JP6929658B2 - プリント回路板の製造方法、プリント回路板、および電子機器 - Google Patents

プリント回路板の製造方法、プリント回路板、および電子機器 Download PDF

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Publication number
JP6929658B2
JP6929658B2 JP2017029822A JP2017029822A JP6929658B2 JP 6929658 B2 JP6929658 B2 JP 6929658B2 JP 2017029822 A JP2017029822 A JP 2017029822A JP 2017029822 A JP2017029822 A JP 2017029822A JP 6929658 B2 JP6929658 B2 JP 6929658B2
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solder
printed circuit
circuit board
metal member
lands
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Japanese (ja)
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JP2018137301A5 (enExample
JP2018137301A (ja
Inventor
邦彦 峰岸
邦彦 峰岸
長谷川　光利
光利 長谷川
榊　隆
隆 榊
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Canon Inc
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Canon Inc
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Priority to JP2017029822A priority Critical patent/JP6929658B2/ja
Priority to US15/897,560 priority patent/US10398037B2/en
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JP2017029822A 2017-02-20 2017-02-21 プリント回路板の製造方法、プリント回路板、および電子機器 Active JP6929658B2 (ja)

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JP2017029822A JP6929658B2 (ja) 2017-02-21 2017-02-21 プリント回路板の製造方法、プリント回路板、および電子機器
US15/897,560 US10398037B2 (en) 2017-02-20 2018-02-15 Printed circuit board and electronic device

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JP2017029822A JP6929658B2 (ja) 2017-02-21 2017-02-21 プリント回路板の製造方法、プリント回路板、および電子機器

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JP2018137301A JP2018137301A (ja) 2018-08-30
JP2018137301A5 JP2018137301A5 (enExample) 2020-04-02
JP6929658B2 true JP6929658B2 (ja) 2021-09-01

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020064998A (ja) * 2018-10-18 2020-04-23 キヤノン株式会社 実装基板およびその製造方法
JP7512027B2 (ja) * 2019-11-06 2024-07-08 キヤノン株式会社 電子モジュールの製造方法、電子モジュール、及び電子機器

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4203666B2 (ja) * 2004-12-27 2009-01-07 パナソニック株式会社 電子部品実装方法および電子部品実装構造
JP2006245189A (ja) * 2005-03-02 2006-09-14 Matsushita Electric Ind Co Ltd 半導体素子のフリップチップ実装方法及び実装構造体
JP2017022190A (ja) * 2015-07-08 2017-01-26 パナソニックＩｐマネジメント株式会社 実装構造体

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