JP6974479B2 - シリコーン系粘着剤組成物及び粘着テープ - Google Patents
シリコーン系粘着剤組成物及び粘着テープ Download PDFInfo
- Publication number
- JP6974479B2 JP6974479B2 JP2019540152A JP2019540152A JP6974479B2 JP 6974479 B2 JP6974479 B2 JP 6974479B2 JP 2019540152 A JP2019540152 A JP 2019540152A JP 2019540152 A JP2019540152 A JP 2019540152A JP 6974479 B2 JP6974479 B2 JP 6974479B2
- Authority
- JP
- Japan
- Prior art keywords
- silicone
- sensitive adhesive
- pressure
- tan
- organic peroxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000002390 adhesive tape Substances 0.000 title claims description 52
- 239000000203 mixture Substances 0.000 title claims description 29
- 239000013464 silicone adhesive Substances 0.000 title description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 119
- 150000001451 organic peroxides Chemical class 0.000 claims description 75
- 230000001070 adhesive effect Effects 0.000 claims description 74
- 239000000853 adhesive Substances 0.000 claims description 73
- 229920001296 polysiloxane Polymers 0.000 claims description 69
- 238000003860 storage Methods 0.000 claims description 36
- 239000001301 oxygen Substances 0.000 claims description 22
- 229910052760 oxygen Inorganic materials 0.000 claims description 22
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 20
- 238000010438 heat treatment Methods 0.000 claims description 20
- 229920005989 resin Polymers 0.000 claims description 16
- 239000011347 resin Substances 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 15
- 238000005259 measurement Methods 0.000 claims description 13
- -1 polyethylene terephthalate Polymers 0.000 claims description 13
- 229920001971 elastomer Polymers 0.000 claims description 12
- 229920001721 polyimide Polymers 0.000 claims description 12
- 239000012790 adhesive layer Substances 0.000 claims description 9
- 239000004642 Polyimide Substances 0.000 claims description 8
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 8
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 8
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 4
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 4
- 229920002530 polyetherether ketone Polymers 0.000 claims description 4
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 4
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 4
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 4
- 229920002312 polyamide-imide Polymers 0.000 claims description 3
- 239000011112 polyethylene naphthalate Substances 0.000 claims description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims 1
- 239000007788 liquid Substances 0.000 description 48
- 230000000052 comparative effect Effects 0.000 description 18
- 238000001723 curing Methods 0.000 description 18
- 239000011550 stock solution Substances 0.000 description 18
- 239000010410 layer Substances 0.000 description 14
- 238000004519 manufacturing process Methods 0.000 description 12
- 238000000034 method Methods 0.000 description 12
- 239000004065 semiconductor Substances 0.000 description 10
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 239000007787 solid Substances 0.000 description 9
- 238000001035 drying Methods 0.000 description 8
- 239000002904 solvent Substances 0.000 description 8
- 239000003795 chemical substances by application Substances 0.000 description 7
- 150000002978 peroxides Chemical class 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 238000000576 coating method Methods 0.000 description 5
- 238000009832 plasma treatment Methods 0.000 description 5
- 229920002050 silicone resin Polymers 0.000 description 5
- 229920002379 silicone rubber Polymers 0.000 description 5
- 239000004945 silicone rubber Substances 0.000 description 5
- 239000000654 additive Substances 0.000 description 4
- 125000003342 alkenyl group Chemical group 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 230000000873 masking effect Effects 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 3
- 239000003963 antioxidant agent Substances 0.000 description 3
- 235000019400 benzoyl peroxide Nutrition 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 239000006082 mold release agent Substances 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 238000005303 weighing Methods 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 239000003945 anionic surfactant Substances 0.000 description 2
- 239000002216 antistatic agent Substances 0.000 description 2
- 239000003093 cationic surfactant Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000007865 diluting Methods 0.000 description 2
- 239000004205 dimethyl polysiloxane Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 239000002736 nonionic surfactant Substances 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- ZAFNJMIOTHYJRJ-UHFFFAOYSA-N Diisopropyl ether Chemical compound CC(C)OC(C)C ZAFNJMIOTHYJRJ-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 229910004283 SiO 4 Inorganic materials 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 238000013006 addition curing Methods 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000003849 aromatic solvent Substances 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000003759 ester based solvent Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000004210 ether based solvent Substances 0.000 description 1
- 239000011086 glassine Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- GJRQTCIYDGXPES-UHFFFAOYSA-N iso-butyl acetate Natural products CC(C)COC(C)=O GJRQTCIYDGXPES-UHFFFAOYSA-N 0.000 description 1
- FGKJLKRYENPLQH-UHFFFAOYSA-M isocaproate Chemical compound CC(C)CCC([O-])=O FGKJLKRYENPLQH-UHFFFAOYSA-M 0.000 description 1
- OQAGVSWESNCJJT-UHFFFAOYSA-N isovaleric acid methyl ester Natural products COC(=O)CC(C)C OQAGVSWESNCJJT-UHFFFAOYSA-N 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 150000003058 platinum compounds Chemical class 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2017/031924 WO2019049200A1 (ja) | 2017-09-05 | 2017-09-05 | シリコーン系粘着剤組成物及び粘着テープ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2019049200A1 JPWO2019049200A1 (ja) | 2020-10-01 |
JP6974479B2 true JP6974479B2 (ja) | 2021-12-01 |
Family
ID=65633696
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019540152A Active JP6974479B2 (ja) | 2017-09-05 | 2017-09-05 | シリコーン系粘着剤組成物及び粘着テープ |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6974479B2 (zh) |
KR (1) | KR102422196B1 (zh) |
CN (1) | CN111094498B (zh) |
TW (1) | TWI805610B (zh) |
WO (1) | WO2019049200A1 (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20230004554A (ko) * | 2020-03-31 | 2023-01-06 | 가부시키가이샤 데라오카 세이사쿠쇼 | 수지 조성물 및 점착 테이프 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4809988B2 (ja) | 2001-03-21 | 2011-11-09 | 日東電工株式会社 | シリコーン系感圧接着剤組成物およびそれを用いた感圧接着テープ |
CN100341391C (zh) * | 2001-04-18 | 2007-10-03 | 日东电工株式会社 | 在柔性印刷电路上安装电子部件的方法及用于固定柔性印刷电路的压敏胶粘剂片 |
JP2002309201A (ja) * | 2001-04-18 | 2002-10-23 | Nitto Denko Corp | フレキシブルプリント配線板固定用接着シート及びフレキシブルプリント配線板への電子部品の実装方法 |
JP4119156B2 (ja) * | 2002-04-23 | 2008-07-16 | 日東電工株式会社 | 両面粘着テープおよび接着方法 |
JP3888679B2 (ja) * | 2002-04-23 | 2007-03-07 | 日東電工株式会社 | 両面粘着テープおよび固定方法 |
JP3956121B2 (ja) | 2002-09-04 | 2007-08-08 | 信越化学工業株式会社 | 導電性シリコーン粘着剤組成物 |
JP2006028311A (ja) | 2004-07-14 | 2006-02-02 | Shin Etsu Chem Co Ltd | 耐熱性に優れるシリコーン粘着剤組成物および製造方法 |
JP5049584B2 (ja) * | 2006-12-25 | 2012-10-17 | 東レ・ダウコーニング株式会社 | 過酸化物硬化型シリコーン系感圧接着剤組成物および粘着テープ |
JP5117713B2 (ja) | 2006-12-25 | 2013-01-16 | 東レ・ダウコーニング株式会社 | シリコーン系感圧接着剤組成物および粘着テープ |
EP2184332A4 (en) * | 2007-08-27 | 2012-08-29 | Lintec Corp | DETACHABLE ADHESIVE SHEET AND METHOD FOR PROTECTING AN INCOMPLY CURED COATING FILM |
JP4919098B2 (ja) * | 2008-06-26 | 2012-04-18 | 信越化学工業株式会社 | 有機過酸化物硬化型シリコーン粘着剤組成物及び粘着テープ |
KR101181335B1 (ko) * | 2009-04-09 | 2012-09-11 | 디아이씨 가부시끼가이샤 | 양면 점착 테이프 |
JP2013147540A (ja) | 2012-01-17 | 2013-08-01 | Nitto Denko Corp | 半導体部品の表面保護用粘着テープ |
JP2014072301A (ja) * | 2012-09-28 | 2014-04-21 | Fujifilm Corp | 基板搬送用キャリア |
CN105745293A (zh) * | 2013-11-26 | 2016-07-06 | 琳得科株式会社 | 两面粘着片及两面粘着片的制造方法 |
JP6265772B2 (ja) * | 2014-02-13 | 2018-01-24 | 日東電工株式会社 | シリコーン粘着剤組成物、粘着テープおよび粘着テープの製造方法 |
JP6348434B2 (ja) * | 2014-03-28 | 2018-06-27 | 信越化学工業株式会社 | シリコーン粘着剤組成物、その製造法及び粘着フィルム |
KR20150112851A (ko) * | 2014-03-28 | 2015-10-07 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 실리콘 점착제 조성물, 그의 제조 방법 및 점착 필름 |
-
2017
- 2017-09-05 WO PCT/JP2017/031924 patent/WO2019049200A1/ja active Application Filing
- 2017-09-05 CN CN201780094591.5A patent/CN111094498B/zh active Active
- 2017-09-05 KR KR1020207008651A patent/KR102422196B1/ko active IP Right Grant
- 2017-09-05 JP JP2019540152A patent/JP6974479B2/ja active Active
-
2018
- 2018-09-03 TW TW107130854A patent/TWI805610B/zh active
Also Published As
Publication number | Publication date |
---|---|
TW201920580A (zh) | 2019-06-01 |
WO2019049200A1 (ja) | 2019-03-14 |
CN111094498B (zh) | 2022-02-01 |
KR102422196B1 (ko) | 2022-07-20 |
TWI805610B (zh) | 2023-06-21 |
JPWO2019049200A1 (ja) | 2020-10-01 |
CN111094498A (zh) | 2020-05-01 |
KR20200044082A (ko) | 2020-04-28 |
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