JP6966457B2 - 液晶ディスプレイ用大容量コンデンサのための界面技術 - Google Patents
液晶ディスプレイ用大容量コンデンサのための界面技術 Download PDFInfo
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- JP6966457B2 JP6966457B2 JP2018541182A JP2018541182A JP6966457B2 JP 6966457 B2 JP6966457 B2 JP 6966457B2 JP 2018541182 A JP2018541182 A JP 2018541182A JP 2018541182 A JP2018541182 A JP 2018541182A JP 6966457 B2 JP6966457 B2 JP 6966457B2
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- H10D30/6737—Thin-film transistors [TFT] characterised by the electrodes characterised by the electrode materials
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- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02172—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides
- H01L21/02175—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal
- H01L21/02194—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal the material containing more than one metal element
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
- H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
- H10K59/1216—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being capacitors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/124—Insulating layers formed between TFT elements and OLED elements
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Crystallography & Structural Chemistry (AREA)
- Computer Hardware Design (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Optics & Photonics (AREA)
- Mathematical Physics (AREA)
- Plasma & Fusion (AREA)
- Thin Film Transistor (AREA)
- Liquid Crystal (AREA)
- Chemical Vapour Deposition (AREA)
- Physical Vapour Deposition (AREA)
- Formation Of Insulating Films (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662292017P | 2016-02-05 | 2016-02-05 | |
| US62/292,017 | 2016-02-05 | ||
| PCT/US2017/013953 WO2017136141A1 (en) | 2016-02-05 | 2017-01-18 | Interface engineering for high capacitance capacitor for liquid crystal display |
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| JP2019507903A JP2019507903A (ja) | 2019-03-22 |
| JP2019507903A5 JP2019507903A5 (enExample) | 2020-02-27 |
| JP6966457B2 true JP6966457B2 (ja) | 2021-11-17 |
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| JP (1) | JP6966457B2 (enExample) |
| KR (1) | KR102717556B1 (enExample) |
| CN (1) | CN108700788B (enExample) |
| WO (1) | WO2017136141A1 (enExample) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US11049887B2 (en) | 2017-11-10 | 2021-06-29 | Applied Materials, Inc. | Layer stack for display applications |
| US20190206691A1 (en) * | 2018-01-04 | 2019-07-04 | Applied Materials, Inc. | High-k gate insulator for a thin-film transistor |
| US20200066858A1 (en) * | 2018-08-24 | 2020-02-27 | Qualcomm Incorporated | High performance thin film transistor with negative index material |
| TWI698029B (zh) * | 2018-11-28 | 2020-07-01 | 財團法人金屬工業研究發展中心 | 形成半導體結構之方法 |
| CN109742087B (zh) * | 2018-12-27 | 2021-08-24 | 武汉华星光电技术有限公司 | 阵列基板及其制备方法 |
| KR102704437B1 (ko) * | 2019-06-13 | 2024-09-09 | 삼성디스플레이 주식회사 | 박막트랜지스터 기판 및 이를 구비한 디스플레이 장치 |
| JP7292163B2 (ja) | 2019-09-19 | 2023-06-16 | 株式会社ディスコ | 被加工物の加工方法 |
| KR102688604B1 (ko) * | 2019-11-04 | 2024-07-25 | 삼성디스플레이 주식회사 | 표시 장치 |
| JP7447432B2 (ja) * | 2019-11-05 | 2024-03-12 | 東京エレクトロン株式会社 | 基板を処理する装置、原料カートリッジ、基板を処理する方法、及び原料カートリッジを製造する方法 |
| KR20210089079A (ko) | 2020-01-06 | 2021-07-15 | 에이에스엠 아이피 홀딩 비.브이. | 채널형 리프트 핀 |
| CN111943175A (zh) * | 2020-07-29 | 2020-11-17 | 北海惠科光电技术有限公司 | 一种石墨烯薄膜和石墨烯材料的制作方法以及显示面板 |
| KR102890627B1 (ko) * | 2020-12-24 | 2025-11-25 | 삼성디스플레이 주식회사 | 표시 장치 및 표시 장치의 제조 방법 |
| US12439650B2 (en) * | 2021-01-15 | 2025-10-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | CMOS fabrication methods for back-gate transistor |
| CN117596917A (zh) * | 2022-08-19 | 2024-02-23 | 华为技术有限公司 | 折叠显示面板及其制备方法、电子设备 |
| CN115763206A (zh) * | 2022-11-15 | 2023-03-07 | 上海华力微电子有限公司 | 一种连接组件及应用其的刻蚀机 |
Family Cites Families (40)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11148078A (ja) | 1997-11-18 | 1999-06-02 | Sanyo Electric Co Ltd | アクティブマトリクス型液晶表示装置 |
| US7588989B2 (en) | 2001-02-02 | 2009-09-15 | Samsung Electronic Co., Ltd. | Dielectric multilayer structures of microelectronic devices and methods for fabricating the same |
| JP2002299632A (ja) | 2001-03-30 | 2002-10-11 | Sanyo Electric Co Ltd | 半導体装置及びアクティブマトリクス型表示装置 |
| KR100579194B1 (ko) | 2004-05-28 | 2006-05-11 | 삼성에스디아이 주식회사 | 유기 전계 발광 표시 소자의 제조방법 |
| KR101133753B1 (ko) | 2004-07-26 | 2012-04-09 | 삼성전자주식회사 | 감지 소자를 내장한 액정 표시 장치 |
| KR100700642B1 (ko) | 2004-12-13 | 2007-03-27 | 삼성에스디아이 주식회사 | 유기전계발광표시소자 및 그 제조방법 |
| US20060214154A1 (en) * | 2005-03-24 | 2006-09-28 | Eastman Kodak Company | Polymeric gate dielectrics for organic thin film transistors and methods of making the same |
| JP5148912B2 (ja) * | 2006-04-06 | 2013-02-20 | 株式会社半導体エネルギー研究所 | 液晶表示装置及び半導体装置、並びに電子機器 |
| JP2008203761A (ja) | 2007-02-22 | 2008-09-04 | Hitachi Displays Ltd | 表示装置 |
| TW200921225A (en) * | 2007-11-06 | 2009-05-16 | Au Optronics Corp | Transflective liquid crystal display panel |
| CN101452162A (zh) | 2007-12-07 | 2009-06-10 | 上海广电Nec液晶显示器有限公司 | 液晶显示面板中的阵列基板及其制造方法 |
| TWI445083B (zh) * | 2008-02-08 | 2014-07-11 | Tokyo Electron Ltd | Insulation film formation method, the computer can read the memory media and processing system |
| US20090278120A1 (en) * | 2008-05-09 | 2009-11-12 | Korea Institute Of Science And Technology | Thin Film Transistor |
| TWI380106B (en) * | 2008-08-01 | 2012-12-21 | Chunghwa Picture Tubes Ltd | Pixel structure and method for repairing the same |
| CN101847641B (zh) * | 2009-03-27 | 2011-12-28 | 京东方科技集团股份有限公司 | 阵列基板及其制造方法和宽视角液晶显示器 |
| US8115883B2 (en) | 2009-08-27 | 2012-02-14 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method for manufacturing the same |
| JP2011059157A (ja) * | 2009-09-07 | 2011-03-24 | Seiko Epson Corp | 液晶装置及び電子機器 |
| KR101097333B1 (ko) | 2010-02-11 | 2011-12-23 | 삼성모바일디스플레이주식회사 | 액정표시장치 |
| JP5437895B2 (ja) | 2010-04-20 | 2014-03-12 | 株式会社ジャパンディスプレイ | 表示装置及びその製造方法 |
| KR101710179B1 (ko) | 2010-06-03 | 2017-02-27 | 삼성디스플레이 주식회사 | 평판 표시 장치 및 그 제조 방법 |
| KR101824537B1 (ko) | 2010-10-01 | 2018-03-15 | 삼성디스플레이 주식회사 | 박막 트랜지스터 및 이를 포함하는 유기 발광 디스플레이 |
| KR20120060664A (ko) * | 2010-12-02 | 2012-06-12 | 삼성전자주식회사 | 표시 장치 및 표시 장치 제조 방법 |
| KR20120061312A (ko) | 2010-12-03 | 2012-06-13 | 삼성모바일디스플레이주식회사 | 유기 전계 발광 표시장치 및 그의 제조방법 |
| TW201224615A (en) * | 2010-12-06 | 2012-06-16 | Chunghwa Picture Tubes Ltd | Pixel array substrate and method of fabricating the same |
| KR20120124527A (ko) * | 2011-05-04 | 2012-11-14 | 삼성디스플레이 주식회사 | 표시 장치 및 표시 장치의 제조 방법 |
| TWI423310B (zh) | 2011-06-10 | 2014-01-11 | Au Optronics Corp | 畫素結構 |
| KR101878882B1 (ko) * | 2011-10-21 | 2018-07-17 | 엘지디스플레이 주식회사 | 나노 메쉬 투명 전극과 이의 제조방법, 나노 메쉬 투명 전극을 포함하는 터치 스크린 및 디스플레이 장치 |
| KR102025836B1 (ko) * | 2011-11-07 | 2019-09-27 | 삼성디스플레이 주식회사 | 박막 트랜지스터 어레이 기판, 이를 포함하는 유기 발광 표시 장치 및 그 제조 방법 |
| KR101945237B1 (ko) | 2012-06-01 | 2019-02-08 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 |
| CN108054175A (zh) * | 2012-08-03 | 2018-05-18 | 株式会社半导体能源研究所 | 半导体装置 |
| WO2014038482A1 (ja) * | 2012-09-05 | 2014-03-13 | シャープ株式会社 | 半導体装置およびその製造方法 |
| CN102981341A (zh) * | 2012-12-25 | 2013-03-20 | 信利半导体有限公司 | 薄膜晶体管液晶显示器 |
| TWI607510B (zh) * | 2012-12-28 | 2017-12-01 | 半導體能源研究所股份有限公司 | 半導體裝置及半導體裝置的製造方法 |
| US9178042B2 (en) * | 2013-01-08 | 2015-11-03 | Globalfoundries Inc | Crystalline thin-film transistor |
| CN103336396B (zh) * | 2013-06-28 | 2016-03-23 | 京东方科技集团股份有限公司 | 阵列基板及其制造方法和显示装置 |
| JP2015015440A (ja) * | 2013-07-08 | 2015-01-22 | ソニー株式会社 | 半導体装置およびその製造方法、並びに表示装置および電子機器 |
| KR20150021622A (ko) * | 2013-08-20 | 2015-03-03 | 삼성디스플레이 주식회사 | 표시패널 |
| TWI551926B (zh) * | 2014-01-27 | 2016-10-01 | 友達光電股份有限公司 | 畫素結構 |
| KR20160114510A (ko) * | 2015-03-24 | 2016-10-05 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 터치 패널 |
| US20170017327A1 (en) * | 2015-07-17 | 2017-01-19 | Innolux Corporation | Touch display device |
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2016
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2017
- 2017-01-18 WO PCT/US2017/013953 patent/WO2017136141A1/en not_active Ceased
- 2017-01-18 CN CN201780014750.6A patent/CN108700788B/zh active Active
- 2017-01-18 JP JP2018541182A patent/JP6966457B2/ja active Active
- 2017-01-18 KR KR1020187025600A patent/KR102717556B1/ko active Active
- 2017-01-20 US US15/411,724 patent/US10381454B2/en active Active
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| CN108700788A (zh) | 2018-10-23 |
| US20170229490A1 (en) | 2017-08-10 |
| US20170229554A1 (en) | 2017-08-10 |
| WO2017136141A1 (en) | 2017-08-10 |
| KR102717556B1 (ko) | 2024-10-14 |
| KR20180102207A (ko) | 2018-09-14 |
| JP2019507903A (ja) | 2019-03-22 |
| US10381454B2 (en) | 2019-08-13 |
| CN108700788B (zh) | 2022-09-30 |
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