JP6914309B2 - シート型絶縁ワニス及びその製造方法、電気機器、並びに回転電機 - Google Patents
シート型絶縁ワニス及びその製造方法、電気機器、並びに回転電機 Download PDFInfo
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- JP6914309B2 JP6914309B2 JP2019198174A JP2019198174A JP6914309B2 JP 6914309 B2 JP6914309 B2 JP 6914309B2 JP 2019198174 A JP2019198174 A JP 2019198174A JP 2019198174 A JP2019198174 A JP 2019198174A JP 6914309 B2 JP6914309 B2 JP 6914309B2
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- sheet
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- thermosetting resin
- insulating varnish
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- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 239000002981 blocking agent Substances 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- BXIQXYOPGBXIEM-UHFFFAOYSA-N butyl 4,4-bis(tert-butylperoxy)pentanoate Chemical compound CCCCOC(=O)CCC(C)(OOC(C)(C)C)OOC(C)(C)C BXIQXYOPGBXIEM-UHFFFAOYSA-N 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 229920006026 co-polymeric resin Polymers 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 150000001896 cresols Chemical class 0.000 description 1
- SPTHWAJJMLCAQF-UHFFFAOYSA-M ctk4f8481 Chemical compound [O-]O.CC(C)C1=CC=CC=C1C(C)C SPTHWAJJMLCAQF-UHFFFAOYSA-M 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- 239000012933 diacyl peroxide Substances 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- LZFQGEMBQPYJJJ-UHFFFAOYSA-N ethanamine;trichloroborane Chemical compound CCN.ClB(Cl)Cl LZFQGEMBQPYJJJ-UHFFFAOYSA-N 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 229920001973 fluoroelastomer Polymers 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- QUPCNWFFTANZPX-UHFFFAOYSA-N hydrogen peroxide;1-methyl-4-propan-2-ylcyclohexane Chemical compound OO.CC(C)C1CCC(C)CC1 QUPCNWFFTANZPX-UHFFFAOYSA-N 0.000 description 1
- 150000002432 hydroperoxides Chemical class 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- STQYDSASXIHUJU-UHFFFAOYSA-N n-ethylethanamine;trifluoroborane Chemical compound FB(F)F.CCNCC STQYDSASXIHUJU-UHFFFAOYSA-N 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- YRZFHTRSHNGOSR-UHFFFAOYSA-N phenylmethanamine;trifluoroborane Chemical compound FB(F)F.NCC1=CC=CC=C1 YRZFHTRSHNGOSR-UHFFFAOYSA-N 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003055 poly(ester-imide) Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- CIQUNISKQPOPCF-UHFFFAOYSA-N propan-2-amine;trifluoroborane Chemical compound CC(C)N.FB(F)F CIQUNISKQPOPCF-UHFFFAOYSA-N 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- SWAXTRYEYUTSAP-UHFFFAOYSA-N tert-butyl ethaneperoxoate Chemical compound CC(=O)OOC(C)(C)C SWAXTRYEYUTSAP-UHFFFAOYSA-N 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- VPYJNCGUESNPMV-UHFFFAOYSA-N triallylamine Chemical compound C=CCN(CC=C)CC=C VPYJNCGUESNPMV-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Description
以下に、実施の形態1による熱硬化性樹脂組成物について説明する。実施の形態1による熱硬化性樹脂組成物は、絶縁対象の部材同士の隙間に配置されるシート型絶縁ワニス用の樹脂組成物であって、部材同士の隙間の少なくとも一部はほぼ一定の寸法を有するものである(以下、これを隙間の寸法という)。なお、以下の説明において、熱硬化性樹脂(A)及び熱硬化性樹脂(B)を特に区別せず両方を指す場合、あるいはこれらの混合樹脂を指す場合は、単に「熱硬化性樹脂」と記す。また、常温とは約25℃を示す。
実施の形態2では、上記実施の形態1による熱硬化性樹脂組成物を用いたシート型絶縁ワニスの製造方法と、シート型絶縁ワニスの物性について説明する。シート型絶縁ワニスは、上記実施の形態1による熱硬化性樹脂組成物を未硬化または半硬化の状態で膜厚1μm〜500μmのシート状に形成したものである。
実施の形態3では、上記実施の形態2によるシート型絶縁ワニスの電源デバイスへの使用例について、図4を用いて説明する。なお、実施の形態3では、電源デバイスを例に挙げているが、これに限定されるものではなく、シート型絶縁ワニスは電子機器を含む電気機器全般に適用可能である。電源デバイスとしては、例えばスイッチング方式のDC−DCコンバータ、AC−DCコンバータ等がある。
実施の形態4では、上記実施の形態2によるシート型絶縁ワニスの回転電機への使用例について、図5から図9を用いて説明する。電動機、発電機、圧縮機等の回転電機は、図5及び図6に示すように、固定子コイル11と円環状の固定子鉄心12を含む固定子20を備えている。固定子鉄心12のティース部13の間には、所定数のスロット14が周方向に設けられ、スロット14内に固定子コイル11が収納される。
(1−1)ビスフェノールA型エポキシ樹脂(エポキシ当量720、軟化点90℃)
(1−2)ビスフェノールF型エポキシ樹脂(エポキシ当量4200、軟化点135℃)
(1−3)フェノールノボラック型エポキシ樹脂(エポキシ当量190、軟化点150℃)
(1−4)ビスフェノールA型ビニルエステル樹脂(重合平均分子量2000、軟化点80℃)
(2−1)ビスフェノールA型エポキシ樹脂(エポキシ当量184)
(2−2)ビスフェノールF型エポキシ樹脂(エポキシ当量165)
(2−3)ネオペンチルグリコールジメタクリレート(重合平均分子量240)
(3−1)三フッ化ホウ素モノエチルアミン錯体(反応開始温度120℃)
(3−2)ジシアンジアミド(反応開始温度160℃)
(3−3)プロピレンアミン(常温で反応活性)
(3−4)2,5−ジメチル−2,5−ジ(t−ブチルパーオキシ)ヘキサン(10時間半減期温度117.9℃)
(3−5)クミルパーオキシネオデカノエート(10時間半減期温度36.5℃)
(4−1)1−シアノエチル−2−メチルイミダゾール(反応開始温度100℃)
(4−2)1,8−ジアザビシクロ[5.4.0]ウンデセン−7(反応開始温度100℃)
(5−1)フェノキシ樹脂(重合平均分子量10万)
(5−2)ポリエステル樹脂(重合平均分子量5万)
<粘着付与剤>
(6−1)ポリビニルアセタール樹脂(重合平均分子量10万)
(7−1)溶融シリカ(最大粒径7μm、平均粒径2μm)
(7−2)結晶シリカ(最大粒径550μm、平均粒径200μm)
(7−3)アルミナ(最大粒径18μm、平均粒径5μm)
(7−4)炭酸カルシウム(最大粒径10μm、平均粒径3μm)
実施例1−6によるシート型絶縁ワニスの評価結果を表3に、比較例1−6によるシート型絶縁ワニスの評価結果を表4にそれぞれ示す。
Claims (20)
- 絶縁対象の部材同士の隙間に配置されるシート型絶縁ワニスであって、前記隙間の少なくとも一部は一定の寸法を有するものであり、
25℃で固体の熱硬化性樹脂(A)と、25℃で液状の熱硬化性樹脂(B)と、60℃以下で反応不活性な潜在性硬化剤と、最大粒径が前記隙間の前記寸法よりも小さく平均粒径が前記隙間の前記寸法の0.5倍よりも小さい無機充填剤とを含む熱硬化性樹脂組成物が未硬化または半硬化の状態で一定の膜厚のシート状に形成されており、
前記熱硬化性樹脂(A)と前記熱硬化性樹脂(B)の合計100質量部に対して、前記熱硬化性樹脂(A)を30質量部〜70質量部含み、
前記無機充填剤の組成物全量に対する体積比が50%以下であり、
25℃で25MPaの圧力を加えた時に前記膜厚が10%以上減少する圧縮率を有することを特徴とするシート型絶縁ワニス。 - 前記熱硬化性樹脂(A)及び前記熱硬化性樹脂(B)は、エポキシ樹脂、フェノール樹脂、及び不飽和ポリエステル樹脂の少なくとも1つを含むことを特徴とする請求項1記載のシート型絶縁ワニス。
- 前記熱硬化性樹脂(A)は、軟化点が50℃〜160℃であるエポキシ樹脂であることを特徴とする請求項1記載のシート型絶縁ワニス。
- 前記潜在性硬化剤は、三フッ化ホウ素−アミン錯体、ジシアンジアミド、有機酸ヒドラジッドのいずれかであることを特徴とする請求項1から請求項3のいずれか一項に記載のシート型絶縁ワニス。
- 60℃以下で反応不活性な硬化促進剤を含むことを特徴とする請求項1から請求項4のいずれか一項に記載のシート型絶縁ワニス。
- 重量平均分子量が10,000〜100,000の熱可塑性樹脂を含み、前記熱可塑性樹脂は、前記熱硬化性樹脂(A)と前記熱硬化性樹脂(B)の合計100質量部に対して1質量部〜40質量部であることを特徴とする請求項1から請求項5のいずれか一項に記載のシート型絶縁ワニス。
- 前記熱可塑性樹脂は、フェノキシ樹脂またはポリエステル樹脂であることを特徴とする請求項6記載のシート型絶縁ワニス。
- 前記膜厚は、1μm〜500μmであることを特徴とする請求項1から請求項7のいずれか一項に記載のシート型絶縁ワニス。
- 前記膜厚は、前記隙間の前記寸法の1.1倍以上に設定されることを特徴とする請求項1から請求項8のいずれか一項に記載のシート型絶縁ワニス。
- 全質量100重量部に対して不揮発分が97質量部以上であることを特徴とする請求項1から請求項9のいずれか一項に記載のシート型絶縁ワニス。
- 25℃での貯蔵せん断弾性率が1.0×103Pa〜5.0×104Paであり、貯蔵せん断弾性率の最低値が80℃〜150℃にあって10Pa〜2.0×103Paであることを特徴とする請求項1から請求項10のいずれか一項に記載のシート型絶縁ワニス。
- 25℃での複素粘度が6.0×102Pa・s〜1.0×104Pa・sであり、複素粘度の最低値が80℃〜150℃にあって5.0×102Pa・s以下であることを特徴とする請求項1から請求項11のいずれか一項に記載のシート型絶縁ワニス。
- 前記部材同士の前記隙間に配置された時の部材との接着力が20N/m以上であることを特徴とする請求項1から請求項12のいずれか一項に記載のシート型絶縁ワニス。
- 一方の表面に離型フィルムまたは離型紙が配置されていることを特徴とする請求項1から請求項13のいずれか一項に記載のシート型絶縁ワニス。
- 電子部品が搭載された基板と、前記基板が固定された筐体とを備えた電気機器であって、
前記電子部品と前記基板の隙間、または前記基板と前記筐体の隙間に、請求項1から請求項14のいずれか一項に記載のシート型絶縁ワニスが配置されたことを特徴とする電気機器。 - 固定子鉄心のスロット内に固定子コイルが収納された回転電機であって、
前記スロットの内壁と前記固定子コイルの隙間に、請求項1から請求項14のいずれか一項に記載のシート型絶縁ワニスが配置されたことを特徴とする回転電機。 - 前記隙間に絶縁紙が配置され、前記絶縁紙の前記固定子コイルの側、または前記絶縁紙の両側に前記シート型絶縁ワニスが配置されたことを特徴とする請求項16記載の回転電機。
- 絶縁対象の部材同士の隙間に配置されるシート型絶縁ワニスの製造方法であって、
前記隙間の少なくとも一部は一定の寸法を有するものであり、
25℃で固体の熱硬化性樹脂(A)と、25℃で液状の熱硬化性樹脂(B)と、60℃以下で反応不活性な潜在性硬化剤と、最大粒径が前記隙間の前記寸法よりも小さく平均粒径が前記隙間の前記寸法の0.5倍よりも小さい無機充填剤と、希釈用有機溶剤とを攪拌混合し、熱硬化性樹脂組成物のスラリーを作製する第1の工程と、
前記スラリーを離型フィルムまたは離型紙に前記隙間の前記寸法の1.1倍〜2.0倍の膜厚に塗布し乾燥させる第2の工程とを含み、
前記第1の工程において、前記熱硬化性樹脂組成物は、前記熱硬化性樹脂(A)と前記熱硬化性樹脂(B)の合計100質量部に対して前記熱硬化性樹脂(A)を30質量部〜70質量部含み、前記無機充填剤の組成物全量に対する体積比が50%以下であり、
前記第2の工程において、25℃で25MPaの圧力を加えた時に前記膜厚が10%以上減少する圧縮率を有するように乾燥状態が決定されることを特徴とするシート型絶縁ワニスの製造方法。 - 前記第2の工程において、80℃〜160℃の温度条件で乾燥して希釈剤を揮発させ、乾燥後のシート型絶縁ワニスの全質量100重量部に対する不揮発分を97質量部以上とすることを特徴とする請求項18記載のシート型絶縁ワニスの製造方法。
- 前記第2の工程の後、硬化反応を進めるための加熱をさらに行い、半硬化状態とすることを特徴とする請求項18または請求項19に記載のシート型絶縁ワニスの製造方法。
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