JP6866858B2 - 樹脂組成物層 - Google Patents

樹脂組成物層 Download PDF

Info

Publication number
JP6866858B2
JP6866858B2 JP2018032461A JP2018032461A JP6866858B2 JP 6866858 B2 JP6866858 B2 JP 6866858B2 JP 2018032461 A JP2018032461 A JP 2018032461A JP 2018032461 A JP2018032461 A JP 2018032461A JP 6866858 B2 JP6866858 B2 JP 6866858B2
Authority
JP
Japan
Prior art keywords
resin composition
resin
mass
composition layer
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018032461A
Other languages
English (en)
Japanese (ja)
Other versions
JP2018152556A (ja
Inventor
一彦 鶴井
一彦 鶴井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ajinomoto Co Inc
Original Assignee
Ajinomoto Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ajinomoto Co Inc filed Critical Ajinomoto Co Inc
Publication of JP2018152556A publication Critical patent/JP2018152556A/ja
Application granted granted Critical
Publication of JP6866858B2 publication Critical patent/JP6866858B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Medical Preparation Storing Or Oral Administration Devices (AREA)
  • Confectionery (AREA)
  • Materials For Medical Uses (AREA)
JP2018032461A 2017-03-10 2018-02-26 樹脂組成物層 Active JP6866858B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017046602 2017-03-10
JP2017046602 2017-03-10

Publications (2)

Publication Number Publication Date
JP2018152556A JP2018152556A (ja) 2018-09-27
JP6866858B2 true JP6866858B2 (ja) 2021-04-28

Family

ID=63576795

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018032461A Active JP6866858B2 (ja) 2017-03-10 2018-02-26 樹脂組成物層

Country Status (4)

Country Link
JP (1) JP6866858B2 (ko)
KR (1) KR102515200B1 (ko)
CN (1) CN108570213A (ko)
TW (1) TWI820018B (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7119290B2 (ja) * 2017-05-30 2022-08-17 住友ベークライト株式会社 熱硬化性樹脂組成物、キャリア付樹脂膜、プリプレグ、プリント配線基板および半導体装置
JP7123731B2 (ja) * 2018-10-11 2022-08-23 積水化学工業株式会社 樹脂材料及び多層プリント配線板
TWI840455B (zh) * 2018-12-03 2024-05-01 日商味之素股份有限公司 樹脂組成物
JP2020094089A (ja) * 2018-12-10 2020-06-18 積水化学工業株式会社 樹脂材料及び多層プリント配線板
WO2020129248A1 (ja) * 2018-12-21 2020-06-25 日立化成株式会社 封止用樹脂組成物及び電子部品装置
JPWO2020129249A1 (ja) * 2018-12-21 2021-11-04 昭和電工マテリアルズ株式会社 封止用樹脂組成物及び電子部品装置
JP6908199B2 (ja) * 2019-06-21 2021-07-21 住友ベークライト株式会社 熱硬化性樹脂組成物、樹脂シートおよび金属ベース基板

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1161351A (zh) * 1995-12-19 1997-10-08 住友化学工业株式会社 树脂组合物和具有含该树脂组合物的层的成型制品
JP2000336122A (ja) * 1999-05-31 2000-12-05 Nippon Kayaku Co Ltd Ｎ−（メタ）アクリロイル−β−ヒドロキシーアスパラギン酸の（共）重合体を含有する硬化物形成性組成物及びその硬化物
JP6123152B2 (ja) * 2010-12-08 2017-05-10 味の素株式会社 樹脂組成物
BR112014026668A2 (pt) * 2012-04-27 2017-06-27 Henkel Ag & Co Kgaa agente de cura de resina epóxi, composição de resina epóxi, adesivo de barreira de gás e laminado de barreira de gás
US20150059295A1 (en) * 2012-04-27 2015-03-05 Mitsubishi Gas Chemical Company, Inc. Epoxy resin curing agent, epoxy resin composition, and gas-barrier adhesive and gas-barrier laminate
JP6276499B2 (ja) * 2012-08-07 2018-02-07 味の素株式会社 接着フィルム、硬化体の製造方法、硬化体、配線板、及び半導体装置
CN103881310A (zh) * 2014-04-11 2014-06-25 上海神沃电子有限公司 一种无卤环保热敏电阻用环氧树脂包封材料及应用
JP6672630B2 (ja) * 2015-08-07 2020-03-25 味の素株式会社 樹脂組成物

Also Published As

Publication number Publication date
KR102515200B1 (ko) 2023-03-29
TW201842046A (zh) 2018-12-01
JP2018152556A (ja) 2018-09-27
CN108570213A (zh) 2018-09-25
TWI820018B (zh) 2023-11-01
KR20180103754A (ko) 2018-09-19

Similar Documents

Publication Publication Date Title
JP6992333B2 (ja) 樹脂組成物
JP6866858B2 (ja) 樹脂組成物層
JP7279319B2 (ja) 樹脂組成物
JP6724474B2 (ja) 樹脂シート
KR102699711B1 (ko) 수지 조성물
JP7020572B2 (ja) 樹脂組成物
KR20170064482A (ko) 수지 조성물
JP6672953B2 (ja) 樹脂シート
JP7400883B2 (ja) 樹脂組成物
JP6672954B2 (ja) 樹脂シート
JP7156433B2 (ja) 樹脂組成物
JP7272392B2 (ja) 樹脂組成物
JP6766507B2 (ja) 樹脂組成物
JP2021181229A (ja) 樹脂組成物
JP7338413B2 (ja) 樹脂組成物
JP6953709B2 (ja) 樹脂組成物
JP2020186392A (ja) 樹脂組成物
JP6926817B2 (ja) 樹脂組成物、樹脂シート、プリント配線板及び半導体装置
JP7283498B2 (ja) 樹脂シート、プリント配線板及び半導体装置
JP7247471B2 (ja) 樹脂組成物
JP6911311B2 (ja) 樹脂組成物
JP2021044569A (ja) 支持体付き樹脂シート
JP7248000B2 (ja) 樹脂組成物
JP2017154397A (ja) 支持体付き樹脂シート

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20201020

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20201020

A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20201208

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20201215

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20210212

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20210309

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20210322

R150 Certificate of patent or registration of utility model

Ref document number: 6866858

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250