JP6850354B2 - ポリアミドイミドフィルムおよびその製造方法 - Google Patents
ポリアミドイミドフィルムおよびその製造方法 Download PDFInfo
- Publication number
- JP6850354B2 JP6850354B2 JP2019537331A JP2019537331A JP6850354B2 JP 6850354 B2 JP6850354 B2 JP 6850354B2 JP 2019537331 A JP2019537331 A JP 2019537331A JP 2019537331 A JP2019537331 A JP 2019537331A JP 6850354 B2 JP6850354 B2 JP 6850354B2
- Authority
- JP
- Japan
- Prior art keywords
- polyamide
- imide film
- compound
- imide
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229920002312 polyamide-imide Polymers 0.000 title claims description 107
- 239000004962 Polyamide-imide Substances 0.000 title claims description 106
- 238000004519 manufacturing process Methods 0.000 title claims description 20
- -1 aromatic diamine compound Chemical class 0.000 claims description 173
- 229920000642 polymer Polymers 0.000 claims description 96
- LXEJRKJRKIFVNY-UHFFFAOYSA-N terephthaloyl chloride Chemical compound ClC(=O)C1=CC=C(C(Cl)=O)C=C1 LXEJRKJRKIFVNY-UHFFFAOYSA-N 0.000 claims description 20
- 230000000379 polymerizing effect Effects 0.000 claims description 14
- QDBOAKPEXMMQFO-UHFFFAOYSA-N 4-(4-carbonochloridoylphenyl)benzoyl chloride Chemical compound C1=CC(C(=O)Cl)=CC=C1C1=CC=C(C(Cl)=O)C=C1 QDBOAKPEXMMQFO-UHFFFAOYSA-N 0.000 claims description 13
- 238000010438 heat treatment Methods 0.000 claims description 13
- 238000005266 casting Methods 0.000 claims description 12
- 150000001875 compounds Chemical class 0.000 claims description 11
- 238000001035 drying Methods 0.000 claims description 10
- 238000002834 transmittance Methods 0.000 claims description 9
- 230000006835 compression Effects 0.000 claims description 8
- 238000007906 compression Methods 0.000 claims description 8
- NVKGJHAQGWCWDI-UHFFFAOYSA-N 4-[4-amino-2-(trifluoromethyl)phenyl]-3-(trifluoromethyl)aniline Chemical group FC(F)(F)C1=CC(N)=CC=C1C1=CC=C(N)C=C1C(F)(F)F NVKGJHAQGWCWDI-UHFFFAOYSA-N 0.000 claims description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 7
- 229910001873 dinitrogen Inorganic materials 0.000 claims description 7
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 6
- 125000004989 dicarbonyl group Chemical group 0.000 claims description 6
- 229910052731 fluorine Inorganic materials 0.000 claims description 6
- 239000011737 fluorine Substances 0.000 claims description 6
- 238000010926 purge Methods 0.000 claims description 6
- 125000001424 substituent group Chemical group 0.000 claims description 4
- QHHKLPCQTTWFSS-UHFFFAOYSA-N 5-[2-(1,3-dioxo-2-benzofuran-5-yl)-1,1,1,3,3,3-hexafluoropropan-2-yl]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)(C(F)(F)F)C(F)(F)F)=C1 QHHKLPCQTTWFSS-UHFFFAOYSA-N 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 description 21
- 239000000126 substance Substances 0.000 description 21
- 238000000034 method Methods 0.000 description 15
- 150000001408 amides Chemical class 0.000 description 13
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 11
- 150000003949 imides Chemical group 0.000 description 9
- 238000011156 evaluation Methods 0.000 description 8
- 238000001125 extrusion Methods 0.000 description 8
- 239000003960 organic solvent Substances 0.000 description 8
- 230000000704 physical effect Effects 0.000 description 8
- 229920005575 poly(amic acid) Polymers 0.000 description 8
- 238000006116 polymerization reaction Methods 0.000 description 8
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 7
- 125000003118 aryl group Chemical group 0.000 description 7
- 239000012535 impurity Substances 0.000 description 7
- 238000005259 measurement Methods 0.000 description 7
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 229920001721 polyimide Polymers 0.000 description 6
- 239000004642 Polyimide Substances 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 238000005553 drilling Methods 0.000 description 5
- 230000003472 neutralizing effect Effects 0.000 description 5
- 238000001556 precipitation Methods 0.000 description 5
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- 230000008602 contraction Effects 0.000 description 4
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 3
- 150000001728 carbonyl compounds Chemical class 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000001914 filtration Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 150000004984 aromatic diamines Chemical class 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 238000006297 dehydration reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 150000004678 hydrides Chemical class 0.000 description 2
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 2
- NSGXIBWMJZWTPY-UHFFFAOYSA-N 1,1,1,3,3,3-hexafluoropropane Chemical compound FC(F)(F)CC(F)(F)F NSGXIBWMJZWTPY-UHFFFAOYSA-N 0.000 description 1
- ITQTTZVARXURQS-UHFFFAOYSA-N 3-methylpyridine Chemical compound CC1=CC=CN=C1 ITQTTZVARXURQS-UHFFFAOYSA-N 0.000 description 1
- TWISHTANSAOCNX-UHFFFAOYSA-N 4-(1,1,1,3,3,3-hexafluoropropan-2-yl)phthalic acid Chemical compound OC(=O)C1=CC=C(C(C(F)(F)F)C(F)(F)F)C=C1C(O)=O TWISHTANSAOCNX-UHFFFAOYSA-N 0.000 description 1
- JPZRPCNEISCANI-UHFFFAOYSA-N 4-(4-aminophenyl)-3-(trifluoromethyl)aniline Chemical group C1=CC(N)=CC=C1C1=CC=C(N)C=C1C(F)(F)F JPZRPCNEISCANI-UHFFFAOYSA-N 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical compound S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000004480 active ingredient Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 125000005262 alkoxyamine group Chemical group 0.000 description 1
- 150000003973 alkyl amines Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000002801 charged material Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000005536 corrosion prevention Methods 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 125000004216 fluoromethyl group Chemical group [H]C([H])(F)* 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- IXCSERBJSXMMFS-UHFFFAOYSA-N hcl hcl Chemical compound Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 1
- 239000012210 heat-resistant fiber Substances 0.000 description 1
- 125000001183 hydrocarbyl group Chemical class 0.000 description 1
- 229910000037 hydrogen sulfide Inorganic materials 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 239000003345 natural gas Substances 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000003129 oil well Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/14—Polyamide-imides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/22—Component parts, details or accessories; Auxiliary operations
- B29C39/24—Feeding the material into the mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/22—Component parts, details or accessories; Auxiliary operations
- B29C39/38—Heating or cooling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/22—Component parts, details or accessories; Auxiliary operations
- B29C39/42—Casting under special conditions, e.g. vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/22—Component parts, details or accessories; Auxiliary operations
- B29C39/44—Measuring, controlling or regulating
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
- C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C41/00—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
- B29C41/003—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor characterised by the choice of material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C41/00—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
- B29C41/24—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor for making articles of indefinite length
- B29C41/26—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor for making articles of indefinite length by depositing flowable material on a rotating drum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C41/00—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
- B29C41/24—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor for making articles of indefinite length
- B29C41/28—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor for making articles of indefinite length by depositing flowable material on an endless belt
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2077/00—Use of PA, i.e. polyamides, e.g. polyesteramides or derivatives thereof, as moulding material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/0094—Condition, form or state of moulded material or of the material to be shaped having particular viscosity
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/10—Transparent films; Clear coatings; Transparent materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/16—Applications used for films
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Moulding By Coating Moulds (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
Description
<式1>
4≦X/Y≦12
X:前記フィルムを、UTM圧縮モードにより2.5mm球状のチップを用いて10mm/minの速度で穿孔する際、クラックを含む穿孔最大径(mm)
Y:前記フィルムのモジュラス(GPa)
[ポリアミドイミドフィルム]
次いで、前記ポリアミック酸は、脱水反応によりポリイミドに転換され得、前記ポリイミドはイミド(imide)繰り返し単位を含む。
例えば、前記ポリイミドは、下記化学式3で表される化合物を含み得るが、これに限定されるものではない。
<式1>
4≦X/Y≦12
X:前記フィルムを、UTM圧縮モードにより2.5mm球状のチップを用いて10mm/minの速度で穿孔する際、クラックを含む穿孔最大径(mm)
Y:前記フィルムのモジュラス(GPa)
前述のポリアミドイミドフィルムに関する様々な特性が組み合わせわされ得る。
[ポリアミドイミドフィルムの製造方法]
これは所望の粘度を正確に達成できるという点から有利である。
前記第2重合体溶液の粘度が前記範囲であると、押出およびキャスティング工程において効率的にポリアミドイミドフィルムが製造され得る。また、製造されたポリアミドイミドフィルムは、向上されたモジュラスなどの機械的物性を有し得る。
前記中和剤の例として、アルコキシアミン、アルキルアミンまたはアルカノールアミンなどのアミン系中和剤などが挙げられるが、これらに限定されるものではない。
前記中和剤により調節された第2重合体溶液のpHは、約4〜約7であり得る。具体的に、調節された第2重合体溶液のpHは、約4.5〜約7であり得る。
前記押出およびキャスティング工程の際、前述の有機溶媒が使用され得る。
前記乾燥工程は、約60℃〜約150℃の温度で、約5分〜約60分間行える。
また、前記第1減温段階の減温速度が前記第2減温段階の減温速度よりも速いこともあり得る。
例えば、前記第1減温段階中の最大速度が、前記第2減温段階中の最大速度よりも速い。または、前記第1減温段階中の最低速度が、前記第2減温段階中の最低速度よりも速い。
(実施例)
(実施例1ないし実施例7)
比較例2の場合は、SKC社の自社作制サンプルとしてアクリル系フィルムを使用した。
比較例3の場合は、SKC社のSG65C名称のPETフィルムを使用した。
[評価例]
[評価例1:フィルムの厚さ測定]
[評価例2:圧縮強度の測定]
インストロン(Instron)社の万能試験機UTM5566Aを用いて、サンプルの主収縮方向と直交する方向に10cmおよび主収縮方向に10cmに切り、前記フィルムをUTM圧縮モードで2.5mm球状のチップを使用して、10mm/minの速度で圧縮して、穿孔される瞬間の引張強度を測定した。
[評価例3:穿孔最大径測定]
[評価例4:モジュラス(modulus)測定]
[評価例5:表面硬度測定]
[評価例6:黄色度(YI)測定]
[評価例7:光透過度およびヘイズ(HZ)測定]
Claims (18)
- 芳香族ジアミン化合物、芳香族ジアンヒドリド化合物およびジカルボニル化合物を重合して形成されたポリアミドイミド重合体を含み、
前記ジカルボニル化合物は、テレフタロイルクロリド(terephthaloyl chloride、TPC)及び1,1'−ビフェニル−4,4'−ジカルボニルジクロリド(1,1'-biphenyl-4,4'-dicarbonyl dichloride、BPDC)を30:70〜50:50のモル比で含み、
<式1>
4≦X/Y≦12
X:前記フィルムを、UTM圧縮モードにより2.5mm球状のチップを用いて10mm/minの速度で穿孔する際、クラックを含む穿孔最大径(mm)
Y:前記フィルムのモジュラス(GPa)
前記一般式1の条件を満足する、ポリアミドイミドフィルム。 - 上記ポリアミドイミドフィルムの厚さ50μmを基準に、圧縮強度が0.4kgf/μm以上である、請求項1に記載のポリアミドイミドフィルム。
- 前記ポリアミドイミドフィルムの厚さ50μmを基準に、前記穿孔最大径(X)が60mm以下である、請求項1に記載のポリアミドイミドフィルム。
- 前記ポリアミドイミドフィルムの厚さ50μmを基準に、モジュラスが5.0GPa以上である、請求項1に記載のポリアミドイミドフィルム。
- 前記ポリアミドイミドフィルムの表面硬度がHB以上である、請求項1に記載のポリアミドイミドフィルム。
- 前記ポリアミドイミドフィルムの厚さ50μmを基準に、黄色度が5以下である、請求項1に記載のポリアミドイミドフィルム。
- 前記ポリアミドイミドフィルムの厚さ50μmを基準に、ヘイズが2%以下である、請求項1に記載のポリアミドイミドフィルム。
- 前記ポリアミドイミドフィルムの厚さ50μmを基準に、550nmで測定した光透過度が85%以上である、請求項1に記載のポリアミドイミドフィルム。
- 前記芳香族ジアンヒドリド化合物は、フッ素含有置換基を有する化合物からなる、請求項1に記載のポリアミドイミドフィルム。
- 前記芳香族ジアミン化合物は、2,2'−ビス(トリフルオロメチル)−4,4'−ジアミノビフェニル(2,2'-Bis(trifluoromethyl)-4,4'-diaminobiphenyl、TFDB)を含み、
前記芳香族ジアンヒドリド化合物は、2,2'−ビス(3,4−ジカルボキシフェニル)ヘキサフルオロプロパンジアンヒドリド(2,2'-Bis(3,4-Dicarboxyphenyl)hexafluoropropane dianhydride、6−FDA)を含む、請求項1に記載のポリアミドイミドフィルム。 - 前記芳香族ジアミン化合物に対する前記芳香族ジアンヒドリド化合物のモル比は10:2〜10:4である、請求項1に記載のポリアミドイミドフィルム。
- 前記ジカルボニル化合物は、互いに異なる少なくとも2種のジカルボニル化合物を含む、請求項1に記載のポリアミドイミドフィルム。
- 芳香族ジアミン化合物、芳香族ジアンヒドリド化合物およびジカルボニル化合物を重合してポリアミドイミド重合体溶液を調製する段階と、
前記重合体溶液をタンクに投入する段階と、
前記タンク内の重合体溶液を押出およびキャスティングした後乾燥させ、ゲルシートを製造する段階と、
前記ゲルシートを熱処理する段階とを含み、
前記重合体溶液の粘度が10万cps〜30万cpsであり、
前記熱処理段階が、80℃〜500℃の温度範囲で2℃/min〜80℃/minの速度で昇温させながら5分〜40分間行われ、前記熱処理段階中の最高温度が300℃〜500℃であり、
<式1>
4≦X/Y≦12
X:前記フィルムを、UTM圧縮モードにより2.5mm球状のチップを用いて10mm/minの速度で穿孔する際、クラックを含む穿孔最大径(mm)
Y:前記フィルムのモジュラス(GPa)
前記ポリアミドイミドフィルムが前記一般式1の条件を満足する、ポリアミドイミドフィルムの製造方法。 - 前記タンクの内部温度が−20℃〜0℃である、請求項13に記載のポリアミドイミドフィルムの製造方法。
- 前記調製された重合体溶液をタンクに投入する段階の後に、
前記タンク内の圧力が0.2bar〜0.4barになるまで、1時間〜2時間真空脱泡する段階をさらに含む、請求項13に記載のポリアミドイミドフィルムの製造方法。 - 前記調製された重合体溶液をタンクに投入する段階の後に、
窒素ガスを使用して1気圧〜2気圧で、前記タンクをパージ(purging)する段階をさらに含む、請求項13に記載のポリアミドイミドフィルムの製造方法。 - 前記乾燥は、60℃〜150℃の温度で、5分〜60分間行い、
前記熱処理段階中の最高温度が400℃〜500℃である、請求項13に記載のポリアミドイミドフィルムの製造方法。 - 前記熱処理段階の後に、
前記熱処理されたシートを減温させる段階をさらに含み、
前記減温させる段階は、100℃/minから1000℃/minの速度で減温させる第1減温段階および40℃/minから400℃/minの速度で減温させる第2減温段階を含み、
前記第1減温段階の後に第2減温段階が行われ、
前記第1減温段階の減温速度が前記第2減温段階の減温速度よりも速い、請求項13に記載のポリアミドイミドフィルムの製造方法。
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KR102304105B1 (ko) * | 2015-02-04 | 2021-09-23 | 삼성전자주식회사 | 폴리(이미드-아미드) 코폴리머, 폴리(이미드-아미드) 코폴리머를 포함하는 성형품, 상기 성형품을 포함하는 디스플레이 장치 |
KR102339037B1 (ko) * | 2015-06-26 | 2021-12-14 | 코오롱인더스트리 주식회사 | 폴리아마이드-이미드 전구체, 폴리아마이드-이미드 필름 및 이를 포함하는 표시소자 |
KR102529151B1 (ko) * | 2016-01-27 | 2023-05-08 | 삼성전자주식회사 | 폴리이미드 또는 폴리(아미드-이미드) 코폴리머를 포함하는 성형품 제조용 조성물, 상기 조성물로부터 얻어지는 성형품, 및 상기 성형품을 포함하는 디스플레이 장치 |
TWI640552B (zh) * | 2016-04-11 | 2018-11-11 | Skc股份有限公司 | 無色且透明的聚醯胺-醯亞胺薄膜及其製備方法 |
CN109311287B (zh) * | 2016-06-24 | 2021-08-24 | 东丽株式会社 | 叠层膜 |
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