JP6946543B2 - ワークピースを処理するための前処理アセンブリ及び方法 - Google Patents
ワークピースを処理するための前処理アセンブリ及び方法 Download PDFInfo
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- H01J37/32752—Means for moving the material to be treated for moving the material across the discharge
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- H01J37/32733—Means for moving the material to be treated
- H01J37/32752—Means for moving the material to be treated for moving the material across the discharge
- H01J37/32761—Continuous moving
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/84—Star-shaped wheels or devices having endless travelling belts or chains, the wheels or devices being equipped with article-engaging elements
- B65G47/841—Devices having endless travelling belts or chains equipped with article-engaging elements
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/84—Star-shaped wheels or devices having endless travelling belts or chains, the wheels or devices being equipped with article-engaging elements
- B65G47/846—Star-shaped wheels or wheels equipped with article-engaging elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01T—SPARK GAPS; OVERVOLTAGE ARRESTERS USING SPARK GAPS; SPARKING PLUGS; CORONA DEVICES; GENERATING IONS TO BE INTRODUCED INTO NON-ENCLOSED GASES
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Description
本願は、2017年7月14日に出願された米国特許出願第15/650,005号の利益を主張し、当該特許出願は、参照により本明細書の一部となる。
Claims (14)
- 前処理アセンブリ(10)用の製品支持アセンブリ(20)であって、
前記前処理アセンブリ(10)は、幾つかのワークピース(1)を処理するように構成されており、
前記前処理アセンブリ(10)は、幾つかのイオン発生ステーション(90)を含んでおり、
前記製品支持アセンブリ(20)は、
第一支持アセンブリ(22)と、
第一駆動アセンブリ(26)と、
幾つかの第二支持アセンブリ(24)と、
第二駆動アセンブリ(28)と、
を備えており、
前記第一駆動アセンブリ(26)は、前記第一支持アセンブリ(22)に動作可能に連結されており、
前記第一駆動アセンブリ(26)は、前記第一支持アセンブリ(22)に一定の動きをさせ、
各第二支持アセンブリ(24)は、幾つかのワークピース(1)を支持するように構成されており、
各第二支持アセンブリ(24)は、前記第一支持アセンブリ(22)に可動に連結されており、
前記第二駆動アセンブリ(28)は、各第二支持アセンブリ(24)に動作可能に連結されており、
前記第二駆動アセンブリ(28)は、各第二支持アセンブリ(24)を選択的に動かし、
どの第二支持アセンブリ(24)もイオン発生ステーション(90)で止まらない、
製品支持アセンブリ。 - 前記第一支持アセンブリ(22)はタレットアセンブリ(30)であり、
前記タレットアセンブリ(30)は、各第二支持アセンブリ(24)を第一の半径(40)にて支持するように構成された本体(32)を含んでおり、
前記タレットアセンブリの本体(32)は回転軸(36)を有しており、
各第二支持アセンブリ(24)は、前記第一の半径(40)にて前記タレットアセンブリ(30)に連結されており、
前記第一駆動アセンブリ(26)は、前記第一の半径(40)が速い速度、非常に速い速度、又は極めて速い速度の何れかで移動するように前記タレットアセンブリの本体(32)を回転させるように構成されている、請求項1に記載の製品支持アセンブリ。 - 各第二支持アセンブリ(24)は、マンドレルアセンブリ(50)であり、
各マンドレルアセンブリ(50)は、第一の端部(54)及び第二の端部(56)を有する細長い本体(52)を含んでおり、
各マンドレルアセンブリ本体(52)は、前記タレットアセンブリの本体(32)に回転可能に連結されている、請求項2に記載の製品支持アセンブリ。 - 各イオン発生ステーション(90)はイオン化面(94)を含んでおり、各イオン化面(94)は幅を有しており、各イオン表面(94)は、前記タレットアセンブリの本体の第一の半径(40)に隣接して配置されており、各イオン化面(94)は、マンドレルアセンブリの本体(52)の移動経路とほぼ平行に延びており、
各マンドレルアセンブリの本体の第二の端部(56)の移動経路は、各イオン化面(94)から有効距離に配置される、請求項3に記載の製品支持アセンブリ。 - 各イオン化面(94)がほぼ内側円錐面であり、各マンドレルアセンブリ本体の第二の端部(56)はテーパー状である、請求項4に記載の製品支持アセンブリ。
- 前記第一駆動アセンブリ(26)は第一の回転速度を有しており、
前記第二駆動アセンブリ(28)は、各マンドレルアセンブリンの本体(52)が各イオン化面(94)付近を移動すると、各マンドレルアセンブリの本体(52)を実質的に一回転させるように構成されている、請求項4に記載の製品支持アセンブリ。 - どのマンドレルアセンブリの本体(52)も、イオン発生ステーション(90)で止まらない、請求項4に記載の製品支持アセンブリ。
- 各マンドレルアセンブリの本体の回転軸(58)は、前記タレットアセンブリの本体の回転軸(36)とほぼ平行に延びている、請求項3記載の製品支持アセンブリ。
- 前記第一駆動アセンブリ(26)及び前記第二駆動アセンブリ(28)は独立に動作可能である、請求項1に記載の製品支持アセンブリ。
- 請求項1乃至9の何れかに記載の製品支持アセンブリ(20)と、
幾つかの前記イオン発生ステーション(90)と、
を備える前処理アセンブリ(10)であって、
各イオン発生ステーション(90)は、前記製品支持アセンブリ(20)に隣接して配置されている、前処理アセンブリ。 - 前記製品支持アセンブリ(20)は、毎分当たり多数のワークピース(1)、毎分当たり非常に多数のワークピース(1)、又は毎分当たり極めて多数のワークピース(1)の何れかに有効距離で前記幾つかのイオン発生ステーション(90)付近を有効距離で通過させる、請求項10に記載の前処理アセンブリ。
- 幾つかのワークピース(1)を処理する方法において、
製品支持アセンブリと、幾つかのイオン発生ステーションを含む前処理アセンブリ(10)を用意する工程(1000)であって、
各イオン発生ステーションは、前記製品支持アセンブリに隣接して配置され、
前記製品支持アセンブリは、第一支持アセンブリ(22)、第一駆動アセンブリ、幾つかの第二支持アセンブリ(24)、及び第二駆動アセンブリを含んでおり、
前記第一駆動アセンブリは、前記第一支持アセンブリ(22)に動作可能に連結されており、
前記第一駆動アセンブリは、前記第一支持アセンブリ(22)に一定の動きをさせ、
各第二支持アセンブリ(24)は、幾つかのワークピースを支持するように構成されており、
各第二支持アセンブリ(24)は、前記第一支持アセンブリ(22)に可動に連結されており、
前記第二駆動アセンブリは、各第二支持アセンブリ(24)に動作可能に連結されており、
前記第二駆動アセンブリは、各第二支持アセンブリ(24)を選択的に動かす、
工程(1000)と、
幾つかのワークピース(1)を処理する工程(1001)と、
を含んでおり、
幾つかのワークピース(1)を処理する工程(1001)は、
第二支持アセンブリ(24)にワークピース(1)を配置する工程(1002)と、
前記第一支持アセンブリ(22)をほぼ一定の速度で移動させる工程(1004)と、
各第二支持アセンブリ(24)に前記幾つかのイオン発生ステーション(90)付近を移動させる工程(1006)と、
を含んでおり、
どの第二支持アセンブリ(24)もイオン発生ステーション(90)で止まらない、
方法。 - 前記第一支持アセンブリ(22)をほぼ一定の速度で移動させる工程(1004)は、 前記第一支持アセンブリ(22)上の第一の半径(40)が、速い速度、非常に速い速度、又は極めて速い速度の何れかで移動するように前記第一支持アセンブリ(22)を移動させる工程(1020)を含む、請求項12に記載の方法。
- 幾つかのワークピース(1)を処理する工程(1001)は、毎分当たり多数のワークピース(1)、毎分当たり非常に多数のワークピース(1)、又は、毎分当たり極めて多数のワークピース(1)の何れかを処理する工程(1030)を含む、請求項12に記載の方法。
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JP2021150019A JP7374966B2 (ja) | 2017-07-14 | 2021-09-15 | ワークピースを処理するための前処理アセンブリ及び製品支持アセンブリ |
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US15/650,005 US10913995B2 (en) | 2017-07-14 | 2017-07-14 | Pretreatment assembly and method for treating work pieces |
US15/650,005 | 2017-07-14 | ||
PCT/US2018/041554 WO2019014298A1 (en) | 2017-07-14 | 2018-07-11 | PRETREATMENT ASSEMBLY AND PROCESSING METHOD FOR WORKPIECES |
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CN115386842A (zh) * | 2022-09-20 | 2022-11-25 | 湖南千山制药机械股份有限公司 | 塑料安瓿真空外镀模组及一体成型机 |
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CN111133387A (zh) | 2020-05-08 |
JP7374966B2 (ja) | 2023-11-07 |
US20190017160A1 (en) | 2019-01-17 |
WO2019014298A1 (en) | 2019-01-17 |
JP2022002844A (ja) | 2022-01-11 |
EP3652589A4 (en) | 2021-04-14 |
EP3652589A1 (en) | 2020-05-20 |
CN111133387B (zh) | 2023-09-01 |
JP2020527451A (ja) | 2020-09-10 |
US10913995B2 (en) | 2021-02-09 |
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