JP2018137301A5 - - Google Patents
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- JP2018137301A5 JP2018137301A5 JP2017029822A JP2017029822A JP2018137301A5 JP 2018137301 A5 JP2018137301 A5 JP 2018137301A5 JP 2017029822 A JP2017029822 A JP 2017029822A JP 2017029822 A JP2017029822 A JP 2017029822A JP 2018137301 A5 JP2018137301 A5 JP 2018137301A5
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- JP
- Japan
- Prior art keywords
- solder
- circuit board
- printed circuit
- lands
- metal member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229910000679 solder Inorganic materials 0.000 claims description 34
- 239000002184 metal Substances 0.000 claims description 20
- 239000011347 resin Substances 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 10
- 229920001187 thermosetting polymer Polymers 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 7
- 239000000843 powder Substances 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 238000002844 melting Methods 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 4
- 230000000875 corresponding Effects 0.000 claims description 2
- 230000002093 peripheral Effects 0.000 description 1
Description
本発明の一実施形態に係わるプリント回路板の製造方法は、底面に複数の第１のランドが設けられた電子部品と、前記電子部品の底面と対向する主面を有し該主面側に複数の第１の開口を有するソルダーレジストと該複数の第１の開口に設けられた複数の第２のランドとを有するプリント配線板とを含み、前記複数の第１のランドと前記複数の第２のランドとがそれぞれはんだによって接合されたプリント回路板の製造方法であって、前記複数の第２のランドにはんだ粉末および熱硬化性樹脂を含有するはんだペーストを供給する供給工程と、前記プリント配線板の主面上に前記電子部品を搭載する搭載工程と、前記はんだペーストを前記はんだ粉末の融点より高い温度に加熱することにより前記はんだ粉末を溶融させて前記複数の第１のランドと対応する前記複数の第２のランドとをそれぞれはんだで接合するはんだ接合加熱工程と、前記熱硬化性樹脂を硬化させる樹脂硬化加熱工程とを備え、前記複数の第２のランドの少なくとも１つの周囲には少なくとも１つの金属部材が設けられ、前記プリント回路板を前記電子部品側から平面視したときに、前記主面の前記電子部品が投影される領域内において、前記金属部材の総面積が前記ソルダーレジストの総面積以下であり、前記熱硬化性樹脂は前記はんだ及び前記金属部材と接触した状態で硬化することを特徴とする。 A method of manufacturing a printed circuit board according to an embodiment of the present invention includes an electronic component having a plurality of first lands provided on a bottom surface, and a main surface facing the bottom surface of the electronic component. and a printed wiring board having a plurality of second lands that are provided in the solder resist and the plurality of first openings having a plurality of first openings, the first and the plurality of first lands of the plurality and second land is a method for manufacturing a printed circuit board which is joined by solder, respectively, a supply step of supplying a solder paste containing a solder powder and a thermosetting resin to said plurality of second lands, the printed a mounting step of mounting the electronic component on the main surface of the wiring board, the first La said solder powder is melted in the plurality by heating the solder paste to a temperature above the melting point of the solder powder Comprising a solder joint heating step of joining by soldering a plurality of second lands corresponding to de respectively, and a resin cured by heating curing the pre Symbol thermosetting resin, at least of the plurality of second lands At least one metal member is provided around one periphery, and when the printed circuit board is viewed in plan from the electronic component side , a total of the metal members is provided in a region of the main surface where the electronic component is projected. An area is equal to or less than a total area of the solder resist, and the thermosetting resin is cured while being in contact with the solder and the metal member.
本発明の一実施形態に係わるプリント回路板は、底面に複数の第１のランドが設けられた電子部品と、前記電子部品の底面と対向する主面を有し該主面側に複数の第１の開口を有するソルダーレジストと該複数の第１の開口に設けられた複数の第２のランドとを有するプリント配線板とを含み、前記複数の第１のランドと前記複数の第２のランドとがそれぞれはんだによって接合されたプリント回路板であって、前記複数の第２のランドの少なくとも１つの周囲には少なくとも１つの金属部材が設けられ、前記はんだの周囲を覆う熱硬化性樹脂の硬化物が、前記金属部材と接し、かつ、前記電子部品の底面と前記ソルダーレジストとを接合しており、前記プリント回路板を前記電子部品側から平面視したときに、前記主面の前記電子部品が投影される領域内において、前記金属部材の総面積が前記ソルダーレジストの総面積以下であることを特徴とする。 A printed circuit board according to an embodiment of the present invention includes an electronic component having a plurality of first lands provided on a bottom surface, a main surface facing the bottom surface of the electronic component, and a plurality of first lands on the main surface side. and a printed wiring board having a plurality of second lands that are provided in the solder resist and the plurality of first openings having a first opening, the plurality of first lands and the previous SL multiple second each and lands a printed circuit board which is joined by soldering, wherein the at least one peripheral of the plurality of second lands provided at least one metal member, a thermosetting resin covering the periphery of the solder The cured product is in contact with the metal member, and joins the bottom surface of the electronic component and the solder resist, and when the printed circuit board is viewed from above the electronic component side, the main surface of the main surface Electronic components In the region which is characterized in that the total area of the metal member is less than the total area of the solder resist.
本発明の一実施形態に係わる電子機器は、上記プリント回路板を備えることを特徴とする。 An electronic device according to an embodiment of the present invention includes the printed circuit board .
Claims (15)
前記複数の第２のランドにはんだ粉末および熱硬化性樹脂を含有するはんだペーストを供給する供給工程と、前記プリント配線板の主面上に前記電子部品を搭載する搭載工程と、前記はんだペーストを前記はんだ粉末の融点より高い温度に加熱することにより前記はんだ粉末を溶融させて前記複数の第１のランドと対応する前記複数の第２のランドとをそれぞれはんだで接合するはんだ接合加熱工程と、前記熱硬化性樹脂を硬化させる樹脂硬化加熱工程とを備え、
前記複数の第２のランドの少なくとも１つの周囲には少なくとも１つの金属部材が設けられ、前記プリント回路板を前記電子部品側から平面視したときに、前記主面の前記電子部品が投影される領域内において、前記金属部材の総面積が前記ソルダーレジストの総面積以下であり、前記熱硬化性樹脂は前記はんだ及び前記金属部材と接触した状態で硬化することを特徴とするプリント回路板の製造方法。 An electronic component provided with a plurality of first lands on a bottom surface, a solder resist having a main surface facing the bottom surface of the electronic component and having a plurality of first openings on the main surface side; and a printed wiring board having a plurality of second lands that are provided in the opening of, the manufacture of printed circuit board which is joined to the plurality of first lands and said plurality of second lands by soldering, respectively The method
A supply step of supplying a solder paste containing a solder powder and a thermosetting resin to the plurality of second lands; a mounting step of mounting the electronic component on a main surface of the printed wiring board; A solder joining heating step of melting the solder powder by heating to a temperature higher than the melting point of the solder powder and joining the plurality of first lands and the corresponding plurality of second lands with solder, respectively ; and a pre-Symbol resin curing heating step for curing the thermosetting resin,
At least one metal member is provided around at least one of the plurality of second lands, and the electronic component on the main surface is projected when the printed circuit board is viewed in plan from the electronic component side. in the region, the is the total area of the metal member is less total area of the solder resist, producing the thermosetting resin of the printed circuit board, characterized in that the curing in contact with the solder and the metal member Method.
前記複数の第２のランドの少なくとも１つの周囲には少なくとも１つの金属部材が設けられ、前記はんだの周囲を覆う熱硬化性樹脂の硬化物が、前記金属部材と接し、かつ、前記電子部品の底面と前記ソルダーレジストとを接合しており、前記プリント回路板を前記電子部品側から平面視したときに、前記主面の前記電子部品が投影される領域内において、前記金属部材の総面積が前記ソルダーレジストの総面積以下であることを特徴とするプリント回路板。 An electronic component provided with a plurality of first lands on a bottom surface, a solder resist having a main surface facing the bottom surface of the electronic component and having a plurality of first openings on the main surface side; in the and a printed wiring board having a plurality of second lands that are provided in the opening, a printed circuit board wherein a plurality of first lands and a previous SL plurality of second lands are joined by soldering, respectively So,
At least one metal member is provided around at least one of the plurality of second lands, and a cured product of a thermosetting resin covering the periphery of the solder is in contact with the metal member, and the electronic component The bottom surface of the metal member is joined to the solder resist, and when the printed circuit board is viewed from the electronic component side in a plan view , the total area of the metal member is within a region where the electronic component is projected on the main surface. printed circuit board, characterized in that but is less than the total area of the solder resist.
前記第２の開口には前記金属部材が設けられていることを特徴とする、請求項６に記載のプリント回路板。The printed circuit board according to claim 6, wherein the metal member is provided in the second opening.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017029822A JP6929658B2 (en) | 2017-02-21 | 2017-02-21 | How to make printed circuit boards, printed circuit boards, and electronic devices |
| US15/897,560 US10398037B2 (en) | 2017-02-20 | 2018-02-15 | Printed circuit board and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017029822A JP6929658B2 (en) | 2017-02-21 | 2017-02-21 | How to make printed circuit boards, printed circuit boards, and electronic devices |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018137301A JP2018137301A (en) | 2018-08-30 |
| JP2018137301A5 true JP2018137301A5 (en) | 2020-04-02 |
| JP6929658B2 JP6929658B2 (en) | 2021-09-01 |
Family
ID=63366144
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017029822A Active JP6929658B2 (en) | 2017-02-20 | 2017-02-21 | How to make printed circuit boards, printed circuit boards, and electronic devices |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6929658B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020064998A (en) * | 2018-10-18 | 2020-04-23 | キヤノン株式会社 | Mounting substrate and method of manufacturing the same |
| JP7512027B2 (en) * | 2019-11-06 | 2024-07-08 | キヤノン株式会社 | Manufacturing method of electronic module, electronic module, and electronic device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4203666B2 (en) * | 2004-12-27 | 2009-01-07 | パナソニック株式会社 | Electronic component mounting method and electronic component mounting structure |
| JP2006245189A (en) * | 2005-03-02 | 2006-09-14 | Matsushita Electric Ind Co Ltd | Flip-chip mounting method and mounting structure of semiconductor device |
| JP2017022190A (en) * | 2015-07-08 | 2017-01-26 | パナソニックＩｐマネジメント株式会社 | Mounting structure |
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2017
- 2017-02-21 JP JP2017029822A patent/JP6929658B2/en active Active
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