JP2019197886A5 - - Google Patents

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Publication number
JP2019197886A5
JP2019197886A5 JP2019069932A JP2019069932A JP2019197886A5 JP 2019197886 A5 JP2019197886 A5 JP 2019197886A5 JP 2019069932 A JP2019069932 A JP 2019069932A JP 2019069932 A JP2019069932 A JP 2019069932A JP 2019197886 A5 JP2019197886 A5 JP 2019197886A5
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JP
Japan
Prior art keywords
region
thermosetting resin
repelling
printed circuit
property
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2019069932A
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English (en)
Japanese (ja)
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JP2019197886A (ja
JP7362286B2 (ja
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Publication date
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Priority to US16/398,405 priority Critical patent/US11382209B2/en
Publication of JP2019197886A publication Critical patent/JP2019197886A/ja
Publication of JP2019197886A5 publication Critical patent/JP2019197886A5/ja
Application granted granted Critical
Publication of JP7362286B2 publication Critical patent/JP7362286B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2019069932A 2018-05-07 2019-04-01 プリント回路板の製造方法、プリント回路板、及び電子機器 Active JP7362286B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US16/398,405 US11382209B2 (en) 2018-05-07 2019-04-30 Method for manufacturing printed circuit board, printed circuit board, and electronic device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018089514 2018-05-07
JP2018089514 2018-05-07

Publications (3)

Publication Number Publication Date
JP2019197886A JP2019197886A (ja) 2019-11-14
JP2019197886A5 true JP2019197886A5 (enExample) 2022-04-04
JP7362286B2 JP7362286B2 (ja) 2023-10-17

Family

ID=68537721

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019069932A Active JP7362286B2 (ja) 2018-05-07 2019-04-01 プリント回路板の製造方法、プリント回路板、及び電子機器

Country Status (1)

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JP (1) JP7362286B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6691998B1 (ja) * 2019-12-24 2020-05-13 株式会社鈴木 半導体装置の製造方法及び半導体装置の製造装置
JP2023101235A (ja) * 2022-01-07 2023-07-20 キヤノン株式会社 電子モジュール、装置及び電子モジュールの製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5037450B2 (ja) * 2008-08-08 2012-09-26 シャープ株式会社 表示素子・電子素子モジュールおよび電子情報機器
JP2018014674A (ja) * 2016-07-22 2018-01-25 キヤノン株式会社 電気配線、及び電子機器
JP2018056234A (ja) * 2016-09-27 2018-04-05 キヤノン株式会社 プリント回路板、電子機器及びプリント回路板の製造方法

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