JP6886866B2 - 減圧乾燥装置 - Google Patents

減圧乾燥装置 Download PDF

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Publication number
JP6886866B2
JP6886866B2 JP2017107517A JP2017107517A JP6886866B2 JP 6886866 B2 JP6886866 B2 JP 6886866B2 JP 2017107517 A JP2017107517 A JP 2017107517A JP 2017107517 A JP2017107517 A JP 2017107517A JP 6886866 B2 JP6886866 B2 JP 6886866B2
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JP
Japan
Prior art keywords
solvent
exhaust
chamber
collecting portion
substrate
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Active
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JP2017107517A
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English (en)
Japanese (ja)
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JP2018204810A (ja
Inventor
明典 島村
明典 島村
林　輝幸
輝幸 林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2017107517A priority Critical patent/JP6886866B2/ja
Priority to TW107116715A priority patent/TWI766997B/zh
Priority to KR1020180056369A priority patent/KR102474469B1/ko
Priority to CN201810552163.9A priority patent/CN108987310A/zh
Publication of JP2018204810A publication Critical patent/JP2018204810A/ja
Application granted granted Critical
Publication of JP6886866B2 publication Critical patent/JP6886866B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Solid Materials (AREA)
JP2017107517A 2017-05-31 2017-05-31 減圧乾燥装置 Active JP6886866B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2017107517A JP6886866B2 (ja) 2017-05-31 2017-05-31 減圧乾燥装置
TW107116715A TWI766997B (zh) 2017-05-31 2018-05-17 減壓乾燥裝置及減壓乾燥方法
KR1020180056369A KR102474469B1 (ko) 2017-05-31 2018-05-17 감압 건조 장치
CN201810552163.9A CN108987310A (zh) 2017-05-31 2018-05-31 减压干燥装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017107517A JP6886866B2 (ja) 2017-05-31 2017-05-31 減圧乾燥装置

Publications (2)

Publication Number Publication Date
JP2018204810A JP2018204810A (ja) 2018-12-27
JP6886866B2 true JP6886866B2 (ja) 2021-06-16

Family

ID=64540249

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017107517A Active JP6886866B2 (ja) 2017-05-31 2017-05-31 減圧乾燥装置

Country Status (4)

Country Link
JP (1) JP6886866B2 (zh)
KR (1) KR102474469B1 (zh)
CN (1) CN108987310A (zh)
TW (1) TWI766997B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6920131B2 (ja) * 2017-08-10 2021-08-18 東京エレクトロン株式会社 減圧乾燥装置
KR102206766B1 (ko) * 2019-02-18 2021-01-25 엘지전자 주식회사 감압 건조 장치

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4022186B2 (ja) 2003-09-04 2007-12-12 東京エレクトロン株式会社 減圧乾燥装置、減圧乾燥方法及び捕集装置
JP5089288B2 (ja) * 2007-01-26 2012-12-05 大日本スクリーン製造株式会社 減圧乾燥装置
TWI385266B (zh) * 2010-05-25 2013-02-11 Univ Shu Te Atomization coating device
JP6114636B2 (ja) * 2013-06-06 2017-04-12 東京エレクトロン株式会社 乾燥装置及び乾燥処理方法
JP6189161B2 (ja) * 2013-09-27 2017-08-30 東京エレクトロン株式会社 乾燥装置、乾燥処理方法、基板ホルダ及び溶媒吸着シート
JP6429189B2 (ja) * 2014-11-27 2018-11-28 エリーパワー株式会社 真空乾燥装置、真空乾燥方法、および電池電極の製造方法
JP6639175B2 (ja) * 2015-09-29 2020-02-05 東京エレクトロン株式会社 乾燥装置及び乾燥処理方法

Also Published As

Publication number Publication date
TW201907132A (zh) 2019-02-16
JP2018204810A (ja) 2018-12-27
CN108987310A (zh) 2018-12-11
TWI766997B (zh) 2022-06-11
KR102474469B1 (ko) 2022-12-05
KR20180131400A (ko) 2018-12-10

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