JP2018137301A5 - - Google Patents
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- Publication number
- JP2018137301A5 JP2018137301A5 JP2017029822A JP2017029822A JP2018137301A5 JP 2018137301 A5 JP2018137301 A5 JP 2018137301A5 JP 2017029822 A JP2017029822 A JP 2017029822A JP 2017029822 A JP2017029822 A JP 2017029822A JP 2018137301 A5 JP2018137301 A5 JP 2018137301A5
- Authority
- JP
- Japan
- Prior art keywords
- solder
- circuit board
- printed circuit
- lands
- metal member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 claims description 34
- 239000002184 metal Substances 0.000 claims description 20
- 239000011347 resin Substances 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 10
- 229920001187 thermosetting polymer Polymers 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 7
- 239000000843 powder Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 238000002844 melting Methods 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 description 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017029822A JP6929658B2 (ja) | 2017-02-21 | 2017-02-21 | プリント回路板の製造方法、プリント回路板、および電子機器 |
| US15/897,560 US10398037B2 (en) | 2017-02-20 | 2018-02-15 | Printed circuit board and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017029822A JP6929658B2 (ja) | 2017-02-21 | 2017-02-21 | プリント回路板の製造方法、プリント回路板、および電子機器 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018137301A JP2018137301A (ja) | 2018-08-30 |
| JP2018137301A5 true JP2018137301A5 (enExample) | 2020-04-02 |
| JP6929658B2 JP6929658B2 (ja) | 2021-09-01 |
Family
ID=63366144
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017029822A Active JP6929658B2 (ja) | 2017-02-20 | 2017-02-21 | プリント回路板の製造方法、プリント回路板、および電子機器 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6929658B2 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020064998A (ja) * | 2018-10-18 | 2020-04-23 | キヤノン株式会社 | 実装基板およびその製造方法 |
| JP7512027B2 (ja) * | 2019-11-06 | 2024-07-08 | キヤノン株式会社 | 電子モジュールの製造方法、電子モジュール、及び電子機器 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4203666B2 (ja) * | 2004-12-27 | 2009-01-07 | パナソニック株式会社 | 電子部品実装方法および電子部品実装構造 |
| JP2006245189A (ja) * | 2005-03-02 | 2006-09-14 | Matsushita Electric Ind Co Ltd | 半導体素子のフリップチップ実装方法及び実装構造体 |
| JP2017022190A (ja) * | 2015-07-08 | 2017-01-26 | パナソニックＩｐマネジメント株式会社 | 実装構造体 |
-
2017
- 2017-02-21 JP JP2017029822A patent/JP6929658B2/ja active Active
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