ja) * 2013-12-26 2018-04-25 ソニー株式会社 電子デバイス
JP2015198273A (ja) * 2014-03-31 2015-11-09 ソニー株式会社 イメージセンサ、およびイメージセンサの動作方法、撮像装置および撮像方法、並びに電子機器
KR102326607B1 (ko) 2014-07-14 2021-11-16 소니그룹주식회사 비교기, ad 변환기, 고체 촬상 장치, 전자 기기, 및 비교기의 제어 방법
JP2016171399A (ja) 2015-03-11 2016-09-23 株式会社東芝 固体撮像装置
JP6419655B2 (ja) 2015-06-22 2018-11-07 株式会社東芝 固体撮像装置
JP6451575B2 (ja) * 2015-09-18 2019-01-16 株式会社ニコン 撮像装置
JP6919154B2 (ja) * 2016-03-31 2021-08-18 ソニーグループ株式会社 固体撮像素子、撮像装置、および電子機器

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US20190104267A1 (en) 2019-04-04
JP2019068266A (ja) 2019-04-25
US11388358B2 (en) 2022-07-12

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