JP6853770B2 - 半導体装置および表示装置 - Google Patents
半導体装置および表示装置 Download PDFInfo
- Publication number
- JP6853770B2 JP6853770B2 JP2017230723A JP2017230723A JP6853770B2 JP 6853770 B2 JP6853770 B2 JP 6853770B2 JP 2017230723 A JP2017230723 A JP 2017230723A JP 2017230723 A JP2017230723 A JP 2017230723A JP 6853770 B2 JP6853770 B2 JP 6853770B2
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- gate electrode
- film
- electrode
- insulating layer
- semiconductor film
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
- H10D30/673—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
- H10D30/6733—Multi-gate TFTs
- H10D30/6734—Multi-gate TFTs having gate electrodes arranged on both top and bottom sides of the channel, e.g. dual-gate TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/481—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs integrated with passive devices, e.g. auxiliary capacitors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
- H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
- H10K59/1216—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being capacitors
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thin Film Transistor (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017230723A JP6853770B2 (ja) | 2017-11-30 | 2017-11-30 | 半導体装置および表示装置 |
| US16/174,284 US10886411B2 (en) | 2017-11-30 | 2018-10-30 | Semiconductor device and display unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017230723A JP6853770B2 (ja) | 2017-11-30 | 2017-11-30 | 半導体装置および表示装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019102602A JP2019102602A (ja) | 2019-06-24 |
| JP2019102602A5 JP2019102602A5 (enExample) | 2019-09-26 |
| JP6853770B2 true JP6853770B2 (ja) | 2021-03-31 |
Family
ID=66633563
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017230723A Active JP6853770B2 (ja) | 2017-11-30 | 2017-11-30 | 半導体装置および表示装置 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US10886411B2 (enExample) |
| JP (1) | JP6853770B2 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN210607259U (zh) * | 2019-12-13 | 2020-05-22 | 北京京东方技术开发有限公司 | 显示基板和显示装置 |
| CN111682057B (zh) * | 2020-07-07 | 2021-09-24 | 深圳市华星光电半导体显示技术有限公司 | 显示面板及显示面板的制备方法 |
| US11843022B2 (en) * | 2020-12-03 | 2023-12-12 | Sharp Kabushiki Kaisha | X-ray imaging panel and method of manufacturing X-ray imaging panel |
| US11916094B2 (en) * | 2021-08-02 | 2024-02-27 | Sharp Display Technology Corporation | Photoelectric conversion panel and method for manufacturing photoelectric conversion panel |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4094179B2 (ja) * | 1998-08-21 | 2008-06-04 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP4472064B2 (ja) * | 1998-08-31 | 2010-06-02 | 株式会社半導体エネルギー研究所 | 半導体装置の製造方法 |
| JP4202502B2 (ja) * | 1998-12-28 | 2008-12-24 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| KR101058105B1 (ko) * | 2009-04-06 | 2011-08-24 | 삼성모바일디스플레이주식회사 | 액티브 매트릭스 기판의 제조방법 및 유기 발광 표시장치의 제조방법 |
| KR101746198B1 (ko) * | 2009-09-04 | 2017-06-12 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시장치 및 전자기기 |
| KR102143924B1 (ko) * | 2013-07-12 | 2020-08-13 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 |
| KR102294507B1 (ko) * | 2013-09-06 | 2021-08-30 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| KR102132181B1 (ko) * | 2013-12-31 | 2020-07-10 | 엘지디스플레이 주식회사 | 유기 발광 디스플레이 장치와 이의 제조 방법 |
| JP6523695B2 (ja) * | 2014-02-05 | 2019-06-05 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| KR102524983B1 (ko) * | 2014-11-28 | 2023-04-21 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치, 모듈, 및 전자 기기 |
| KR20160086016A (ko) * | 2015-01-08 | 2016-07-19 | 삼성디스플레이 주식회사 | 박막 트랜지스터 표시판 및 이의 제조 방법 |
| JP6920785B2 (ja) * | 2015-08-19 | 2021-08-18 | 株式会社ジャパンディスプレイ | 表示装置 |
| JP6654466B2 (ja) | 2015-08-31 | 2020-02-26 | 株式会社Joled | 半導体装置、表示装置、表示装置の製造方法および電子機器 |
| JP6970511B2 (ja) * | 2016-02-12 | 2021-11-24 | 株式会社半導体エネルギー研究所 | トランジスタ |
| JP2017191917A (ja) * | 2016-04-15 | 2017-10-19 | 株式会社Joled | 薄膜トランジスタ基板の製造方法 |
| WO2017208923A1 (ja) * | 2016-05-31 | 2017-12-07 | 凸版印刷株式会社 | 有機薄膜トランジスタおよび画像表示装置 |
| CN107644941A (zh) * | 2016-07-22 | 2018-01-30 | 上海和辉光电有限公司 | 一种有机发光二极管器件的薄膜封装构件 |
| CN109643659B (zh) * | 2016-08-23 | 2022-07-26 | 凸版印刷株式会社 | 有机薄膜晶体管及其制造方法以及图像显示装置 |
| US20180190672A1 (en) * | 2017-01-03 | 2018-07-05 | Innolux Corporation | Display device |
-
2017
- 2017-11-30 JP JP2017230723A patent/JP6853770B2/ja active Active
-
2018
- 2018-10-30 US US16/174,284 patent/US10886411B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US20190165183A1 (en) | 2019-05-30 |
| JP2019102602A (ja) | 2019-06-24 |
| US10886411B2 (en) | 2021-01-05 |
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