JP6921057B2 - レーザ処理装置、ワークピースをレーザ処理する方法及び関連する構成 - Google Patents

レーザ処理装置、ワークピースをレーザ処理する方法及び関連する構成 Download PDF

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JP6921057B2
JP6921057B2 JP2018512536A JP2018512536A JP6921057B2 JP 6921057 B2 JP6921057 B2 JP 6921057B2 JP 2018512536 A JP2018512536 A JP 2018512536A JP 2018512536 A JP2018512536 A JP 2018512536A JP 6921057 B2 JP6921057 B2 JP 6921057B2
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workpiece
spot
laser
scan
spot positions
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JP2018532595A5 (cg-RX-API-DMAC10.html
JP2018532595A (ja
Inventor
ウンラート，マーク
ヤン，チュアン
クライネルト，ヤン
ピープルズ，マーク
オーウェンズ，ヒュー
バーン，グウェンドリン
チョウ，ハイビン
レッド，ジャスティン
ニューフェルド，コーリー
ブルックハイザー，ジェームス
康 大迫
康 大迫
アルペイ，メメット
リン，ジィビン
レイチェル，パトリック
ヌッコルス，ティム
松本　久
久 松本
ライダー，クリス
Original Assignee
エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド
エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド
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Publication of JP2018532595A publication Critical patent/JP2018532595A/ja
Publication of JP2018532595A5 publication Critical patent/JP2018532595A5/ja
Priority to JP2021122216A priority Critical patent/JP7404316B2/ja
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Priority to JP2023174408A priority patent/JP7879090B2/ja
Priority to JP2026019903A priority patent/JP2026086671A/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/703—Cooling arrangements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/54—Glass

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Mechanical Optical Scanning Systems (AREA)
  • Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
  • Lasers (AREA)
JP2018512536A 2015-09-09 2016-09-08 レーザ処理装置、ワークピースをレーザ処理する方法及び関連する構成 Active JP6921057B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2021122216A JP7404316B2 (ja) 2015-09-09 2021-07-27 レーザ処理装置、ワークピースをレーザ処理する方法及び関連する構成
JP2023174408A JP7879090B2 (ja) 2015-09-09 2023-10-06 レーザ処理装置、ワークピースをレーザ処理する方法及び関連する構成
JP2026019903A JP2026086671A (ja) 2015-09-09 2026-02-10 レーザ処理装置、ワークピースをレーザ処理する方法及び関連する構成

Applications Claiming Priority (11)

Application Number Priority Date Filing Date Title
US201562216102P 2015-09-09 2015-09-09
US62/216,102 2015-09-09
US201562241624P 2015-10-14 2015-10-14
US62/241,624 2015-10-14
US201562271446P 2015-12-28 2015-12-28
US62/271,446 2015-12-28
US201662294991P 2016-02-12 2016-02-12
US62/294,991 2016-02-12
US201662366984P 2016-07-26 2016-07-26
US62/366,984 2016-07-26
PCT/US2016/050804 WO2017044646A1 (en) 2015-09-09 2016-09-08 Laser processing apparatus, methods of laser-processing workpieces and related arrangements

Related Child Applications (1)

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JP2021122216A Division JP7404316B2 (ja) 2015-09-09 2021-07-27 レーザ処理装置、ワークピースをレーザ処理する方法及び関連する構成

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JP2018532595A JP2018532595A (ja) 2018-11-08
JP2018532595A5 JP2018532595A5 (cg-RX-API-DMAC10.html) 2019-10-03
JP6921057B2 true JP6921057B2 (ja) 2021-08-18

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JP2021122216A Active JP7404316B2 (ja) 2015-09-09 2021-07-27 レーザ処理装置、ワークピースをレーザ処理する方法及び関連する構成
JP2023174408A Active JP7879090B2 (ja) 2015-09-09 2023-10-06 レーザ処理装置、ワークピースをレーザ処理する方法及び関連する構成
JP2026019903A Pending JP2026086671A (ja) 2015-09-09 2026-02-10 レーザ処理装置、ワークピースをレーザ処理する方法及び関連する構成

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JP2023174408A Active JP7879090B2 (ja) 2015-09-09 2023-10-06 レーザ処理装置、ワークピースをレーザ処理する方法及び関連する構成
JP2026019903A Pending JP2026086671A (ja) 2015-09-09 2026-02-10 レーザ処理装置、ワークピースをレーザ処理する方法及び関連する構成

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US (3) US11077526B2 (cg-RX-API-DMAC10.html)
JP (4) JP6921057B2 (cg-RX-API-DMAC10.html)
KR (3) KR20250037607A (cg-RX-API-DMAC10.html)
CN (3) CN116213918B (cg-RX-API-DMAC10.html)
TW (3) TWI780684B (cg-RX-API-DMAC10.html)
WO (1) WO2017044646A1 (cg-RX-API-DMAC10.html)

Families Citing this family (102)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE46672E1 (en) 2006-07-13 2018-01-16 Velodyne Lidar, Inc. High definition LiDAR system
US10627490B2 (en) 2016-01-31 2020-04-21 Velodyne Lidar, Inc. Multiple pulse, LIDAR based 3-D imaging
CN109154661A (zh) 2016-03-19 2019-01-04 威力登激光雷达有限公司 用于基于lidar的3-d成像的集成照射和检测
JP7165587B2 (ja) 2016-06-01 2022-11-04 ベロダイン ライダー ユーエスエー，インコーポレイテッド 多重ピクセル走査ｌｉｄａｒ
US11192389B2 (en) * 2016-12-02 2021-12-07 Alltec Angewandte Laserlicht Technologie Gmbh System and method for laser marking substrates
WO2018183843A1 (en) * 2017-03-31 2018-10-04 Velodyne Lidar, Inc. Integrated lidar illumination power control
EP3398764A1 (en) * 2017-05-03 2018-11-07 Macsa ID, S.A. Cutting module for packaging machine for sachet-type packages made from flexible film
CA3062701A1 (en) 2017-05-08 2018-11-15 Velodyne Lidar, Inc. Lidar data acquisition and control
US12145216B2 (en) * 2017-05-15 2024-11-19 The Trustees Of The University Of Pennsylvania Systems and methods for laser cleaving diamonds
EP3417982A1 (de) * 2017-06-21 2018-12-26 Heraeus Deutschland GmbH & Co. KG Laserschneiden von metall-keramik-substraten
JP7023629B2 (ja) * 2017-07-07 2022-02-22 株式会社ディスコ レーザー加工装置
GB2566477A (en) * 2017-09-14 2019-03-20 Nat Univ Ireland Galway Method of processing a target material
US11258377B2 (en) * 2017-09-19 2022-02-22 The United States Of America, As Represented By The Secretary Of The Navy Perturbation measurement, correction, and inducing system adapted to provide highly accurate perturbation measurements and reduce the effects of perturbations within the system
US11705686B2 (en) * 2017-09-22 2023-07-18 Electro Scientific Industries, Inc. Acousto-optic system having phase-shifting reflector
DE102017009001A1 (de) * 2017-09-23 2019-03-28 Hochschule Mittweida (Fh) Verwendung eines Hochleistungs-Ultrakurzpulslasers zum Materialabtrag, Verfahren zum Materialabtrag und Einrichtung zum Materialabtrag eines Festkörpers und/oder wenigstens einer darauf befindlichen Schicht
US11353559B2 (en) 2017-10-09 2022-06-07 Luminar, Llc Adjustable scan patterns for lidar system
US11415675B2 (en) * 2017-10-09 2022-08-16 Luminar, Llc Lidar system with adjustable pulse period
KR102596305B1 (ko) * 2017-11-20 2023-10-30 아이피지 포토닉스 코포레이션 재료의 가공을 위한 시스템 및 방법 레이저
US11294041B2 (en) 2017-12-08 2022-04-05 Velodyne Lidar Usa, Inc. Systems and methods for improving detection of a return signal in a light ranging and detection system
JP7019412B2 (ja) * 2017-12-25 2022-02-15 日本電産マシンツール株式会社 制御装置、レーザ加工機、レーザ加工機の制御方法、およびプログラム
JP7083645B2 (ja) * 2018-01-11 2022-06-13 Ｊｓｗアクティナシステム株式会社 レーザ処理装置、レーザ処理方法及び半導体装置の製造方法
JP6740267B2 (ja) * 2018-02-19 2020-08-12 ファナック株式会社 レーザ加工装置
KR102778985B1 (ko) * 2018-06-05 2025-03-12 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 레이저 가공 장치, 그 작동 방법 및 이를 사용한 작업물 가공 방법
US11971507B2 (en) 2018-08-24 2024-04-30 Velodyne Lidar Usa, Inc. Systems and methods for mitigating optical crosstalk in a light ranging and detection system
US20210333173A1 (en) * 2018-09-10 2021-10-28 Fluidigm Canada Inc. High speed modulation sample imaging apparatus and method
US10712434B2 (en) * 2018-09-18 2020-07-14 Velodyne Lidar, Inc. Multi-channel LIDAR illumination driver
US11082010B2 (en) 2018-11-06 2021-08-03 Velodyne Lidar Usa, Inc. Systems and methods for TIA base current detection and compensation
DE102018133553A1 (de) * 2018-12-21 2020-06-25 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Gegenstand mit einem Metallsubstrat und einem Kanal im Metallsubstrat sowie Verfahren zu dessen Herstellung
EP3674427A1 (en) * 2018-12-28 2020-07-01 Etxe-Tar, S.A. Method and system for heating using an energy beam
US11885958B2 (en) 2019-01-07 2024-01-30 Velodyne Lidar Usa, Inc. Systems and methods for a dual axis resonant scanning mirror
US12061263B2 (en) 2019-01-07 2024-08-13 Velodyne Lidar Usa, Inc. Systems and methods for a configurable sensor system
TWI892641B (zh) 2019-01-31 2025-08-01 美商伊雷克托科學工業股份有限公司 光學系統
US12103110B2 (en) * 2019-03-22 2024-10-01 Via Mechanics, Ltd. Laser processing apparatus and laser processing method
DE102019108131A1 (de) * 2019-03-28 2020-10-01 Pulsar Photonics Gmbh Vorrichtung und Verfahren zur Ausbildung von VIA-Laserbohrungen
US12304001B2 (en) * 2019-04-02 2025-05-20 Asmpt Singapore Pte. Ltd. Optimised laser cutting
CN111822868B (zh) * 2019-04-19 2022-06-17 大族激光科技产业集团股份有限公司 激光飞行打标机、打标系统及打标方法
CN110238547B (zh) * 2019-05-09 2020-12-18 西安理工大学 一种用于测量大功率激光焦点位置的系统及测量方法
FR3096511B1 (fr) * 2019-05-22 2021-07-02 Amplitude Systemes Monture de composant optique et système de commande de faisceau lumineux associé
JP7428481B2 (ja) * 2019-06-07 2024-02-06 住友重機械工業株式会社 レーザアニール方法及びレーザ制御装置
CN113710407B (zh) * 2019-06-10 2024-11-26 伊雷克托科学工业股份有限公司 镭射加工设备、其操作方法以及使用其加工工件的方法
CN112091210A (zh) * 2019-06-17 2020-12-18 广东汉邦激光科技有限公司 3d激光成型装置及3d激光成型方法
DE102019116803A1 (de) * 2019-06-21 2020-12-24 Trumpf Laser- Und Systemtechnik Gmbh Verfahren und Vorrichtung zur Bearbeitung eines Werkstücks
US10613203B1 (en) 2019-07-01 2020-04-07 Velodyne Lidar, Inc. Interference mitigation for light detection and ranging
DE102019214684A1 (de) * 2019-09-25 2021-03-25 Q.ant GmbH Verfahren zum Herstellen von Mikrostrukturen an einem optischen Kristall
DE102019215000A1 (de) * 2019-09-30 2021-04-01 Robert Bosch Gmbh Mikroschweißverfahren flexibler und dünner Folien, bspw. für den Einsatz in elektrischen und elektronischen Vorrichtungen
EP3800033B1 (en) * 2019-09-30 2024-08-21 Ricoh Company, Ltd. Irradiation target flying apparatus, three-dimensional modeling apparatus, and irradiation target flying method
US11069537B2 (en) * 2019-10-18 2021-07-20 Hamilton Sundstrand Corporation Method for delidding a hermetically sealed circuit package
US11999014B2 (en) * 2019-11-22 2024-06-04 Medtronic, Inc. Laser cutting system
CN110970794B (zh) * 2019-12-20 2020-10-30 中国科学院半导体研究所 用于提高激光器功率的声光q开关、谐振腔和脉冲激光器
DE102020201207A1 (de) * 2020-01-31 2021-08-05 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Anordnung zur Materialbearbeitung mit einem Laserstrahl, insbesondere zum Laserstrahl-Bohren
KR20220149583A (ko) 2020-03-02 2022-11-08 아톰 컴퓨팅 인크. 확장 가능한 중성 원자 기반 양자 컴퓨팅
AU2020433835A1 (en) * 2020-03-02 2022-09-29 Atom Computing Inc. Scalable neutral atom based quantum computing
US12064830B2 (en) * 2020-03-12 2024-08-20 Rohr, Inc. Substrate perforation system and method using beamlets
WO2021231559A1 (en) 2020-05-13 2021-11-18 Luminar, Llc Lidar system with high-resolution scan pattern
CN111889457B (zh) * 2020-07-29 2021-09-03 武汉翔明激光科技有限公司 一种大幅面自动化激光清洗装置及方法
CN114592224A (zh) * 2020-12-03 2022-06-07 泰科电子(上海)有限公司 回流熔融系统和导电端子生产系统
CN112721425A (zh) * 2020-12-28 2021-04-30 淳华科技(昆山)有限公司 防焊印刷机
JP7660598B2 (ja) * 2021-01-27 2025-04-11 ギガフォトン株式会社 レーザ加工方法、及びレーザ加工システム
KR102254339B1 (ko) * 2021-02-03 2021-05-21 주식회사 21세기 펨토초 펄스 레이저를 이용한 플래닝-폴리싱 장치 및 방법
JP7594925B2 (ja) * 2021-02-05 2024-12-05 株式会社ディスコ レーザー加工装置
TWI754553B (zh) * 2021-02-25 2022-02-01 東捷科技股份有限公司 焊接設備
DE102021106769A1 (de) 2021-03-19 2022-09-22 Pulsar Photonics Gmbh Verfahren und Fertigungssystem zur Fertigung eines Flachprodukts mit einer perforierten Struktur, Flachprodukt sowie Verwendung des Flachprodukts in einem Mikrofilter
US11555895B2 (en) 2021-04-20 2023-01-17 Innovusion, Inc. Dynamic compensation to polygon and motor tolerance using galvo control profile
GB2606725B (en) * 2021-05-17 2023-11-01 Thermo Fisher Scient Ecublens Sarl ARC scanning methods for laser induced breakdown spectroscopy applications
EP4314884A1 (en) * 2021-05-21 2024-02-07 Innovusion, Inc. Movement profiles for smart scanning using galvonometer mirror inside lidar scanner
JP2024526083A (ja) * 2021-06-21 2024-07-17 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド ビーム分析システムを含むレーザ加工装置並びにビーム特性の測定及び制御の方法
TWI798762B (zh) * 2021-07-22 2023-04-11 台達電子工業股份有限公司 雷射焊錫系統及其光束整形方法
CN115673453A (zh) * 2021-07-22 2023-02-03 台达电子工业股份有限公司 激光焊锡系统及其光束整形方法
IL312370A (en) 2021-10-25 2025-01-01 Trumpf Lasersystems Semiconductor Mfg Gmbh Deep ultraviolet light source if beam positioning device
IT202200004085A1 (it) * 2022-03-04 2023-09-04 Taumac S R L Attrezzatura per incisione/marcatura/saldatura di pezzi, particolarmente per oreficeria, bigiotteria e meccanica, e metodo di incisione/marcatura/saldatura di tali pezzi
CN118922270A (zh) * 2022-04-18 2024-11-08 雅马哈发动机株式会社 激光加工装置、激光加工方法、激光加工程序、记录介质、半导体芯片制造方法和半导体芯片
CN115190697B (zh) * 2022-07-19 2023-08-08 常州海弘电子有限公司 一种印制电路板通孔与盲孔快速金属化工艺
US12276897B2 (en) 2022-09-06 2025-04-15 Orbotech Ltd. Dynamic correction for an acousto-optic deflector
JP7470764B1 (ja) * 2022-10-14 2024-04-18 株式会社アマダ レーザ加工機、レーザ加工方法、加工プログラム作成方法、及び加工プログラムの構成方法
TW202423586A (zh) * 2022-10-27 2024-06-16 美商秀拉科技股份有限公司 雷射光束成形和圖案化的雷射製造系統及其方法
CN118046102A (zh) * 2022-11-10 2024-05-17 上海名古屋精密工具股份有限公司 激光切割物料的加工方法和应用
JP2026505788A (ja) * 2023-02-06 2026-02-18 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド レーザ加工システムにおいて熱誘起ビームポインティング誤差を補償するための方法及び装置
TWI861714B (zh) * 2023-02-08 2024-11-11 雷傑科技股份有限公司 雷射剝離方法及雷射剝離設備
KR20240143431A (ko) * 2023-03-24 2024-10-02 주식회사 엘지에너지솔루션 레이저 절단 장치
TWI869831B (zh) * 2023-04-25 2025-01-11 聚嶸科技股份有限公司 用於複合材料鑽孔的GHz脈衝串雷射光源系統與方法
TWI902558B (zh) * 2023-04-25 2025-10-21 聚嶸科技股份有限公司 用於複合材料鑽孔的GHz脈衝串雷射光源系統與方法
TWI856629B (zh) * 2023-04-27 2024-09-21 新代科技股份有限公司 雷射加工系統及其加工方法
CN116833552B (zh) * 2023-04-28 2026-02-24 聚嵘科技股份有限公司 用于切割复合材料的GHz脉冲串激光光源系统与方法
CN116833551B (zh) * 2023-04-28 2026-02-24 聚嵘科技股份有限公司 用于复合材料钻孔的GHz脉冲串激光光源系统与方法
DE102024116622A1 (de) * 2023-06-14 2024-12-19 Carl Zeiss Smt Gmbh Bauteil mit einer in einem Bauteilmaterial ausgebildeten Hohlstruktur zum Führen von Fluiden
KR102881796B1 (ko) * 2023-09-07 2025-11-05 한국생산기술연구원 극초단 레이저 펄스의 빔 형상 제어에 따른 금속 표면 흑색화 제어 시스템 및 방법
KR102706001B1 (ko) * 2023-09-14 2024-09-11 (주)퀀텀플라즈마 고속 스캐닝이 가능한 대면적 레이저 가공장치 및 가공방법
DE102023210846A1 (de) 2023-11-02 2025-05-08 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren zu einem Betrieb einer Bearbeitungsvorrichtung, mit zumindest einer Bearbeitungseinheit, insbesondere Laserbohreinheit
JP7725180B1 (ja) * 2023-11-15 2025-08-19 西進商事株式会社 アブレーション方法および分析方法
CN120101686A (zh) * 2023-12-05 2025-06-06 三赢科技（深圳）有限公司 三维轮廓测量系统
CN117389200A (zh) * 2023-12-08 2024-01-12 迈为技术(珠海)有限公司 基于声光偏转器的激光控制系统、方法和计算机设备
DE102023135197A1 (de) * 2023-12-14 2025-06-18 TRUMPF Laser SE DWM in SSL zur Parallelisierung
DE102024110083B4 (de) * 2024-04-11 2025-11-13 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Verfahren und Vorrichtung zur Formkorrektur eines optischen Bauelements mittels Laserstrahlung
US20260002874A1 (en) * 2024-06-28 2026-01-01 Wolfspeed, Inc. Multi-Channel Workpiece Inspection System
US20260026272A1 (en) * 2024-07-16 2026-01-22 Tokyo Electron Limited Substrate processing system using an optical pattern
CN118950609B (zh) * 2024-08-01 2025-09-19 哈尔滨工业大学 一种激光清洗控制方法、装置、电子设备及存储介质
CN119035829B (zh) * 2024-11-01 2025-01-24 河北鼎瓷电子科技有限公司 一种陶瓷封装基板制造设备及方法
KR20260110852A (ko) * 2025-01-06 2026-07-14 케이투레이저시스템 (주) 다공성 지지체 레이저 가공 시스템
CN120297542B (zh) * 2025-06-12 2025-09-16 深圳市智鼎自动化技术有限公司 复杂曲面的激光飞行加工轨迹规划方法及装置
CN120395147B (zh) * 2025-07-03 2025-09-19 江苏中迪节能科技有限公司 一种空冷器加工用智能型自动焊接设备
CN121340310B (zh) * 2025-12-18 2026-03-03 武汉翔明激光科技有限公司 一种获得均匀激光清洗效果的激光扫描轨迹规划方法
CN121900297B (zh) * 2026-03-19 2026-05-19 洛阳诚发电力设备有限公司 一种数控激光切割机总线式控制系统

Family Cites Families (100)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US479230A (en) * 1892-07-19 Compensator for signals
US4081653A (en) 1976-12-27 1978-03-28 Western Electric Co., Inc. Removal of thin films from substrates by laser induced explosion
US4328410A (en) 1978-08-24 1982-05-04 Slivinsky Sandra H Laser skiving system
US4432855A (en) * 1982-09-30 1984-02-21 International Business Machines Corporation Automated system for laser mask definition for laser enhanced and conventional plating and etching
US4792930A (en) * 1987-05-29 1988-12-20 Hoya Corporation Acoustooptic device capable of internally cooling an acoustooptic element
US4912487A (en) 1988-03-25 1990-03-27 Texas Instruments Incorporated Laser scanner using focusing acousto-optic device
JPH0433788A (ja) 1990-05-25 1992-02-05 Mitsubishi Electric Corp レーザ穴明け方法
US5173441A (en) * 1991-02-08 1992-12-22 Micron Technology, Inc. Laser ablation deposition process for semiconductor manufacture
US5584956A (en) * 1992-12-09 1996-12-17 University Of Iowa Research Foundation Method for producing conductive or insulating feedthroughs in a substrate
GB9324589D0 (en) * 1993-11-30 1994-01-19 Univ Southampton Beam shaping device
US5638267A (en) 1994-06-15 1997-06-10 Convolve, Inc. Method and apparatus for minimizing unwanted dynamics in a physical system
US5633747A (en) * 1994-12-21 1997-05-27 Tencor Instruments Variable spot-size scanning apparatus
US5847960A (en) 1995-03-20 1998-12-08 Electro Scientific Industries, Inc. Multi-tool positioning system
US5751585A (en) 1995-03-20 1998-05-12 Electro Scientific Industries, Inc. High speed, high accuracy multi-stage tool positioning system
WO1997046865A1 (en) * 1996-06-04 1997-12-11 Tencor Instruments Optical scanning system for surface inspection
US5837962A (en) * 1996-07-15 1998-11-17 Overbeck; James W. Faster laser marker employing acousto-optic deflection
JP3479761B2 (ja) * 1996-11-08 2003-12-15 シャープ株式会社 透明薄膜除去装置、透明薄膜除去方法および薄膜エレクトロルミネッセント素子
US6037967A (en) * 1996-12-18 2000-03-14 Etec Systems, Inc. Short wavelength pulsed laser scanner
JP3380416B2 (ja) * 1997-02-05 2003-02-24 本田技研工業株式会社 レーザ溶接装置
US5917300A (en) 1997-03-10 1999-06-29 Convolve, Inc. Method and apparatus for the control of gantry machines
US6314473B1 (en) 1998-03-05 2001-11-06 Convolve, Inc. System for removing selected unwanted frequenices in accordance with altered settings in a user interface of a data storage device
TW482705B (en) * 1999-05-28 2002-04-11 Electro Scient Ind Inc Beam shaping and projection imaging with solid state UV Gaussian beam to form blind vias
US7014885B1 (en) * 1999-07-19 2006-03-21 The United States Of America As Represented By The Secretary Of The Navy Direct-write laser transfer and processing
SE516347C2 (sv) 1999-11-17 2001-12-17 Micronic Laser Systems Ab Laserskanningssystem och metod för mikrolitografisk skrivning
WO2001052004A1 (en) 2000-01-11 2001-07-19 Electro Scientific Industries, Inc. Abbe error correction system and method
US6407363B2 (en) 2000-03-30 2002-06-18 Electro Scientific Industries, Inc. Laser system and method for single press micromachining of multilayer workpieces
US6483071B1 (en) * 2000-05-16 2002-11-19 General Scanning Inc. Method and system for precisely positioning a waist of a material-processing laser beam to process microstructures within a laser-processing site
DE10060407C2 (de) * 2000-12-05 2003-04-30 Lpkf Laser & Electronics Ag Vorrichtung zum Laserstrahlbohren
US6816294B2 (en) 2001-02-16 2004-11-09 Electro Scientific Industries, Inc. On-the-fly beam path error correction for memory link processing
US8497450B2 (en) 2001-02-16 2013-07-30 Electro Scientific Industries, Inc. On-the fly laser beam path dithering for enhancing throughput
US7245412B2 (en) 2001-02-16 2007-07-17 Electro Scientific Industries, Inc. On-the-fly laser beam path error correction for specimen target location processing
US6777645B2 (en) * 2001-03-29 2004-08-17 Gsi Lumonics Corporation High-speed, precision, laser-based method and system for processing material of one or more targets within a field
JP2003136266A (ja) 2001-10-29 2003-05-14 Sumitomo Heavy Ind Ltd レーザ加工方法及びレーザ加工装置
JP2003136270A (ja) 2001-11-02 2003-05-14 Hitachi Via Mechanics Ltd レーザ加工装置
JP2003177553A (ja) * 2001-12-13 2003-06-27 Dainippon Screen Mfg Co Ltd レーザ描画方法とその装置
US6706998B2 (en) 2002-01-11 2004-03-16 Electro Scientific Industries, Inc. Simulated laser spot enlargement
JP4270891B2 (ja) 2003-01-21 2009-06-03 三洋電機株式会社 Ｅｌ表示装置のレーザーリペア方法
US7358157B2 (en) 2002-03-27 2008-04-15 Gsi Group Corporation Method and system for high-speed precise laser trimming, scan lens system for use therein and electrical device produced thereby
DE10249868B3 (de) * 2002-10-25 2004-04-29 Siemens Ag Verfahren zum Bohren von Löchern in einem aus Polymermaterial mit Glasfaserverstärkung gebildeten Substrat
JP4143391B2 (ja) 2002-12-02 2008-09-03 Ｎｅｃエンジニアリング株式会社 マルチビーム・マルチヘッド描画装置
US6706999B1 (en) 2003-02-24 2004-03-16 Electro Scientific Industries, Inc. Laser beam tertiary positioner apparatus and method
US6809289B2 (en) 2003-03-05 2004-10-26 The Hong Kong Polytechnic University Method of drilling a circuit board
AU2003902527A0 (en) * 2003-05-22 2003-06-05 Macquarie University Method for fabricating microstructures
US6947454B2 (en) 2003-06-30 2005-09-20 Electro Scientific Industries, Inc. Laser pulse picking employing controlled AOM loading
CN2667723Y (zh) 2003-09-19 2004-12-29 富士康(昆山)电脑接插件有限公司 电连接器组件
JP4348199B2 (ja) 2004-01-16 2009-10-21 日立ビアメカニクス株式会社 レーザ加工方法およびレーザ加工装置
US7133188B2 (en) 2004-06-07 2006-11-07 Electro Scientific Industries, Inc. AOM modulation techniques employing an upstream Bragg adjustment device
GB2429843B (en) * 2004-06-18 2009-07-08 Electro Scient Ind Inc Semiconductor structure processing using multiple laser beam spots
US7259354B2 (en) 2004-08-04 2007-08-21 Electro Scientific Industries, Inc. Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories
US7366378B2 (en) * 2004-10-29 2008-04-29 Matsushita Electric Industrial Co., Ltd. Ultrafast laser machining system and method for forming diffractive structures in optical fibers
US20060114948A1 (en) 2004-11-29 2006-06-01 Lo Ho W Workpiece processing system using a common imaged optical assembly to shape the spatial distributions of light energy of multiple laser beams
US7834293B2 (en) 2006-05-02 2010-11-16 Electro Scientific Industries, Inc. Method and apparatus for laser processing
US7605343B2 (en) 2006-05-24 2009-10-20 Electro Scientific Industries, Inc. Micromachining with short-pulsed, solid-state UV laser
US20080083706A1 (en) * 2006-10-05 2008-04-10 Mu-Gahat Enterprises, Llc Reverse side film laser circuit etching
US8026158B2 (en) 2007-06-01 2011-09-27 Electro Scientific Industries, Inc. Systems and methods for processing semiconductor structures using laser pulses laterally distributed in a scanning window
WO2008157666A1 (en) * 2007-06-19 2008-12-24 The Government Of The United States Of America, As Represented By The Secretary Of The Navy Sub-micron laser direct write
US8076605B2 (en) 2007-06-25 2011-12-13 Electro Scientific Industries, Inc. Systems and methods for adapting parameters to increase throughput during laser-based wafer processing
JP4937011B2 (ja) 2007-06-26 2012-05-23 住友重機械工業株式会社 レーザ加工装置及びレーザ加工方法
GB0800333D0 (en) 2008-01-09 2008-02-20 Ucl Business Plc Beam deflection apparatus and methods
CN102006964B (zh) 2008-03-21 2016-05-25 Imra美国公司 基于激光的材料加工方法和系统
US8598490B2 (en) 2008-03-31 2013-12-03 Electro Scientific Industries, Inc. Methods and systems for laser processing a workpiece using a plurality of tailored laser pulse shapes
US7982160B2 (en) * 2008-03-31 2011-07-19 Electro Scientific Industries, Inc. Photonic clock stabilized laser comb processing
CN101990729B (zh) 2008-03-31 2013-02-27 伊雷克托科学工业股份有限公司 结合多重激光束以形成高重复率、高平均功率的极化激光束
US8680430B2 (en) 2008-12-08 2014-03-25 Electro Scientific Industries, Inc. Controlling dynamic and thermal loads on laser beam positioning system to achieve high-throughput laser processing of workpiece features
WO2010067042A1 (en) * 2008-12-13 2010-06-17 M-Solv Limited Method and apparatus for laser machining relatively narrow and relatively wide structures
GB0900036D0 (en) * 2009-01-03 2009-02-11 M Solv Ltd Method and apparatus for forming grooves with complex shape in the surface of apolymer
US8663754B2 (en) * 2009-03-09 2014-03-04 Imra America, Inc. Pulsed laser micro-deposition pattern formation
TWI594828B (zh) 2009-05-28 2017-08-11 伊雷克托科學工業股份有限公司 應用於雷射處理工件中的特徵的聲光偏轉器及相關雷射處理方法
US8680429B2 (en) * 2009-11-10 2014-03-25 Instrument Associates LLC Laser beam scribing system
TWI430000B (zh) 2010-07-02 2014-03-11 Ind Tech Res Inst 平面顯示器之修補方法與系統
DE102010025968B4 (de) 2010-07-02 2016-06-02 Schott Ag Erzeugung von Mikrolöchern
KR102383125B1 (ko) * 2010-10-22 2022-04-08 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 빔 디더링 및 스카이빙을 위한 레이저 처리 시스템 및 방법
US8958052B2 (en) 2010-11-04 2015-02-17 Micronic Ab Multi-method and device with an advanced acousto-optic deflector (AOD) and a dense brush of flying spots
JP2012115899A (ja) 2010-11-09 2012-06-21 Amada Co Ltd レーザ切断加工方法及びレーザ加工装置
JP2012115844A (ja) 2010-11-29 2012-06-21 Mitsubishi Electric Corp レーザ加工方法
US8648277B2 (en) 2011-03-31 2014-02-11 Electro Scientific Industries, Inc. Laser direct ablation with picosecond laser pulses at high pulse repetition frequencies
JP6087916B2 (ja) * 2011-07-05 2017-03-01 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド 使用中の音響光学ビーム偏向器および音響光学変調器の温度安定性を実現するためのシステムならびに方法
DE102012207220A1 (de) * 2012-04-30 2013-10-31 Robert Bosch Gmbh Verfahren zur Bearbeitung eines Werkstücks mit Laserstrahlung
US9259802B2 (en) 2012-07-26 2016-02-16 Electro Scientific Industries, Inc. Method and apparatus for collecting material produced by processing workpieces
US9610653B2 (en) 2012-09-21 2017-04-04 Electro Scientific Industries, Inc. Method and apparatus for separation of workpieces and articles produced thereby
WO2014066251A1 (en) * 2012-10-22 2014-05-01 Electro Scientific Industries, Inc. Method and apparatus for marking an article
KR102208818B1 (ko) * 2012-11-20 2021-01-28 삼성디스플레이 주식회사 레이저 가공 장치
CN103056517A (zh) 2012-12-28 2013-04-24 江苏大学 一种三维激光清洗装置
CN104903044B (zh) 2013-01-11 2018-01-12 伊雷克托科学工业股份有限公司 激光脉冲能量控制系统及方法
DE102013201968B4 (de) 2013-02-07 2014-08-28 BLZ Bayerisches Laserzentrum Gemeinnützige Forschungsgesellschaft mbH Vorrichtung zur akustooptischen Umformung periodisch gepulster, elektromagnetischer Strahlung
US9842665B2 (en) 2013-02-21 2017-12-12 Nlight, Inc. Optimization of high resolution digitally encoded laser scanners for fine feature marking
US9527159B2 (en) 2013-03-15 2016-12-27 Electro Scientific Industries, Inc. Laser emission-based control of beam positioner
TWI637803B (zh) * 2013-03-15 2018-10-11 美商伊雷克托科學工業股份有限公司 雷射處理設備和經由雷射工具操作而處理工件的方法
JP2016516584A (ja) 2013-03-15 2016-06-09 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド テーパ制御のためのビーム角度とワークピース移動の連係方法
KR102245810B1 (ko) 2013-03-15 2021-04-30 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 Aod 라우트 프로세싱을 위한 레이저 시스템들 및 방법들
WO2014153280A1 (en) * 2013-03-22 2014-09-25 Merck Sharp & Dohme Corp. 2-pyridyl carboxamide-containing spleen tyrosine kinase (syk) inhibitors
CN103418913A (zh) * 2013-08-13 2013-12-04 中国航空工业集团公司北京航空制造工程研究所 一种超短脉冲激光加工小孔装置及小孔加工方法
JP2015088604A (ja) 2013-10-30 2015-05-07 昭和電工株式会社 孔を有する誘電体層の製造方法および孔を有する誘電体層を含む素子の製造方法
WO2015108991A2 (en) 2014-01-17 2015-07-23 Imra America, Inc. Laser-based modification of transparent materials
US9434006B2 (en) * 2014-09-23 2016-09-06 Attostat, Inc. Composition containing spherical and coral-shaped nanoparticles and method of making same
JP2016068149A (ja) 2014-10-02 2016-05-09 株式会社ディスコ レーザー加工装置
JP2018507782A (ja) * 2015-02-23 2018-03-22 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド 広範囲の改質のためのレーザシステム及び方法
WO2016144290A1 (en) * 2015-03-06 2016-09-15 Intel Corporation Acousto-optics deflector and mirror for laser beam steering
JP2019512397A (ja) * 2016-03-17 2019-05-16 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド レーザ加工システムにおける像平面の配置
KR102577671B1 (ko) * 2017-11-15 2023-09-12 그라낫 리서치, 리미티드 금속 액적 분사 시스템

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