JP6877271B2 - 光モジュールの製造方法 - Google Patents

光モジュールの製造方法 Download PDF

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JP6877271B2
JP6877271B2 JP2017131656A JP2017131656A JP6877271B2 JP 6877271 B2 JP6877271 B2 JP 6877271B2 JP 2017131656 A JP2017131656 A JP 2017131656A JP 2017131656 A JP2017131656 A JP 2017131656A JP 6877271 B2 JP6877271 B2 JP 6877271B2
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solder
ceramic substrate
metal block
groove
width
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JP2019016658A (ja
JP2019016658A5 (enExample
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米田　裕
裕 米田
藤野　純司
純司 藤野
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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JP2017131656A 2017-07-05 2017-07-05 光モジュールの製造方法 Active JP6877271B2 (ja)

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JP2017131656A JP6877271B2 (ja) 2017-07-05 2017-07-05 光モジュールの製造方法

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JP2019016658A JP2019016658A (ja) 2019-01-31
JP2019016658A5 JP2019016658A5 (enExample) 2020-04-23
JP6877271B2 true JP6877271B2 (ja) 2021-05-26

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112367773A (zh) * 2020-10-28 2021-02-12 安徽瑞迪微电子有限公司 Dbc基板与芯片焊接方法
JP7795089B2 (ja) * 2022-03-03 2026-01-07 日亜化学工業株式会社 発光装置、パッケージの製造方法、および発光装置の製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61196545A (ja) * 1985-02-26 1986-08-30 Rohm Co Ltd ペレツトボンデイング方法
JPS6252947U (enExample) * 1985-09-24 1987-04-02
JPS62140484A (ja) * 1985-12-16 1987-06-24 Hitachi Ltd 光半導体装置
JP2622029B2 (ja) * 1990-05-18 1997-06-18 株式会社東芝 半導体発光装置
JP3183247B2 (ja) * 1998-02-27 2001-07-09 日本電気株式会社 半導体レーザモジュール
JP2000068583A (ja) * 1998-08-18 2000-03-03 Mitsubishi Electric Corp 半導体レーザ装置
JP2000349099A (ja) * 1999-06-07 2000-12-15 Toshiba Corp はんだ接合方法および、半導体装置の製造方法
JP2004325826A (ja) * 2003-04-25 2004-11-18 Fuji Photo Film Co Ltd 光学部材の固定方法および固定構造
US20060018355A1 (en) * 2004-07-23 2006-01-26 Comlasc.Nt-Ab Laser diode arrays with reduced heat induced strain and stress
JP2010161159A (ja) * 2009-01-07 2010-07-22 Calsonic Kansei Corp ベアチップのダイボンド方法及びベアチップ実装部品
US9455547B2 (en) * 2013-05-13 2016-09-27 Mitsubishi Electric Corporation Semiconductor laser device

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