JP6889452B1 - イメージセンサモジュール、及び、イメージセンサモジュールの製造方法 - Google Patents

イメージセンサモジュール、及び、イメージセンサモジュールの製造方法 Download PDF

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Publication number
JP6889452B1
JP6889452B1 JP2020559579A JP2020559579A JP6889452B1 JP 6889452 B1 JP6889452 B1 JP 6889452B1 JP 2020559579 A JP2020559579 A JP 2020559579A JP 2020559579 A JP2020559579 A JP 2020559579A JP 6889452 B1 JP6889452 B1 JP 6889452B1
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Japan
Prior art keywords
image sensor
sensor chip
cover glass
gap
sensor module
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JP2020559579A
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English (en)
Japanese (ja)
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JPWO2021095193A1 (ja
Inventor
中村　博文
博文 中村
高橋　康
康 高橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AULA-DIUS LLC.
T-ABLE CO.,LTD.
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AULA-DIUS LLC.
T-ABLE CO.,LTD.
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Publication of JP6889452B1 publication Critical patent/JP6889452B1/ja
Publication of JPWO2021095193A1 publication Critical patent/JPWO2021095193A1/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Solid State Image Pick-Up Elements (AREA)
JP2020559579A 2019-11-14 2019-11-14 イメージセンサモジュール、及び、イメージセンサモジュールの製造方法 Active JP6889452B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/044651 WO2021095193A1 (fr) 2019-11-14 2019-11-14 Module de capteur d'image et procédé de fabrication de module de capteur d'image

Publications (2)

Publication Number Publication Date
JP6889452B1 true JP6889452B1 (ja) 2021-06-18
JPWO2021095193A1 JPWO2021095193A1 (ja) 2021-11-25

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JP2020559579A Active JP6889452B1 (ja) 2019-11-14 2019-11-14 イメージセンサモジュール、及び、イメージセンサモジュールの製造方法

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JP (1) JP6889452B1 (fr)
CN (1) CN114651324B (fr)
WO (1) WO2021095193A1 (fr)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006332680A (ja) * 2005-05-27 2006-12-07 Avago Technologies General Ip (Singapore) Private Ltd イメージセンサをパッケージングするための方法及びパッケージングされたイメージセンサ
WO2008032404A1 (fr) * 2006-09-15 2008-03-20 Fujitsu Microelectronics Limited Dispositif à semi-conducteur et son procédé de fabrication
US8072083B1 (en) * 2006-02-17 2011-12-06 Amkor Technology, Inc. Stacked electronic component package having film-on-wire spacer
JP2014075480A (ja) * 2012-10-04 2014-04-24 Seiko Instruments Inc 光学デバイス及び光学デバイスの製造方法
JP2017538933A (ja) * 2014-12-11 2017-12-28 フィンガープリント カーズ アクティエボラーグ 指紋感知装置
WO2018030140A1 (fr) * 2016-08-08 2018-02-15 ソニーセミコンダクタソリューションズ株式会社 Élément d'imagerie, procédé de production et dispositif électronique
JP2019036704A (ja) * 2017-08-15 2019-03-07 キングパック テクノロジー インコーポレイテッドＫｉｎｇｐａｋ Ｔｅｃｈｎｏｌｏｇｙ Ｉｎｃ． 積層型センサ実装構造

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006332680A (ja) * 2005-05-27 2006-12-07 Avago Technologies General Ip (Singapore) Private Ltd イメージセンサをパッケージングするための方法及びパッケージングされたイメージセンサ
US8072083B1 (en) * 2006-02-17 2011-12-06 Amkor Technology, Inc. Stacked electronic component package having film-on-wire spacer
WO2008032404A1 (fr) * 2006-09-15 2008-03-20 Fujitsu Microelectronics Limited Dispositif à semi-conducteur et son procédé de fabrication
JP2014075480A (ja) * 2012-10-04 2014-04-24 Seiko Instruments Inc 光学デバイス及び光学デバイスの製造方法
JP2017538933A (ja) * 2014-12-11 2017-12-28 フィンガープリント カーズ アクティエボラーグ 指紋感知装置
WO2018030140A1 (fr) * 2016-08-08 2018-02-15 ソニーセミコンダクタソリューションズ株式会社 Élément d'imagerie, procédé de production et dispositif électronique
JP2019036704A (ja) * 2017-08-15 2019-03-07 キングパック テクノロジー インコーポレイテッドＫｉｎｇｐａｋ Ｔｅｃｈｎｏｌｏｇｙ Ｉｎｃ． 積層型センサ実装構造

Also Published As

Publication number Publication date
CN114651324B (zh) 2024-05-07
WO2021095193A1 (fr) 2021-05-20
JPWO2021095193A1 (ja) 2021-11-25
CN114651324A (zh) 2022-06-21

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