JP6856335B2 - 加工装置 - Google Patents
加工装置 Download PDFInfo
- Publication number
- JP6856335B2 JP6856335B2 JP2016173459A JP2016173459A JP6856335B2 JP 6856335 B2 JP6856335 B2 JP 6856335B2 JP 2016173459 A JP2016173459 A JP 2016173459A JP 2016173459 A JP2016173459 A JP 2016173459A JP 6856335 B2 JP6856335 B2 JP 6856335B2
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- Prior art keywords
- wafer
- polishing
- gettering
- holding table
- grinding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000005247 gettering Methods 0.000 claims description 117
- 238000005498 polishing Methods 0.000 claims description 92
- 230000003028 elevating effect Effects 0.000 claims description 21
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 17
- 235000012431 wafers Nutrition 0.000 description 95
- 239000002002 slurry Substances 0.000 description 14
- 239000006061 abrasive grain Substances 0.000 description 13
- 230000032258 transport Effects 0.000 description 12
- 238000004140 cleaning Methods 0.000 description 7
- 239000000126 substance Substances 0.000 description 6
- 239000002245 particle Substances 0.000 description 5
- 230000009471 action Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 238000005192 partition Methods 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 description 2
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000004745 nonwoven fabric Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 238000000638 solvent extraction Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0069—Other grinding machines or devices with means for feeding the work-pieces to the grinding tool, e.g. turntables, transfer means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
Description
5a,5b:カセット 6:搬入出手段 7:X方向移動手段 8:仮置き手段
9:洗浄手段 10:搬送手段 11:吸着パッド 12:アーム部 13:支持ロッド
14:移動ブロック 15:支持柱 16:案内レール
20:粗研削手段 21:スピンドル 22:スピンドルハウジング 23:モータ
24:粗研削ホイール 25:研削砥石
30:粗研削送り手段 31:ボールネジ 32:モータ 33:ガイドレール
34:昇降板 340:案内溝
40:仕上げ研削手段 41:スピンドル 42:スピンドルハウジング 43:モータ
44:粗研削ホイール 45:研削砥石
50:仕上げ研削送り手段 51:ボールネジ 52:モータ 53:ガイドレール
54:昇降板 540:案内溝
60:研磨手段 61:回転手段 610:スピンドル 611:モータ
612:スピンドルハウジング 613:案内溝
62:研磨ホイール 620:マウント 621:基台 622:研磨パッド
63:可動ブロック 630:ガイドレール 631:案内溝
64:固定ブロック 640:ガイドレール
65:第1研磨送り手段 650:モータ
66:第2研磨送り手段 660:モータ
70:ゲッタリング層形成手段 71:回転手段 710:スピンドル 711:モータ
712:スピンドルハウジング 713:案内溝
72:ゲッタリングホイール 720:マウント 721:基台
722:ゲッタリングパッド
73:可動ブロック 730:ガイドレール 731:案内溝
74:固定ブロック 740:ガイドレール 741:案内溝
75:昇降手段 750:モータ
76:水平移動手段 760:ボールネジ 761:モータ
80:ドレッサユニット 81:ブラケット 82:ドレス部材
90:純水供給手段
Claims (2)
- ウエーハの被加工面に研削と研磨とを施した後、該被加工面にゲッタリング層を形成する加工装置であって、
中心を軸に自転可能に配設されウエーハを搬入出する搬入出領域とウエーハを研削する研削領域とウエーハを研磨する研磨領域とにウエーハを位置合わせするターンテーブルと、
該ターンテーブルの中心を中心に等角度で配設されウエーハを保持する保持面を有する保持テーブルと、
該搬入出領域に位置づけられた該保持テーブルに対してウエーハを搬入及び搬出する搬送手段と、
該研削領域に位置づけられた該保持テーブルに保持されたウエーハを研削して所定の厚みに形成する研削手段と、
該研磨領域に位置づけられた該保持テーブルに保持されたウエーハの被加工面を研磨する研磨手段と、
該搬入出領域に位置づけられた該保持テーブルに保持されたウエーハの被加工面にゲッタリング層を形成するゲッタリング層形成手段と、を備え、
該ゲッタリング層形成手段は、円板状のゲッタリングパッドが装着されたマウントの中心を軸に回転するスピンドルを有する回転手段と、
該回転手段を該保持テーブルの該保持面に対して垂直方向に昇降させる昇降手段と、
該ゲッタリングパッドの中心から純水をウエーハに供給する純水供給手段と、
該ゲッタリングパッドをドレスするドレス部材と、
を備える加工装置。 - 前記回転手段を前記保持テーブルの前記保持面に平行な水平方向に移動させる水平移動手段を備え、前記ゲッタリングパッドを前記搬入出領域から退避可能とする
請求項1記載の加工装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016173459A JP6856335B2 (ja) | 2016-09-06 | 2016-09-06 | 加工装置 |
TW106126018A TWI732012B (zh) | 2016-09-06 | 2017-08-02 | 加工裝置 |
CN201710767736.5A CN107791115B (zh) | 2016-09-06 | 2017-08-31 | 加工装置 |
KR1020170113293A KR102277932B1 (ko) | 2016-09-06 | 2017-09-05 | 가공 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016173459A JP6856335B2 (ja) | 2016-09-06 | 2016-09-06 | 加工装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018039063A JP2018039063A (ja) | 2018-03-15 |
JP6856335B2 true JP6856335B2 (ja) | 2021-04-07 |
Family
ID=61531694
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016173459A Active JP6856335B2 (ja) | 2016-09-06 | 2016-09-06 | 加工装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6856335B2 (ja) |
KR (1) | KR102277932B1 (ja) |
CN (1) | CN107791115B (ja) |
TW (1) | TWI732012B (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7118558B2 (ja) * | 2019-01-17 | 2022-08-16 | 株式会社ディスコ | 被加工物の加工方法 |
CN109571156A (zh) * | 2019-01-24 | 2019-04-05 | 刘兴秋 | 一种研磨抛光机组 |
CN109822419A (zh) * | 2019-03-04 | 2019-05-31 | 天通日进精密技术有限公司 | 晶圆转移装置及晶圆转移方法 |
CN111216003A (zh) * | 2020-03-15 | 2020-06-02 | 湖北工业大学 | 一种机械配件加工生产用的打磨抛光装置 |
CN113305732B (zh) * | 2021-06-22 | 2022-05-03 | 北京中电科电子装备有限公司 | 一种用于半导体设备的多工位全自动减薄磨削方法 |
CN114473847B (zh) * | 2021-12-29 | 2023-04-25 | 华海清科股份有限公司 | 一种旋转式晶圆交互系统 |
CN114227526B (zh) * | 2022-02-28 | 2022-06-07 | 西安奕斯伟材料科技有限公司 | 一种研磨载台、研磨装置、研磨方法及硅片 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
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DD109365A1 (ja) | 1973-05-10 | 1974-11-05 | ||
JP2719113B2 (ja) * | 1994-05-24 | 1998-02-25 | 信越半導体株式会社 | 単結晶シリコンウェーハの歪付け方法 |
JP3076291B2 (ja) * | 1997-12-02 | 2000-08-14 | 日本電気株式会社 | 研磨装置 |
JP4554901B2 (ja) * | 2003-08-12 | 2010-09-29 | 株式会社ディスコ | ウエーハの加工方法 |
JP2008060220A (ja) * | 2006-08-30 | 2008-03-13 | Disco Abrasive Syst Ltd | ゲッタリング層形成装置 |
JP4907302B2 (ja) * | 2006-11-09 | 2012-03-28 | リンテック株式会社 | 半導体ウエハの研削装置 |
JP2010225987A (ja) * | 2009-03-25 | 2010-10-07 | Disco Abrasive Syst Ltd | ウェーハの研磨方法及び研磨パッド |
JP5588151B2 (ja) * | 2009-09-11 | 2014-09-10 | 株式会社東京精密 | ウェーハ処理方法およびウェーハ処理装置 |
JP5406676B2 (ja) * | 2009-11-10 | 2014-02-05 | 株式会社ディスコ | ウエーハの加工装置 |
JP2013004910A (ja) * | 2011-06-21 | 2013-01-07 | Disco Abrasive Syst Ltd | 埋め込み銅電極を有するウエーハの加工方法 |
JP5916513B2 (ja) * | 2012-05-23 | 2016-05-11 | 株式会社ディスコ | 板状物の加工方法 |
JP6208498B2 (ja) | 2013-08-29 | 2017-10-04 | 株式会社ディスコ | 研磨パッドおよびウエーハの加工方法 |
JP2015230935A (ja) * | 2014-06-04 | 2015-12-21 | 株式会社ディスコ | シリコンウェーハの加工方法 |
KR20150143151A (ko) * | 2014-06-13 | 2015-12-23 | 삼성전자주식회사 | 웨이퍼의 연마 방법 |
JP6366383B2 (ja) * | 2014-06-27 | 2018-08-01 | 株式会社ディスコ | 加工装置 |
-
2016
- 2016-09-06 JP JP2016173459A patent/JP6856335B2/ja active Active
-
2017
- 2017-08-02 TW TW106126018A patent/TWI732012B/zh active
- 2017-08-31 CN CN201710767736.5A patent/CN107791115B/zh active Active
- 2017-09-05 KR KR1020170113293A patent/KR102277932B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
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KR20180027381A (ko) | 2018-03-14 |
TWI732012B (zh) | 2021-07-01 |
KR102277932B1 (ko) | 2021-07-14 |
CN107791115B (zh) | 2021-06-11 |
CN107791115A (zh) | 2018-03-13 |
TW201824392A (zh) | 2018-07-01 |
JP2018039063A (ja) | 2018-03-15 |
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