JP6853770B2 - 半導体装置および表示装置 - Google Patents

半導体装置および表示装置 Download PDF

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Publication number
JP6853770B2
JP6853770B2 JP2017230723A JP2017230723A JP6853770B2 JP 6853770 B2 JP6853770 B2 JP 6853770B2 JP 2017230723 A JP2017230723 A JP 2017230723A JP 2017230723 A JP2017230723 A JP 2017230723A JP 6853770 B2 JP6853770 B2 JP 6853770B2
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Japan
Prior art keywords
gate electrode
film
electrode
insulating layer
semiconductor film
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JP2017230723A
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English (en)
Japanese (ja)
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JP2019102602A (ja
JP2019102602A5 (enExample
Inventor
康浩 寺井
康浩 寺井
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Joled Inc
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Joled Inc
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Priority to JP2017230723A priority Critical patent/JP6853770B2/ja
Priority to US16/174,284 priority patent/US10886411B2/en
Publication of JP2019102602A publication Critical patent/JP2019102602A/ja
Publication of JP2019102602A5 publication Critical patent/JP2019102602A5/ja
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6729Thin-film transistors [TFT] characterised by the electrodes
    • H10D30/673Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
    • H10D30/6733Multi-gate TFTs
    • H10D30/6734Multi-gate TFTs having gate electrodes arranged on both top and bottom sides of the channel, e.g. dual-gate TFTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/674Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6755Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/481Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs integrated with passive devices, e.g. auxiliary capacitors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/131Interconnections, e.g. wiring lines or terminals
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10Substrates, e.g. flexible substrates
    • H10K77/111Flexible substrates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/121Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H10K59/1213Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/121Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H10K59/1216Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being capacitors
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/549Organic PV cells

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thin Film Transistor (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP2017230723A 2017-11-30 2017-11-30 半導体装置および表示装置 Active JP6853770B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2017230723A JP6853770B2 (ja) 2017-11-30 2017-11-30 半導体装置および表示装置
US16/174,284 US10886411B2 (en) 2017-11-30 2018-10-30 Semiconductor device and display unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017230723A JP6853770B2 (ja) 2017-11-30 2017-11-30 半導体装置および表示装置

Publications (3)

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JP2019102602A JP2019102602A (ja) 2019-06-24
JP2019102602A5 JP2019102602A5 (enExample) 2019-09-26
JP6853770B2 true JP6853770B2 (ja) 2021-03-31

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JP2017230723A Active JP6853770B2 (ja) 2017-11-30 2017-11-30 半導体装置および表示装置

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US (1) US10886411B2 (enExample)
JP (1) JP6853770B2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN210607259U (zh) * 2019-12-13 2020-05-22 北京京东方技术开发有限公司 显示基板和显示装置
CN111682057B (zh) * 2020-07-07 2021-09-24 深圳市华星光电半导体显示技术有限公司 显示面板及显示面板的制备方法
US11843022B2 (en) * 2020-12-03 2023-12-12 Sharp Kabushiki Kaisha X-ray imaging panel and method of manufacturing X-ray imaging panel
US11916094B2 (en) * 2021-08-02 2024-02-27 Sharp Display Technology Corporation Photoelectric conversion panel and method for manufacturing photoelectric conversion panel

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4094179B2 (ja) * 1998-08-21 2008-06-04 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP4472064B2 (ja) * 1998-08-31 2010-06-02 株式会社半導体エネルギー研究所 半導体装置の製造方法
JP4202502B2 (ja) * 1998-12-28 2008-12-24 株式会社半導体エネルギー研究所 半導体装置
KR101058105B1 (ko) * 2009-04-06 2011-08-24 삼성모바일디스플레이주식회사 액티브 매트릭스 기판의 제조방법 및 유기 발광 표시장치의 제조방법
KR101746198B1 (ko) * 2009-09-04 2017-06-12 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시장치 및 전자기기
KR102143924B1 (ko) * 2013-07-12 2020-08-13 삼성디스플레이 주식회사 유기 발광 표시 장치
KR102294507B1 (ko) * 2013-09-06 2021-08-30 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
KR102132181B1 (ko) * 2013-12-31 2020-07-10 엘지디스플레이 주식회사 유기 발광 디스플레이 장치와 이의 제조 방법
JP6523695B2 (ja) * 2014-02-05 2019-06-05 株式会社半導体エネルギー研究所 半導体装置
KR102524983B1 (ko) * 2014-11-28 2023-04-21 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치, 모듈, 및 전자 기기
KR20160086016A (ko) * 2015-01-08 2016-07-19 삼성디스플레이 주식회사 박막 트랜지스터 표시판 및 이의 제조 방법
JP6920785B2 (ja) * 2015-08-19 2021-08-18 株式会社ジャパンディスプレイ 表示装置
JP6654466B2 (ja) 2015-08-31 2020-02-26 株式会社Joled 半導体装置、表示装置、表示装置の製造方法および電子機器
JP6970511B2 (ja) * 2016-02-12 2021-11-24 株式会社半導体エネルギー研究所 トランジスタ
JP2017191917A (ja) * 2016-04-15 2017-10-19 株式会社Joled 薄膜トランジスタ基板の製造方法
WO2017208923A1 (ja) * 2016-05-31 2017-12-07 凸版印刷株式会社 有機薄膜トランジスタおよび画像表示装置
CN107644941A (zh) * 2016-07-22 2018-01-30 上海和辉光电有限公司 一种有机发光二极管器件的薄膜封装构件
CN109643659B (zh) * 2016-08-23 2022-07-26 凸版印刷株式会社 有机薄膜晶体管及其制造方法以及图像显示装置
US20180190672A1 (en) * 2017-01-03 2018-07-05 Innolux Corporation Display device

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US20190165183A1 (en) 2019-05-30
JP2019102602A (ja) 2019-06-24
US10886411B2 (en) 2021-01-05

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