WO2017136141A1 - Interface engineering for high capacitance capacitor for liquid crystal display - Google Patents

Interface engineering for high capacitance capacitor for liquid crystal display Download PDF

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Publication number
WO2017136141A1
WO2017136141A1 PCT/US2017/013953 US2017013953W WO2017136141A1 WO 2017136141 A1 WO2017136141 A1 WO 2017136141A1 US 2017013953 W US2017013953 W US 2017013953W WO 2017136141 A1 WO2017136141 A1 WO 2017136141A1
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WIPO (PCT)
Prior art keywords
electrode
layer
substrate
dielectric layer
common electrode
Prior art date
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PCT/US2017/013953
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English (en)
French (fr)
Inventor
Xuena Zhang
Dong-Kil Yim
Wenqing DAI
Harvey You
Tae Kyung Won
Hsiao-Lin Yang
Wan-Yu Lin
Yun-Chu Tsai
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Applied Materials Inc
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Applied Materials Inc
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Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to KR1020187025600A priority Critical patent/KR102717556B1/ko
Priority to JP2018541182A priority patent/JP6966457B2/ja
Priority to CN201780014750.6A priority patent/CN108700788B/zh
Publication of WO2017136141A1 publication Critical patent/WO2017136141A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
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    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
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    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
    • H10D30/6737—Thin-film transistors [TFT] characterised by the electrodes characterised by the electrode materials
    • H10D30/6739—Conductor-insulator-semiconductor electrodes
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    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
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    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/1368—Active matrix addressed cells in which the switching element is a three-electrode device
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    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
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    • H10D86/451—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs characterised by the compositions or shapes of the interlayer dielectrics
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    • H10D86/481—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs integrated with passive devices, e.g. auxiliary capacitors
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    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
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    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
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    • H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02172—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides
    • H01L21/02175—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal
    • H01L21/02192—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal the material containing at least one rare earth metal element, e.g. oxides of lanthanides, scandium or yttrium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02172—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides
    • H01L21/02175—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal
    • H01L21/02194—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal the material containing more than one metal element
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H10K59/1216—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being capacitors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/124—Insulating layers formed between TFT elements and OLED elements

Definitions

  • Embodiments of the present disclosure generally relate to forming a pixel capacitor structure with high capacitance and low leakage. More particularly, embodiments of the disclosure relate to methods for forming a pixel capacitor structure with high capacitance and low leakage for liquid crystal display (LCD) applications.
  • LCD liquid crystal display
  • Display devices have been widely used for a wide range of electronic applications, such as TV, monitors, mobile phone, MP3 players, e-book readers, and personal digital assistants (PDAs) and the like.
  • the display device is generally designed for producing desired image by applying an electric field to a liquid crystal that fills a gap between two substrates ⁇ e.g., a pixel electrode and a common electrode) and has anisotropic dielectric constant that controls the intensity of the dielectric field.
  • a liquid crystal that fills a gap between two substrates ⁇ e.g., a pixel electrode and a common electrode
  • anisotropic dielectric constant that controls the intensity of the dielectric field.
  • a variety of different display devices such as active matrix liquid crystal display (AMLCD) or an active matrix organic light emitting diodes (AMOLED), may be employed as light sources for display devices which utilize touch screen panels.
  • AMLCD active matrix liquid crystal display
  • AMOLED active matrix organic light emitting diodes
  • TFT devices an electronic device with high electron mobility, low leakage current and high breakdown voltage, would allow more pixel area for light transmission and integration of circuitry, thereby resulting in a brighter display, higher overall electrical efficiency, faster response time and higher resolution displays.
  • a dielectric layer is placed between a pixel electrode and a common electrode to form a capacitor that may store electric charges when the TFT devices are in operation.
  • the capacitor as formed is required to have high capacitance as well as low leakage to provide desired electrical performance of the TFT devices.
  • the capacitance may be adjusted by changing of the dielectric constant of the dielectric layer formed between the pixel electrode and the common electrode and/or thickness of the dielectric layer. For example, when the dielectric layer is replaced with a material having a higher dielectric constant, the capacitance of the capacitor will increase as well.
  • selection of the material of the dielectric layer not only affects the capacitance of the capacitor, incompatibility of the material of the dielectric layer to the electrodes (either to the pixel electrode or to the common electrode) may also result in film structure peeling, poor interface adhesion, or interface material diffusion, which may eventually lead to device failure and low product yield.
  • a thin film transistor structure includes a capacitor formed in a thin film transistor device.
  • the capacitor further includes a common electrode disposed on a substrate, a dielectric layer formed on the common electrode and a pixel electrode formed on the dielectric layer.
  • An interface protection layer formed between the common electrode and the dielectric layer, or between the dielectric layer and the pixel electrode.
  • a method for forming a capacitor structure on a substrate for thin film transistor applications includes forming a common electrode on a substrate utilized to form thin film transistor devices, forming a dielectric layer on the common electrode and forming a pixel electrode on the dielectric layer.
  • An interface protection layer is formed between the common electrode and the dielectric layer, or between the dielectric layer and the pixel electrode.
  • a method for forming an insulating layer on a substrate for thin film transistor applications includes forming a high-k layer on a substrate by an atomic layer deposition process or a hybrid process including atomic layer deposition and chemical vapor deposition process, wherein the high-k layer is an gate insulating layer, a passivation layer, a capacitor, an interlayer insulator, an etch stop layer in a thin film transistor device.
  • Figure 1 depicts a sectional view of a processing chamber that may be used to deposit a dielectric layer in accordance with one embodiment of the present disclosure
  • Figure 2 depicts a sectional view of a processing chamber that may be used to deposit a metal layer in accordance with one embodiment of the present disclosure
  • Figure 3 depicts a process flow diagram of one embodiment of a method of forming a portion of a TFT device structure
  • Figure 4 is a sectional view of one example of a thin film transistor device structure
  • Figures 5A-5C depict different examples of film structures that may be utilized in the thin film transistor of Figure 4;
  • Figures 6A-6C depict different examples of film structures that may be utilized in the thin film transistor of Figure 4.
  • Figure 7 depicts a sectional view of a processing chamber that may be used to deposit a high-k material in accordance with one embodiment of the present disclosure.
  • Embodiments of the disclosure generally provide methods of forming a capacitor with enhanced electrical performance, such as high capacitance and low leakage, or an insulating layer with high dielectric constant for display devices.
  • the capacitor formed in the display devices may include a dielectric layer formed between a pixel electrode and a common electrode.
  • the dielectric layer may be a high-k dielectric material having a dielectric constant greater than 8.
  • an interface protection layer may be formed between the pixel electrode and the dielectric layer and/or between the common electrode and the dielectric layer.
  • Such capacitor structure may efficiently enhance the electrical performance of transistor and diode devices with good interface adhesion control.
  • any insulating layer with high dielectric constant such as an gate insulating layer, etching stop layer or an interface protection layer, may also utilize a high dielectric constant material for electric performance enhancement and improvement.
  • FIG. 1 is a schematic cross-section view of one embodiment of a plasma enhanced chemical vapor deposition (PECVD) chamber (processing chamber) 100 in which a dielectric layer, such as an insulating layer, a gate insulating layer, an etch stop layer, a passivation layer, an interlayer insulator, a dielectric layer for capacitor or passivation layer in a TFT device structure, may be deposited.
  • PECVD plasma enhanced chemical vapor deposition
  • One suitable plasma enhanced chemical vapor deposition chamber is available from Applied Materials, Inc., located in Santa Clara, CA. It is contemplated that other deposition chambers, including those from other manufacturers, may be utilized to practice the present disclosure.
  • the chamber 100 generally includes walls 142, a bottom 104 and a lid 1 12 which bound a process volume 106.
  • a gas distribution plate 1 10 and substrate support assembly 130 are disposed with in a process volume 106.
  • the process volume 106 is accessed through a valve 108 formed through the wall 142 such that a substrate 102 may be transferred in to and out of the chamber 100.
  • the substrate support assembly 130 includes a substrate receiving surface 132 for supporting the substrate 102 thereon.
  • a stem 134 couples the substrate support assembly 130 to a lift system 136 which raises and lowers the substrate support assembly 130 between substrate transfer and processing positions.
  • a shadow frame 133 may be optionally placed over periphery of the substrate 102 when processing to prevent deposition on the edge of the substrate 102.
  • Lift pins 138 are moveably disposed through the substrate support assembly 130 and are adapted to space the substrate 102 from the substrate receiving surface 132.
  • the substrate support assembly 130 may also include heating and/or cooling elements 139 utilized to maintain the substrate support assembly 130 at a desired temperature.
  • the substrate support assembly 130 may also include grounding straps 131 to provide an RF return path around the periphery of the substrate support assembly 130.
  • the gas distribution plate 1 10 is coupled at its periphery to a lid 1 12 or wall 142 of the chamber 100 by a suspension 1 14.
  • the gas distribution plate 1 10 may also be coupled to the lid 1 12 by one or more center supports 1 16 to help prevent sag and/or control the straightness/curvature of the gas distribution plate 1 10.
  • the gas distribution plate 1 10 may have different configurations with different dimensions. In an exemplary embodiment, the gas distribution plate 1 10 has a quadrilateral plan shape.
  • the gas distribution plate 1 10 has a downstream surface 150 having a plurality of apertures 1 1 1 formed therein facing an upper surface 1 18 of the substrate 102 disposed on the substrate support assembly 130.
  • the apertures 1 1 1 may have different shapes, number, densities, dimensions, and distributions across the gas distribution plate 1 10. In one embodiment, a diameter of the apertures 1 1 1 may be selected between about 0.01 inch and about 1 inch.
  • a gas source 120 is coupled to the lid 1 12 to provide gas through the lid 1 12 and then through the apertures 1 1 1 formed in the gas distribution plate 1 10 to the process volume 106.
  • a vacuum pump 109 is coupled to the chamber 100 to maintain the gas in the process volume 106 at a desired pressure.
  • An RF power source 122 is coupled to the lid 1 12 and/or to the gas distribution plate 1 10 to provide a RF power that creates an electric field between the gas distribution plate 1 10 and the substrate support assembly 130 so that a plasma may be generated from the gases present between the gas distribution plate 1 10 and the substrate support assembly 130.
  • the RF power may be applied at various RF frequencies. For example, RF power may be applied at a frequency between about 0.3 MHz and about 200 MHz. In one embodiment the RF power is provided at a frequency of 13.56 MHz.
  • the edges of the downstream surface 150 of the gas distribution plate 1 10 may be curved so that a spacing gradient is defined between the edge and corners of the gas distribution plate 1 10 and substrate receiving surface 132 and, consequently, between the gas distribution plate 1 10 and the upper surface 1 18 of the substrate 102.
  • the shape of the downstream surface 150 may be selected to meet specific process requirements.
  • the shape of the downstream surface 150 may be convex, planar, concave or other suitable shape. Therefore, the edge to corner spacing gradient may be utilized to tune the film property uniformity across the edge of the substrate, thereby correcting property non-uniformity in films disposed in the corner of the substrate.
  • edge to center spacing may also be controlled so that the film property distribution uniformity may be controlled between the edge and center of the substrate.
  • a concave curved edge of the gas distribution plate 1 10 may be used so the center portion of the edge of the gas distribution plate 1 10 is spaced farther from the upper surface 1 18 of the substrate 102 than the corners of the gas distribution plate 1 10.
  • a convex curved edge of the gas distribution plate 1 10 may be used so that the corners of the gas distribution plate 1 10 are spaced farther than the edges of the gas distribution plate 1 10 from the upper surface 1 18 of the substrate 102.
  • a remote plasma source 124 such as an inductively coupled remote plasma source, may also be coupled between the gas source and the gas distribution plate 1 10.
  • a cleaning gas may be energized in the remote plasma source 124 to remotely provide plasma utilized to clean chamber components.
  • the cleaning gas entering the process volume 106 may be further excited by the RF power provided to the gas distribution plate 1 10 by the power source 122.
  • Suitable cleaning gases include, but are not limited to, NF 3 , F 2 , and SF 6 .
  • the substrate 102 that may be processed in the chamber 100 may have a surface area of 10,000 cm 2 or more, such as 25,000 cm 2 or more, for example about 55,000 cm 2 or more. It is understood that after processing the substrate may be cut to form smaller other devices.
  • the heating and/or cooling elements 139 may be set to provide a substrate support assembly temperature during deposition of about 600 degrees Celsius or less, for example between about 100 degrees Celsius and about 500 degrees Celsius, or between about 200 degrees Celsius and about 500 degrees Celsius, such as about 300 degrees Celsius and 500 degrees Celsius.
  • the nominal spacing during deposition between the upper surface 1 18 of the substrate 102 disposed on the substrate receiving surface 132 and the gas distribution plate 1 10 may generally vary between 400 mil and about 1 ,200 mil, such as between 400 mil and about 800 mil, or other distance required to obtain desired deposition results.
  • the spacing between the center portion of the edge of the gas distribution plate 1 10 and the substrate receiving surface 132 is between about 400 mils and about 1400 mils, and the spacing between the corners of the gas distribution plate 1 10 and the substrate receiving surface 132 is between about 300 mils and about 1200 mils.
  • FIG. 2 illustrates an exemplary reactive sputter processing chamber 200 suitable for forming an interface protection layer and/or metal electrode, such as a pixel electrode or a common electrode, according to one embodiment of the invention.
  • the processing chamber 200 may be part of a vacuum processing system having multiple processing chambers 200.
  • One example of the process chamber that may be adapted to benefit from the invention is a physical vapor deposition (PVD) process chamber, available from Applied Materials, Inc., located in Santa Clara, California. It is contemplated that other sputter process chambers, including those from other manufactures, may be adapted to practice the present invention.
  • PVD physical vapor deposition
  • the processing chamber 200 includes a chamber body 208 having a processing volume 218 defined therein and enclosed by a lid assembly 204.
  • the chamber body 208 has sidewalls 210 and a bottom 246.
  • the dimensions of the chamber body 208 and related components of the process chamber 200 are not limited and generally are proportionally larger than the size of a substrate, such as the substrate 102 of Figure 1 , to be processed therein.
  • any suitable substrate size may be processed in a suitable sized process chamber. Examples of suitable substrate sizes include substrates having a plan surface area of about 2000 or more square centimeters.
  • the chamber body 208 may be fabricated from aluminum or other suitable material.
  • a substrate access port 230 is formed through the sidewall 210 of the chamber body 208, facilitating the transfer of the substrate 102 (i.e., a solar panel or a flat panel display substrate, a plastic or flexible substrate, a semiconductor wafer, or other workpiece) into and out of the process chamber 200.
  • the access port 230 may be coupled to a transfer chamber and/or other chambers of a substrate processing system.
  • a gas source 228 is coupled to the chamber body 208 to supply process gases into the processing volume 218.
  • process gases that may be provided by the gas source 228 include inert gases, non-reactive gases, and reactive gases.
  • process gases provided by the gas source 228 may include, but not limited to, argon gas (Ar), helium (He), nitrogen gas (N 2 ), oxygen gas (O2), and H 2 O, among others.
  • a pumping port 250 is formed through the bottom 246 of the chamber body 208.
  • a pumping device 252 is coupled to the process volume 218 to evacuate and control the pressure therein. In one embodiment, the pressure level of the process chamber 200 may be maintained at about 1 Torr or less.
  • the lid assembly 204 generally includes a target 220 and a ground shield assembly 226 coupled or positioned proximate thereto.
  • the target 220 provides a material source that can be sputtered and deposited onto the surface of the substrate 102 during a PVD process.
  • the target 220 or target plate may be fabricated from a material utilized as a deposition specie.
  • a high voltage power supply such as a power source 232, is connected to the target 220 to facilitate sputtering materials from the target 220.
  • the target 220 may be fabricated from a metal containing material, such as titanium (Ti), tantalum (Ta), magnesium (Mg), silver (Si), indium (In), tin (Sn), indium tin oxide (ITO), indium tin oxide (ITO), indium zinc oxide (IZO), indium tin zinc oxide (ITZO), aluminum (Al), tungsten (W), gold (Au), molybdenum (Mo), mercury (Hg), chromium (Cr), metal, metal alloy or other suitable materials.
  • the target 220 may be fabricated by materials including indium tin alloy and the like.
  • the target 220 generally includes a peripheral portion 224 and a central portion 216.
  • the peripheral portion 224 is disposed over the sidewalls 210 of the chamber 200.
  • the central portion 216 of the target 220 may have a curvature surface slightly extending towards the surface of the substrate 102 disposed on a substrate support 238.
  • the spacing between the target 220 and the substrate support 238 is maintained between about 50 mm and about 150 mm. It is noted that the dimension, shape, materials, configuration and diameter of the target 220 may be varied for specific process or substrate requirements.
  • the target 220 may further include a backing plate having a central portion bonded and/or fabricated from a material desired to be sputtered onto the substrate surface.
  • the target 220 may also include a plurality of tiles or segment materials that together form the target.
  • the lid assembly 204 may further comprise a magnetron assembly 202 mounted above the target 220 which enhances efficient sputtering of material from the target 220 during processing.
  • the magnetron assembly include a linear magnetron, a serpentine magnetron, a spiral magnetron, a double-digitated magnetron, a rectangularized spiral magnetron, among others.
  • the ground shield assembly 226 of the lid assembly 204 includes a ground frame 206 and a ground shield 212.
  • the ground shield assembly 226 may also include other chamber shield members, target shield member, dark space shield, and dark space shield frame.
  • the ground shield 212 is coupled to the peripheral portion 224 by the ground frame 206 defining an upper processing region 254 below the central portion 216 of the target 220 in the process volume 218.
  • the ground frame 206 electrically insulates the ground shield 212 from the target 220 while providing a ground path to the chamber body 208 of the process chamber 200 through the sidewalls 210.
  • the ground shield 212 constrains plasma generated during processing within the upper processing region 254 so that dislodged target source material from the central portion 216 of the target 220 is mainly deposited on the substrate surface rather than chamber sidewalls 210.
  • the ground shield 212 may be formed by one or more components.
  • the lift mechanism 244 is configured to move the substrate support 238 between a lower transfer position and an upper processing position.
  • a bellows 242 circumscribes the shaft 240 and is coupled to the substrate support 238 to provide a flexible seal therebetween, thereby maintaining vacuum integrity of the chamber processing volume 218.
  • a shadow frame 222 is disposed on the periphery region of the substrate support 238 and is configured to confine deposition of source material sputtered from the target 220 to a desired portion of the substrate surface.
  • the shadow frame 222 is suspended above the substrate support 238 from a lip 256 of a chamber shield 236 that extends from the sidewall 210 of the chamber body 208.
  • an outer edge of the substrate 102 disposed on the substrate support 238 contacts the shadow frame 222, causing the shadow frame 222 to be lifted and spaced away from the chamber shield 236.
  • lift pins are selectively moved through the substrate support 238 to lift the substrate 102 above the substrate support 238 to facilitate access to the substrate 102 by a transfer robot or other suitable transfer mechanism.
  • a controller 248 is coupled to the processing chamber 200 and, optionally, the processing chamber 100.
  • the controller 248 includes a central processing unit (CPU) 260, a memory 258, and support circuits 262.
  • the controller 248 is utilized to control the process sequence, regulating the gas flows from the gas source 228 into the chamber 200 and controlling ion bombardment of the target 220.
  • the CPU 260 may be of any form of a general purpose computer processor that can be used in an industrial setting.
  • the software routines can be stored in the memory 258, such as random access memory, read only memory, floppy or hard disk drive, or other form of digital storage.
  • the support circuits 262 are conventionally coupled to the CPU 260 and may comprise cache, clock circuits, input/output subsystems, power supplies, and the like.
  • the software routines when executed by the CPU 260, transform the CPU into a specific purpose computer (controller) 248 that controls the processing chamber 200 such that the processes are performed in accordance with the present invention.
  • the software routines may also be stored and/or executed by a second controller (not shown) that is located remotely from the chamber 200.
  • the target 220 and the substrate support 238 are biased relative to each other by the power source 232 to maintain a plasma formed from the process gases supplied by the gas source 228.
  • the ions from the plasma are accelerated toward and strike the target 220, causing target material to be dislodged from the target 220.
  • the dislodged target material forms a layer on the substrate 102.
  • certain process gases are supplied into the chamber 200, the dislodged target material and the process gases present in the chamber 200 react to forms a composite film on the substrate 102.
  • FIG 7 is a schematic cross sectional view of an ALD (atomic layer deposition) chamber 700 that may be used to perform a deposition described herein.
  • the ALD deposition process may be utilized to form a dielectric layer, such as an insulating layer, a gate insulating layer, an etch stop layer, an interlayer insulator, a dielectric layer for capacitor or passivation layer in a TFT device structure as described herein.
  • the chamber 700 generally includes a chamber body 702, a lid assembly 704, a substrate support assembly 706, and a process kit 750.
  • the lid assembly 704 is disposed on the chamber body 702, and the substrate support assembly 706 is at least partially disposed within the chamber body 702.
  • the chamber body 702 includes a slit valve opening 708 formed in a sidewall thereof to provide access to the interior of the processing chamber 700.
  • the chamber body 702 includes one or more apertures that are in fluid communication with a vacuum system (e.g., a vacuum pump). The apertures provide an egress for gases within the chamber 700.
  • the vacuum system is controlled by a process controller to maintain a pressure within the ALD chamber 700 suitable for ALD processes.
  • the lid assembly 704 may include one or more differential pumps and purge assemblies 720.
  • the differential pump and purge assemblies 720 are mounted to the lid assembly 704 with bellows 722.
  • the bellows 722 allow the pump and purge assemblies 720 to move vertically with respect to the lid assembly 704 while still maintaining a seal against gas leaks.
  • a compliant first seal 786 and a compliant second seal 788 on the process kit 750 are brought into contact with the differential pump and purge assemblies 720.
  • the differential pump and purge assemblies 720 are connected with a vacuum system (not shown) and maintained at a low pressure.
  • the lid assembly 704 includes a RF cathode 710 that can generate a plasma of reactive species within the chamber 700 and/or within the process kit 750.
  • the RF cathode 710 may be heated by electric heating elements (not shown), for example, and cooled by circulation of cooling fluids, for example.
  • Any power source capable of activating the gases into reactive species and maintaining the plasma of reactive species may be used.
  • RF or microwave (MW) based power discharge techniques may be used.
  • the activation may also be generated by a thermally based technique, a gas breakdown technique, a high intensity light source (e.g., UV energy), or exposure to an x-ray source.
  • the substrate support assembly 706 can be at least partially disposed within the chamber body 702.
  • the substrate support assembly 706 can include a substrate support member or susceptor 730 to support a substrate 732 for processing within the chamber body.
  • the susceptor 730 may be coupled to a substrate lift mechanism (not shown) through a shaft 724 or shafts 724 which extend through one or more openings 726 formed in a bottom surface of the chamber body 702.
  • the substrate lift mechanism can be flexibly sealed to the chamber body 702 by a bellows 728 that prevents vacuum leakage from around the shafts 724.
  • the substrate lift mechanism allows the susceptor 730 to be moved vertically within the ALD chamber 700 between a lower robot entry position, as shown, and processing, process kit transfer, and substrate transfer positions. In some embodiments, the substrate lift mechanism moves between fewer positions than those described.
  • the substrate 732 may be secured to the susceptor using a vacuum chuck (not shown), an electrostatic chuck (not shown), or a mechanical clamp (not shown).
  • the temperature of the susceptor 730 may be controlled (by, e.g., a process controller) during processing in the ALD chamber 700 to influence temperature of the substrate 732 and the process kit 750 to improve performance of the ALD processing.
  • the susceptor 730 may be heated by, for example, electric heating elements (not shown) within the susceptor 730.
  • the temperature of the susceptor 730 may be determined by pyrometers (not shown) in the chamber 700, for example.
  • the susceptor 730 can include one or more bores 734 through the susceptor 730 to accommodate one or more lift pins 736.
  • Each lift pin 736 is mounted so that they may slide freely within a bore 734.
  • the support assembly 706 is movable such that the upper surface of the lift pins 736 can be located above the substrate support surface 738 of the susceptor 730 when the support assembly 706 is in a lower position.
  • the upper surface of the lift pins 736 is located below the upper surface 738 of the susceptor 730 when the support assembly 706 is in a raised position.
  • the lift pins 736 push against a lower surface of the substrate 732, lifting the substrate off the susceptor 730.
  • the susceptor 730 may raise the substrate 732 off of the lift pins 736.
  • the susceptor 730 includes process kit insulation buttons 737 that may include one or more compliant seals 739.
  • the process kit insulation buttons 737 may be used to carry the process kit 750 on the susceptor 730.
  • the one or more compliant seals 839 in the process kit insulation buttons 737 are compressed when the susceptor lifts the process kit 850 into the processing position.
  • Figure 3 depicts a flow diagram of one embodiment of a process 300 for forming a capacitor or an insulating layer suitable for use in thin-film transistor devices.
  • Suitable examples of the insulating layer used in thin-film transistor devices include a gate insulating layer, an interface layer, a dielectric layer utilized to form a capacitor, an etch stop layer or a passivation layer where an insulating material is needed.
  • the capacitor may include a dielectric layer or an insulating layer formed between a pixel electrode and a common electrode.
  • the dielectric layer or the insulating layer may be formed by a plasma enhanced chemical vapor deposition (PECVD) process, which may be practiced in the processing chamber 100, as described in Figure 1 , or an atomic layer deposition (ALD) process, which may be practiced in the processing chamber 700, as described in Figure 7, or other suitable processing chamber.
  • PECVD plasma enhanced chemical vapor deposition
  • ALD atomic layer deposition
  • the pixel electrode and the common electrode may be formed by a physical vapor deposition (PVD) process, which may be practiced in the processing chamber 200, as described in Figure 2.
  • the process 300 begins at operation 302 by providing the substrate 102 in a processing chamber, such as the processing chamber 200 (a PVD chamber) depicted in Figure 2.
  • the substrate 102 may include a TFT device partly formed thereon readily to form a common electrode on the substrate 102.
  • the substrate 102 may include a planar surface 419 of a planarization layer 418 that ready to have a common electrode 420 to be formed thereon.
  • the common electrode 420 along with a dielectric layer 424 (or called an insulating layer) and a pixel electrode 426, as indicated by the circle 460, may together form a capacitor 427 in the TFT device structure 450, which will be later described in detail regarding variations of the structures of the capacitor 427 in Figures 5A-5C at different manufacturing stage of process 300. It is noted that the material utilized to form the dielectric layer 424 ( or the insulating layer) may also be utilized to form as other layers that require insulating materials in the TFT device structure 450. [0051] In the example depicted in Figure 4, the TFT device 450 formed on the substrate 102 comprises a low temperature polysilicon (LTPS) TFT device.
  • LTPS low temperature polysilicon
  • the substrate 102 may have different combination of films, structures or layers previously formed thereon to facilitate forming different device structures or different film stack on the substrate 102.
  • the substrate 102 may be any one of glass substrate, plastic substrate, polymer substrate, metal substrate, singled substrate, roll-to-roll substrate, or other suitable transparent substrate suitable for forming a thin film transistor thereon.
  • the LTPS TFT devices 450 are MOS devices built with a source region 409a, channel region 408, and drain region 409b formed on the optically transparent substrate 402 with or without an optional insulating layer 404 disposed thereon.
  • the source region 409a, channel region 408, and drain region 409b are generally formed from an initially deposited amorphous silicon (a-Si) layer that is typically later thermal or laser processed to form a polysilicon layer.
  • a-Si amorphous silicon
  • the source, drain and channel regions 409a, 408, 409b can be formed by patterning areas on the optically transparent substrate 402 and ion doping the deposited initial a-Si layer, which is then thermally or laser processed ⁇ e.g., an Excimer Laser Annealing process) to form the polysilicon layer.
  • a gate insulating layer 406 is then deposited on top of the deposited polysilicon layer(s) to isolate a gate electrode 414 from the channel region 408, source region 409a and drain regions 409b.
  • the gate electrode 414 is formed on top of the gate insulating layer 406.
  • the gate insulating layer 406 is also commonly known as a gate oxide layer.
  • An interlayer insulator 412 and device connections are then made through the insulating layer to allow control of the TFT devices.
  • a source-drain metal electrode layer 410a, 410b is then deposited, formed and patterned in the interlayer insulator 412 electrically connected to the source region 409a and drain regions 409b.
  • the planarization layer 418 is then formed over the source-drain metal electrode layer 410a, 410b to provide a planar surface 419 where a common electrode 420 may be later formed thereon and patterned.
  • the planarization layer 418 may be fabricated from polyimide, benzocyclobutene- series resin, spin on glass (SOG) or acrylate.
  • the planarization layer 418 is later patterned to form a via contact hole 421 that allows the common electrode 420 ⁇ e.g., a beginning step of process 300 to provide a metal material) along with a dielectric layer 424 and/or a pixel electrode 426 to be sequentially filled therein. It is noted that the structure shown in Figure 4 is just an exemplary embodiment of the TFT device 450.
  • the via contact hole 421 may be filled partly or fully by the common electrode 420, the dielectric layer 424 or the pixel electrode 426 in any configuration as needed.
  • the capacitor 427 ⁇ e.g., a MIM (metal-insulating-metal) structure
  • other insulating layer 428 such as an organic layer or a liquid crystal layer, may be formed on the structure of the capacitor 427 to further complete the structure of the device 450.
  • the process 300 of Figure 3 describes the process sequence of forming the capacitor 427, including the common electrode 420, the dielectric layer 424 and the pixel electrode 426, on the substrate 102.
  • a physical vapor deposition process is performed to form the common electrode 420 ⁇ e.g., a first metal layer) on the substrate 102, as shown in Figure 5A.
  • the common electrode 420, the dielectric layer 424 and the pixel electrode 426 shown in Figures 5A-5C are equivalent to the common electrode 420, the dielectric layer 424 and the pixel electrode 426 shown in Figure 4.
  • the common electrode 420 formed on the substrate 102 is fabricated from a suitable metallic materials, such as indium tin oxide (ITO), indium zinc oxide (IZO), indium tin zinc oxide (ITZO), aluminum (Al), tungsten (W), chromium (Cr), tantalum (Ta), titanium (Ti), molybdenum (Mo), magnesium (Mg), silver (Ag), gold (Au), chromium (Cr), alloys thereof or combination thereof.
  • the common electrode 420 is an indium tin zinc oxide (ITO) layer.
  • the common electrode 420 may be patterned in any form or in any manner as needed prior to forming the dielectric layer 424 thereon as described at operation 306.
  • the dielectric layer 424 is then formed on the substrate 102, as shown in Figure 5A.
  • the dielectric layer 424 may be formed on the substrate 102 by transferring the substrate 102 to a deposition chamber, such as the plasma enhanced chemical vapor deposition chamber 100 depicted in Figure 1 , to perform a chemical vapor deposition process on the substrate 102.
  • the dielectric layer 424 may be a single layer fabricated by a high-k material, e.g., a dielectric material having a dielectric constant greater than 8.
  • a high-k material layer include hafnium dioxide (Hf0 2 ), hafnium oxynitride (HfON), zirconium dioxide (Zr0 2 ), zirconium oxynitride (ZrON), aluminum oxide (AI2O3), aluminum oxynitride (AION), hafnium silicon oxide (HfSi0 2 ), hafnium aluminum oxide (HfAIO), zirconium silicon oxide (ZrSi0 2 ), tantalum dioxide (Ta 2 0 5 ), aluminum oxide, Y2O3, La 2 03, titanium oxide (T1O2), aluminum doped hafnium dioxide, bismuth strontium titanium (BST), and platinum zirconium titanium (PZT), among others.
  • Hf0 2 hafnium oxynitride
  • the dielectric layer 424 may be fabricated by a CVD process, a ALD process or any suitable deposition processes.
  • the high-k material of the dielectric layer 424 may be fabricated by a ALD process in a ALD chamber, such as the processing chamber 700 depicted in Figure 7.
  • a high dielectric constant may be formed in the structure of the capacitor 427 and, thus, a high capacitance may be obtained as capacitance of the capacitor increases as the dielectric constant of the dielectric layer formed in the capacitor increases.
  • High capacitance provided by the dielectric layer 424 may improve the electrical performance of the TFT devices 450 while reducing the undesired current leakage and tunneling effect.
  • the capacitance of the capacitor 427 with high-k material dielectric layer 424 may be enhanced and improved as compared to using a conventional silicon nitride or silicon oxide layer as the dielectric layer in a capacitor.
  • the dielectric layer 424 formed on the substrate 102 may be in form of composite structures having multiple layers, as shown in Figure 5B.
  • the dielectric layer 424 may include a bulk dielectric material 504 sandwiched between a top interface protection layer 506 and a bottom interface protection layer 502.
  • the top interface protection layer 506 may be in contact with the pixel electrode 426 later formed thereon while the bottom interface protection layer 502 may be formed in contact with the common electrode 420.
  • the bulk dielectric material 504 may be fabricated by a silicon nitride material (SiN) or a high-k material while the top and the bottom interface protection layer 506, 502 may be silicon containing dielectric materials, such as silicon oxide (S1O2), silicon oxynitride (SiON), silicon oxycarbide (SiOC), silicon carbide (SiC) and the like.
  • the top and the bottom interface protection layer 506, 502 may be a silicon oxynitride (SiON) material when the bulk dielectric material 504 is a silicon nitride material (SiN).
  • top and the bottom interface protection layer 506, 502 may be a silicon oxide material (S1O2) or silicon oxynitride (SiON) when the bulk dielectric material 504 is a high-k material, as the dielectric layer 424 as depicted in Figure 5A.
  • the top and the bottom interface protection layers 506, 502 may be formed by a CVD deposition process.
  • the top interface protection layer 506 may be formed by oxidizing, oxygen ion implantation or oxygen surface treatment on the bulk dielectric material 504 by an oxygen containing gas, such as O2, O3 or H 2 O, when the bulk dielectric material 504 is a silicon nitride material (SiN) so as to oxidize the surface of the silicon nitride from the bulk dielectric material 504 into a silicon oxynitride layer.
  • top and the bottom interface protection layers 506, 502 formed between the pixel electrode 426 and the common electrode 420 may assist bridging the bulk dielectric material 504 to the top and/or the bottom interface protection layers 506, 502 so as to enhance the adhesion of the structure of the capacitor 427 without film peeling concerns. Furthermore, the top and the bottom interface protection layers 506, 502 may also serve as a thermal stable interface structure so as to reduce leakage from the metallic pixel and common electrodes 426, 420. [0064]
  • the top and/or the bottom interface protection layers 506, 502 may be formed in the same processing chamber where the bulk dielectric material 504 (a silicon nitride material or a high-k material) is formed. Alternatively, the top and/or the bottom interface protection layers 506, 502 may be formed in any suitable chambers as needed.
  • the pixel electrode 426 ⁇ e.g., a second metal layer
  • the pixel electrode 426 may be fabricated from any suitable metallic materials, such as indium tin oxide (ITO), indium zinc oxide (IZO), indium tin zinc oxide (ITZO), aluminum (Al), tungsten (W), chromium (Cr), tantalum (Ta), titanium (Ti), molybdenum (Mo), magnesium (Mg), silver (Ag), gold (Au), chromium (Cr), alloys thereof or combination thereof.
  • the pixel electrode 426 may also be formed by a physical vapor deposition process (PVD) performed in a plasma deposition chamber such as the process chamber 200 depicted in Figure 2.
  • PVD physical vapor deposition process
  • the pixel electrode 426 may be in form of a single layer formed by a metallic material discussed above in this paragraph, as shown in Figures 5A-5B.
  • the pixel electrode 426 may be in form of a composite structure having multiple materials, such as first metal electrode 508 with a second metal electrode 510 formed thereon, as shown in Figure 5C.
  • the first electrode 508 and the second electrode 510 may be a metal material selected from indium tin oxide (ITO), indium zinc oxide (IZO), indium tin zinc oxide (ITZO), aluminum (Al), tungsten (W), chromium (Cr), tantalum (Ta), titanium (Ti), molybdenum (Mo), magnesium (Mg), silver (Ag), gold (Au), chromium (Cr), silver nano ink, carbon nano tube (CNT), silver nano ink, graphene or alloys thereof.
  • the first electrode 508 is an ITO layer and the second electrode 510 may be a metal layer selected from Ta, Ti, Al, Mg, Mo, W, Ag, Mg or alloys thereof.
  • the first electrode 508 may be a metal layer of Ta, Ti, Al, Mg, Mo, W, Ag, Mg or alloys thereof and the second electrode 510 may be an ITO layer.
  • the second electrode 510 may be patterned to be in the form of a mesh or grid electrode formed on the first electrode 508.
  • the pixel electrode 426 and/or the common electrode 420 may be also be in form of a mesh or grid electrode as needed.
  • the high-k material e.g., a dielectric material having a dielectric constant greater than 8
  • the high-k material may also be utilized to form as an insulating material in other locations or places of the TFT devices 450.
  • the high-k material may also be utilized to form the optional insulating layer 404, the gate insulating layer 406 or the interlayer insulator 412, as indicated by the circle 452 in Figure 4.
  • suitable examples of the high-k material layer include hafnium dioxide (Hf0 2 ), hafnium oxynitride (HfON), zirconium dioxide (Zr0 2 ), zirconium oxynitride (ZrON), aluminum oxide (Al 2 0 3 ), aluminum oxynitride (AION), hafnium silicon oxide (HfSi0 2 ), hafnium aluminum oxide (HfAIO), zirconium silicon oxide (ZrSi0 2 ), tantalum dioxide (Ta 2 05), aluminum oxide, Y2O3, La 2 03, titanium oxide (T1O2), aluminum doped hafnium dioxide, bismuth strontium titanium (BST), and platinum zirconium titanium (PZT), among others.
  • hafnium dioxide Hf0 2
  • hafnium oxynitride HfON
  • zirconium dioxide Zr0 2
  • zirconium oxynitride zirON
  • aluminum oxide Al 2 0
  • Figures 6A-6C depict different film stack arrangements or configurations of the optional insulating layer 404, the gate insulating layer 406 and the interlayer insulator 412, as indicated by the circle 452 in Figure 4.
  • any one (or all) of the optional insulating layer 404, the gate insulating layer 406 and the interlayer insulator 412 may be the high-k material, e.g., a dielectric material having a dielectric constant greater than 8, as needed, as shown in Figure 6A.
  • the high-k material of the optional insulating layer 404, the gate insulating layer 406 or the interlayer insulator 412 may be formed by an ALD process performed in an ALD chamber, such as the processing chamber 700 depicted in Figure 7, a CVD process performed in a PECVD, such as the processing chamber 100 depicted in Figure 1 , or a CVD-ALD hybrid process performed both in a CVD and a ALD processing chamber in any order and any time during the manufacturing process as needed.
  • the gate insulating layer 406 may also be in form of a composite structure with more than one layer formed therein.
  • the gate insulating layer 406 is similar to the dielectric layer 424 depicted in Figure 5B and 5C with in total three layers 602, 604, 606 formed therein.
  • the gate insulating layer 406 may include the bulk gate insulating layer 604 sandwiched between the top interface protection layer 606 and the bottom interface protection layer 602.
  • the top interface protection layer 606 may be in contact with the interlayer insulator 412 later formed thereon while the bottom interface protection layer 602 may be formed in contact with the optional insulating layer 404.
  • the bulk gate insulating layer 604 may be fabricated by a high-k material while the top and the bottom interface protection layer 606, 602 may be silicon containing dielectric materials, such as silicon nitride silicon oxide (S1O2), silicon oxynitride (SiON), silicon oxycarbide (SiOC), silicon carbide (SiC) and the like.
  • the top and the bottom interface protection layer 606, 602 may be a silicon oxynitride (SiON) or silicon nitride (SiN) material when the bulk gate insulating layer 606 is a high-k material, as the dielectric layer 424 as depicted in Figures 5B or 5C.
  • the interlayer insulator 412 may also be constructed as more than one layer formed therein.
  • the interlayer insulator 412 is similar to the gate insulating layer 406 depicted in Figure 6C with in total three layers 602, 608, 606 formed therein.
  • the gate interlayer insulator 412 may include the bulk interlayer insulator 608 sandwiched between the top interface protection layer 606 and the bottom interface protection layer 602.
  • the top interface protection layer 606 may be in contact with the planarization layer 418 (as shown in Figure 4) later formed thereon while the bottom interface protection layer 602 may be formed in contact with the gate insulating layer 406.
  • the bulk interlayer insulator 608 may be fabricated by a high-k material while the top and the bottom interface protection layer 606, 602 may be silicon containing dielectric materials, such as silicon nitride silicon oxide (S1O2), silicon oxynitride (SiON), silicon oxycarbide (SiOC), silicon carbide (SiC) and the like.
  • the top and the bottom interface protection layer 606, 602 may be a silicon oxynitride (SiON) or silicon nitride (SiN) material when the bulk interlayer insulator 608 is a high-k material, as the dielectric layer 424 as depicted in Figures 5B or 5C or the gate insulating layer 406 depicted in Figure 6B.
  • SiON silicon oxynitride
  • SiN silicon nitride
  • the methods described herein advantageously improve the electron stability, electrical performance, high capacitance, low leakage and good film stack integration of TFT device structures by controlling the materials and structures of a gate insulating layer, insulating materials in the devices, a pixel electrode, a common electrode along with a dielectric layer formed therebetween as a high electrical performance capacitor in the TFT device structures.

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