JP6871812B2 - シート貼付装置および貼付方法 - Google Patents

シート貼付装置および貼付方法 Download PDF

Info

Publication number
JP6871812B2
JP6871812B2 JP2017121484A JP2017121484A JP6871812B2 JP 6871812 B2 JP6871812 B2 JP 6871812B2 JP 2017121484 A JP2017121484 A JP 2017121484A JP 2017121484 A JP2017121484 A JP 2017121484A JP 6871812 B2 JP6871812 B2 JP 6871812B2
Authority
JP
Japan
Prior art keywords
adherend
adhesive sheet
pressing
sheet
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017121484A
Other languages
English (en)
Japanese (ja)
Other versions
JP2019009182A (ja
Inventor
高野　健
健 高野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Priority to JP2017121484A priority Critical patent/JP6871812B2/ja
Priority to KR1020180063281A priority patent/KR102426175B1/ko
Priority to TW107119763A priority patent/TWI750381B/zh
Priority to CN201810637148.4A priority patent/CN109103126B/zh
Publication of JP2019009182A publication Critical patent/JP2019009182A/ja
Application granted granted Critical
Publication of JP6871812B2 publication Critical patent/JP6871812B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Labeling Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Dicing (AREA)
  • Mechanical Engineering (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
JP2017121484A 2017-06-21 2017-06-21 シート貼付装置および貼付方法 Active JP6871812B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2017121484A JP6871812B2 (ja) 2017-06-21 2017-06-21 シート貼付装置および貼付方法
KR1020180063281A KR102426175B1 (ko) 2017-06-21 2018-06-01 시트 첩부 장치 및 첩부 방법
TW107119763A TWI750381B (zh) 2017-06-21 2018-06-08 薄片貼附裝置及貼附方法
CN201810637148.4A CN109103126B (zh) 2017-06-21 2018-06-20 贴片装置及粘贴方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017121484A JP6871812B2 (ja) 2017-06-21 2017-06-21 シート貼付装置および貼付方法

Publications (2)

Publication Number Publication Date
JP2019009182A JP2019009182A (ja) 2019-01-17
JP6871812B2 true JP6871812B2 (ja) 2021-05-12

Family

ID=64844868

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017121484A Active JP6871812B2 (ja) 2017-06-21 2017-06-21 シート貼付装置および貼付方法

Country Status (4)

Country Link
JP (1) JP6871812B2 (zh)
KR (1) KR102426175B1 (zh)
CN (1) CN109103126B (zh)
TW (1) TWI750381B (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109986793B (zh) * 2019-04-26 2023-07-25 宜昌达瑞机电科技有限公司 一种蒸发器真空贴海绵装置
JP7521902B2 (ja) * 2020-02-14 2024-07-24 株式会社ディスコ テープ貼着装置
TWI777780B (zh) * 2021-09-23 2022-09-11 均華精密工業股份有限公司 供膜裝置及預剝膜機台
CN114701715B (zh) * 2022-05-10 2023-03-24 通通印标签(苏州)有限公司 一种基于传输带的自动化贴标签系统

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4302284B2 (ja) * 2000-03-29 2009-07-22 リンテック株式会社 半導体ウェハの移載装置
JP2005033119A (ja) * 2003-07-11 2005-02-03 Nitto Denko Corp 半導体ウエハ搬送方法および搬送装置
WO2009091333A2 (en) * 2008-01-14 2009-07-23 Lintec Singapore Pte. Ltd. Method and apparatus for laminating a bumped wafer
JP2009300542A (ja) * 2008-06-10 2009-12-24 Orc Mfg Co Ltd 露光描画装置
KR101011120B1 (ko) 2009-07-17 2011-01-25 우에노 세이끼 가부시키가이샤 재부착 장치 및 분류 재부착 방법
JP5451662B2 (ja) * 2011-02-15 2014-03-26 東京エレクトロン株式会社 液処理装置及び液処理方法
JP2013230532A (ja) * 2012-05-01 2013-11-14 Nitto Denko Corp 半導体ウエハの保護テープ切断方法および保護テープ切断装置
JP2015185670A (ja) * 2014-03-24 2015-10-22 リンテック株式会社 板状部材の支持装置および支持方法
JP6340249B2 (ja) * 2014-05-28 2018-06-06 株式会社荏原製作所 テープ貼り付け装置およびテープ貼り付け方法

Also Published As

Publication number Publication date
CN109103126A (zh) 2018-12-28
TWI750381B (zh) 2021-12-21
KR102426175B1 (ko) 2022-07-27
JP2019009182A (ja) 2019-01-17
CN109103126B (zh) 2023-04-07
TW201906049A (zh) 2019-02-01
KR20180138524A (ko) 2018-12-31

Similar Documents

Publication Publication Date Title
JP6871812B2 (ja) シート貼付装置および貼付方法
JP6965036B2 (ja) シート貼付装置および貼付方法
JP3210743U (ja) シート貼付装置
JP2021048378A (ja) シート貼付装置およびシート貼付方法
JP6476027B2 (ja) シート剥離装置および剥離方法、並びに、シート転写装置
TWI735578B (zh) 薄片貼附裝置及貼附方法
JP6857763B2 (ja) シート貼付装置および貼付方法
JP6924670B2 (ja) シート供給装置およびシート供給方法
JP2019096704A (ja) シート剥離装置および剥離方法
JP6818576B2 (ja) シート貼付装置および貼付方法
JP7165572B2 (ja) シート剥離装置およびシート剥離方法
JP7009177B2 (ja) シート剥離装置および剥離方法
JP7133432B2 (ja) シート貼付装置およびシート貼付方法
JP7016679B2 (ja) シート剥離装置および剥離方法
JP7009105B2 (ja) シート貼付装置および貼付方法
JP2017216343A (ja) シート貼付装置および貼付方法
JP6672079B2 (ja) シート貼付装置および貼付方法
JP2022146757A (ja) 清掃装置および清掃方法
JP2021192419A (ja) 転写装置および転写方法
JP2024006766A (ja) シート貼付装置およびシート貼付方法
JP2022146758A (ja) 清掃装置および清掃方法
JP2023102104A (ja) 搬送装置および搬送方法、並びに、シート貼付装置およびシート貼付方法
JP2024029591A (ja) シート貼付装置およびシート貼付方法
JP2021192420A (ja) 転写装置および転写方法
JP2022033500A (ja) シート供給装置およびシート供給方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20200401

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20210224

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20210406

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20210416

R150 Certificate of patent or registration of utility model

Ref document number: 6871812

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250