JP7362286B2 - プリント回路板の製造方法、プリント回路板、及び電子機器 - Google Patents

プリント回路板の製造方法、プリント回路板、及び電子機器 Download PDF

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Publication number
JP7362286B2
JP7362286B2 JP2019069932A JP2019069932A JP7362286B2 JP 7362286 B2 JP7362286 B2 JP 7362286B2 JP 2019069932 A JP2019069932 A JP 2019069932A JP 2019069932 A JP2019069932 A JP 2019069932A JP 7362286 B2 JP7362286 B2 JP 7362286B2
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Japan
Prior art keywords
land
region
thermosetting resin
printed circuit
circuit board
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JP2019069932A
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English (en)
Japanese (ja)
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JP2019197886A (ja
JP2019197886A5 (enExample
Inventor
光利 長谷川
邦彦 峰岸
隆 榊
真伍 石栗
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Canon Inc
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Canon Inc
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Application filed by Canon Inc filed Critical Canon Inc
Priority to US16/398,405 priority Critical patent/US11382209B2/en
Publication of JP2019197886A publication Critical patent/JP2019197886A/ja
Publication of JP2019197886A5 publication Critical patent/JP2019197886A5/ja
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Publication of JP7362286B2 publication Critical patent/JP7362286B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP2019069932A 2018-05-07 2019-04-01 プリント回路板の製造方法、プリント回路板、及び電子機器 Active JP7362286B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US16/398,405 US11382209B2 (en) 2018-05-07 2019-04-30 Method for manufacturing printed circuit board, printed circuit board, and electronic device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018089514 2018-05-07
JP2018089514 2018-05-07

Publications (3)

Publication Number Publication Date
JP2019197886A JP2019197886A (ja) 2019-11-14
JP2019197886A5 JP2019197886A5 (enExample) 2022-04-04
JP7362286B2 true JP7362286B2 (ja) 2023-10-17

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JP2019069932A Active JP7362286B2 (ja) 2018-05-07 2019-04-01 プリント回路板の製造方法、プリント回路板、及び電子機器

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JP (1) JP7362286B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12484152B2 (en) * 2022-01-07 2025-11-25 Canon Kabushiki Kaisha Electronic module and apparatus

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6691998B1 (ja) * 2019-12-24 2020-05-13 株式会社鈴木 半導体装置の製造方法及び半導体装置の製造装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010045463A (ja) 2008-08-08 2010-02-25 Sharp Corp 表示素子・電子素子モジュールおよびその製造方法、電子情報機器
JP2018014674A (ja) 2016-07-22 2018-01-25 キヤノン株式会社 電気配線、及び電子機器
JP2018056234A (ja) 2016-09-27 2018-04-05 キヤノン株式会社 プリント回路板、電子機器及びプリント回路板の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010045463A (ja) 2008-08-08 2010-02-25 Sharp Corp 表示素子・電子素子モジュールおよびその製造方法、電子情報機器
JP2018014674A (ja) 2016-07-22 2018-01-25 キヤノン株式会社 電気配線、及び電子機器
JP2018056234A (ja) 2016-09-27 2018-04-05 キヤノン株式会社 プリント回路板、電子機器及びプリント回路板の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12484152B2 (en) * 2022-01-07 2025-11-25 Canon Kabushiki Kaisha Electronic module and apparatus

Also Published As

Publication number Publication date
JP2019197886A (ja) 2019-11-14

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