JP6831835B2 - 被加工物を仕上げるための、高度に制御可能な処理ツールを有する機械 - Google Patents
被加工物を仕上げるための、高度に制御可能な処理ツールを有する機械 Download PDFInfo
- Publication number
- JP6831835B2 JP6831835B2 JP2018507626A JP2018507626A JP6831835B2 JP 6831835 B2 JP6831835 B2 JP 6831835B2 JP 2018507626 A JP2018507626 A JP 2018507626A JP 2018507626 A JP2018507626 A JP 2018507626A JP 6831835 B2 JP6831835 B2 JP 6831835B2
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- machine
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- tool
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000012545 processing Methods 0.000 title claims description 98
- 238000000034 method Methods 0.000 claims description 20
- 230000008569 process Effects 0.000 claims description 11
- 238000011109 contamination Methods 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 claims description 7
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 7
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 6
- 238000001459 lithography Methods 0.000 claims description 4
- 230000000295 complement effect Effects 0.000 claims 2
- 235000012431 wafers Nutrition 0.000 description 33
- 238000004140 cleaning Methods 0.000 description 11
- 239000000463 material Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 238000012937 correction Methods 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 230000003746 surface roughness Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000005202 decontamination Methods 0.000 description 2
- 230000003588 decontaminative effect Effects 0.000 description 2
- 238000007373 indentation Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 229910002601 GaN Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011554 ferrofluid Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0015—Hanging grinding machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
- B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
- B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/04—Headstocks; Working-spindles; Features relating thereto
- B24B41/047—Grinding heads for working on plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/005—Portal grinding machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/04—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a rotary work-table
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201562205648P | 2015-08-14 | 2015-08-14 | |
| US62/205,648 | 2015-08-14 | ||
| PCT/US2016/046439 WO2017030874A1 (en) | 2015-08-14 | 2016-08-11 | Machine for finishing a work piece, and having a highly controllable treatment tool |
Publications (4)
| Publication Number | Publication Date |
|---|---|
| JP2018531503A JP2018531503A (ja) | 2018-10-25 |
| JP2018531503A6 JP2018531503A6 (ja) | 2018-12-13 |
| JP2018531503A5 JP2018531503A5 (enExample) | 2019-09-12 |
| JP6831835B2 true JP6831835B2 (ja) | 2021-02-17 |
Family
ID=58051031
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018507626A Active JP6831835B2 (ja) | 2015-08-14 | 2016-08-11 | 被加工物を仕上げるための、高度に制御可能な処理ツールを有する機械 |
Country Status (4)
| Country | Link |
|---|---|
| US (4) | US10702968B2 (enExample) |
| EP (1) | EP3334561B1 (enExample) |
| JP (1) | JP6831835B2 (enExample) |
| WO (1) | WO2017030874A1 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017030874A1 (en) * | 2015-08-14 | 2017-02-23 | M Cubed Technologies, Inc. | Machine for finishing a work piece, and having a highly controllable treatment tool |
| JP6599832B2 (ja) * | 2016-09-16 | 2019-10-30 | ファナック株式会社 | 工作機械及びワーク平面加工方法 |
| CN107932283A (zh) * | 2017-12-08 | 2018-04-20 | 马宁 | 一种用于铁路运输设备的打磨装置 |
| TWI722478B (zh) * | 2019-07-05 | 2021-03-21 | 新代科技股份有限公司 | 具有砂輪之磨床及其砂輪加工地圖的最佳化方法 |
| CN110421412A (zh) * | 2019-09-05 | 2019-11-08 | 河北工业大学 | 一种小型磁流变平面抛光装置 |
| CN112045550A (zh) * | 2020-09-15 | 2020-12-08 | 赖宗剑 | 一种抛光速度与力度可调的镜面铝板抛光机 |
| CN112589544B (zh) * | 2020-12-09 | 2022-07-19 | 济南德洋低温科技有限公司 | 一种化工容器制造成型方法 |
| CN114102361A (zh) * | 2021-11-25 | 2022-03-01 | 无锡工艺职业技术学院 | 一种陶瓷件磨削加工方法及磨削设备 |
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| US2926653A (en) * | 1958-09-18 | 1960-03-01 | Thompson Grinder Co | Grinding machines |
| US3500588A (en) * | 1966-12-05 | 1970-03-17 | Fred W Fischer | Surface grinder or related unit |
| US3623273A (en) * | 1970-03-10 | 1971-11-30 | Vyzk Ustav Mech | Apparatus for eccentric machining of electrodes |
| US4128968A (en) * | 1976-09-22 | 1978-12-12 | The Perkin-Elmer Corporation | Optical surface polisher |
| JPS6078254U (ja) * | 1983-11-01 | 1985-05-31 | 株式会社東芝 | 研磨装置 |
| GB8407058D0 (en) * | 1984-03-19 | 1984-04-26 | Black & Decker Inc | Attachments for power tools |
| US4956944A (en) * | 1987-03-19 | 1990-09-18 | Canon Kabushiki Kaisha | Polishing apparatus |
| JPH01156855U (enExample) * | 1988-04-20 | 1989-10-27 | ||
| US4956544A (en) * | 1988-07-26 | 1990-09-11 | Hotwatt Inc. | Overheat protected electric cartridge heater |
| FR2677276B1 (fr) * | 1991-06-06 | 1995-12-01 | Commissariat Energie Atomique | Machine de polissage a table porte-echantillon perfectionnee. |
| FR2695853B1 (fr) * | 1992-09-18 | 1994-11-25 | Thibaut Sa | Machine à fraiser, à surfacer et à polir à changement automatique d'outils et dispositif correspondant. |
| US5938504A (en) * | 1993-11-16 | 1999-08-17 | Applied Materials, Inc. | Substrate polishing apparatus |
| JPH07171747A (ja) * | 1993-12-21 | 1995-07-11 | Ricoh Co Ltd | 研削研磨装置 |
| US5643053A (en) * | 1993-12-27 | 1997-07-01 | Applied Materials, Inc. | Chemical mechanical polishing apparatus with improved polishing control |
| JPH08336741A (ja) * | 1995-06-09 | 1996-12-24 | Tokyo Seimitsu Co Ltd | 表面研削方法 |
| JPH0936070A (ja) | 1995-07-21 | 1997-02-07 | Nippon Steel Corp | 半導体ウエハの研磨装置 |
| JP3664188B2 (ja) * | 1995-12-08 | 2005-06-22 | 株式会社東京精密 | 表面加工方法及びその装置 |
| US6179695B1 (en) | 1996-05-10 | 2001-01-30 | Canon Kabushiki Kaisha | Chemical mechanical polishing apparatus and method |
| US6413156B1 (en) * | 1996-05-16 | 2002-07-02 | Ebara Corporation | Method and apparatus for polishing workpiece |
| TW313535B (en) | 1996-10-11 | 1997-08-21 | United Microelectronics Corp | Eraser of vacuum chuck of a stepper |
| JPH10329012A (ja) * | 1997-03-21 | 1998-12-15 | Canon Inc | 研磨装置および研磨方法 |
| US5969972A (en) * | 1997-07-02 | 1999-10-19 | Motorola, Inc. | Method for manufacturing a semiconductor component and automatic machine program generator therefor |
| TW467802B (en) | 1999-10-12 | 2001-12-11 | Hunatech Co Ltd | Conditioner for polishing pad and method for manufacturing the same |
| JP3859937B2 (ja) | 2000-06-02 | 2006-12-20 | 住友大阪セメント株式会社 | 静電チャック |
| JP2004515918A (ja) * | 2000-12-04 | 2004-05-27 | 株式会社荏原製作所 | 基板処理装置及びその方法 |
| SG131737A1 (en) * | 2001-03-28 | 2007-05-28 | Disco Corp | Polishing tool and polishing method and apparatus using same |
| JP4202703B2 (ja) * | 2002-09-20 | 2008-12-24 | Sumco Techxiv株式会社 | 研磨装置 |
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| JP2007214502A (ja) * | 2006-02-13 | 2007-08-23 | Oki Electric Ind Co Ltd | 半導体装置およびその製造方法 |
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| JP2008124292A (ja) * | 2006-11-14 | 2008-05-29 | Disco Abrasive Syst Ltd | 加工装置のウエーハ位置調整治具 |
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| JP2010153407A (ja) | 2008-12-23 | 2010-07-08 | Nikon Corp | 清掃方法及び装置、並びに露光方法及び装置 |
| JP5275016B2 (ja) * | 2008-12-25 | 2013-08-28 | 株式会社ディスコ | 研削装置 |
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| CN109298602B (zh) | 2012-02-03 | 2021-10-15 | Asml荷兰有限公司 | 衬底保持器和光刻装置 |
| JP2013162084A (ja) * | 2012-02-08 | 2013-08-19 | Ulvac Japan Ltd | 静電チャックの再生方法 |
| JP6085152B2 (ja) | 2012-11-22 | 2017-02-22 | 日本特殊陶業株式会社 | 真空チャック |
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| KR20150073214A (ko) * | 2013-10-02 | 2015-06-30 | 엔지케이 인슐레이터 엘티디 | 연마물의 제조 방법 |
| JP2014128877A (ja) | 2014-03-03 | 2014-07-10 | Femutekku:Kk | 表面加工装置及び方法 |
| JP6307022B2 (ja) * | 2014-03-05 | 2018-04-04 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法及び記録媒体 |
| DE102014003598B4 (de) * | 2014-03-17 | 2020-02-27 | Satisloh Ag | Vorrichtung zum Schleifen, Feinschleifen und/oder Polieren von Werkstücken in optischer Qualität, insbesondere von sphärischen Linsenflächen in der Feinoptik |
| WO2016081951A1 (en) | 2014-11-23 | 2016-05-26 | M Cubed Technologies | Wafer pin chuck fabrication and repair |
| WO2017030874A1 (en) * | 2015-08-14 | 2017-02-23 | M Cubed Technologies, Inc. | Machine for finishing a work piece, and having a highly controllable treatment tool |
| US10144106B2 (en) * | 2015-11-02 | 2018-12-04 | Lake Country Manufacturing, Inc. | Adjustable stroke mechanism for random orbital machine |
-
2016
- 2016-08-11 WO PCT/US2016/046439 patent/WO2017030874A1/en not_active Ceased
- 2016-08-11 JP JP2018507626A patent/JP6831835B2/ja active Active
- 2016-08-11 EP EP16837532.7A patent/EP3334561B1/en active Active
-
2017
- 2017-10-20 US US15/789,943 patent/US10702968B2/en active Active
-
2019
- 2019-11-20 US US16/689,892 patent/US11623319B2/en active Active
-
2023
- 2023-03-14 US US18/183,404 patent/US12122012B2/en active Active
-
2024
- 2024-09-30 US US18/901,318 patent/US20250018521A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2017030874A1 (en) | 2017-02-23 |
| EP3334561B1 (en) | 2023-12-20 |
| JP2018531503A (ja) | 2018-10-25 |
| US20230211453A1 (en) | 2023-07-06 |
| US10702968B2 (en) | 2020-07-07 |
| US20200198089A1 (en) | 2020-06-25 |
| US20250018521A1 (en) | 2025-01-16 |
| US11623319B2 (en) | 2023-04-11 |
| US12122012B2 (en) | 2024-10-22 |
| US20180111246A1 (en) | 2018-04-26 |
| EP3334561A4 (en) | 2019-07-31 |
| EP3334561A1 (en) | 2018-06-20 |
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