|
US2926653A
(en)
*
|
1958-09-18 |
1960-03-01 |
Thompson Grinder Co |
Grinding machines
|
|
US3500588A
(en)
*
|
1966-12-05 |
1970-03-17 |
Fred W Fischer |
Surface grinder or related unit
|
|
US3623273A
(en)
*
|
1970-03-10 |
1971-11-30 |
Vyzk Ustav Mech |
Apparatus for eccentric machining of electrodes
|
|
US4128968A
(en)
*
|
1976-09-22 |
1978-12-12 |
The Perkin-Elmer Corporation |
Optical surface polisher
|
|
JPS6078254U
(ja)
*
|
1983-11-01 |
1985-05-31 |
株式会社東芝 |
研磨装置
|
|
GB8407058D0
(en)
*
|
1984-03-19 |
1984-04-26 |
Black & Decker Inc |
Attachments for power tools
|
|
US4956944A
(en)
*
|
1987-03-19 |
1990-09-18 |
Canon Kabushiki Kaisha |
Polishing apparatus
|
|
JPH01156855U
(enExample)
*
|
1988-04-20 |
1989-10-27 |
|
|
|
US4956544A
(en)
*
|
1988-07-26 |
1990-09-11 |
Hotwatt Inc. |
Overheat protected electric cartridge heater
|
|
FR2677276B1
(fr)
*
|
1991-06-06 |
1995-12-01 |
Commissariat Energie Atomique |
Machine de polissage a table porte-echantillon perfectionnee.
|
|
FR2695853B1
(fr)
*
|
1992-09-18 |
1994-11-25 |
Thibaut Sa |
Machine à fraiser, à surfacer et à polir à changement automatique d'outils et dispositif correspondant.
|
|
US5938504A
(en)
*
|
1993-11-16 |
1999-08-17 |
Applied Materials, Inc. |
Substrate polishing apparatus
|
|
JPH07171747A
(ja)
*
|
1993-12-21 |
1995-07-11 |
Ricoh Co Ltd |
研削研磨装置
|
|
US5643053A
(en)
*
|
1993-12-27 |
1997-07-01 |
Applied Materials, Inc. |
Chemical mechanical polishing apparatus with improved polishing control
|
|
JPH08336741A
(ja)
*
|
1995-06-09 |
1996-12-24 |
Tokyo Seimitsu Co Ltd |
表面研削方法
|
|
JPH0936070A
(ja)
|
1995-07-21 |
1997-02-07 |
Nippon Steel Corp |
半導体ウエハの研磨装置
|
|
JP3664188B2
(ja)
*
|
1995-12-08 |
2005-06-22 |
株式会社東京精密 |
表面加工方法及びその装置
|
|
US6179695B1
(en)
|
1996-05-10 |
2001-01-30 |
Canon Kabushiki Kaisha |
Chemical mechanical polishing apparatus and method
|
|
US6413156B1
(en)
*
|
1996-05-16 |
2002-07-02 |
Ebara Corporation |
Method and apparatus for polishing workpiece
|
|
TW313535B
(en)
|
1996-10-11 |
1997-08-21 |
United Microelectronics Corp |
Eraser of vacuum chuck of a stepper
|
|
JPH10329012A
(ja)
*
|
1997-03-21 |
1998-12-15 |
Canon Inc |
研磨装置および研磨方法
|
|
US5969972A
(en)
*
|
1997-07-02 |
1999-10-19 |
Motorola, Inc. |
Method for manufacturing a semiconductor component and automatic machine program generator therefor
|
|
TW467802B
(en)
|
1999-10-12 |
2001-12-11 |
Hunatech Co Ltd |
Conditioner for polishing pad and method for manufacturing the same
|
|
JP3859937B2
(ja)
|
2000-06-02 |
2006-12-20 |
住友大阪セメント株式会社 |
静電チャック
|
|
JP2004515918A
(ja)
*
|
2000-12-04 |
2004-05-27 |
株式会社荏原製作所 |
基板処理装置及びその方法
|
|
SG131737A1
(en)
*
|
2001-03-28 |
2007-05-28 |
Disco Corp |
Polishing tool and polishing method and apparatus using same
|
|
JP4202703B2
(ja)
*
|
2002-09-20 |
2008-12-24 |
Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 |
研磨装置
|
|
US6796887B2
(en)
*
|
2002-11-13 |
2004-09-28 |
Speedfam-Ipec Corporation |
Wear ring assembly
|
|
US20040116058A1
(en)
*
|
2002-12-13 |
2004-06-17 |
Eastman Kodak Company |
Sub-aperture compliant toroidal polishing element
|
|
JP2004235201A
(ja)
*
|
2003-01-28 |
2004-08-19 |
Okamoto Machine Tool Works Ltd |
基板の乾式化学機械研磨方法および乾式化学機械研磨装置
|
|
US7150677B2
(en)
|
2004-09-22 |
2006-12-19 |
Mitsubishi Materials Corporation |
CMP conditioner
|
|
US7104342B2
(en)
*
|
2004-09-29 |
2006-09-12 |
Berg Frederic P |
Active rotational balancing system for orbital sanders
|
|
JP4756583B2
(ja)
|
2005-08-30 |
2011-08-24 |
株式会社東京精密 |
研磨パッド、パッドドレッシング評価方法、及び研磨装置
|
|
JP2007214502A
(ja)
*
|
2006-02-13 |
2007-08-23 |
Oki Electric Ind Co Ltd |
半導体装置およびその製造方法
|
|
JP2007258240A
(ja)
*
|
2006-03-20 |
2007-10-04 |
Tokyo Electron Ltd |
表面処理方法
|
|
DE102006026467B4
(de)
*
|
2006-06-07 |
2018-06-28 |
Texas Instruments Deutschland Gmbh |
Vorrichtung für das Schleifen eines Wafers
|
|
JP2008124292A
(ja)
*
|
2006-11-14 |
2008-05-29 |
Disco Abrasive Syst Ltd |
加工装置のウエーハ位置調整治具
|
|
US20080125014A1
(en)
*
|
2006-11-29 |
2008-05-29 |
William Rogers Rosch |
Sub-aperture deterministric finishing of high aspect ratio glass products
|
|
US8740670B2
(en)
*
|
2006-12-28 |
2014-06-03 |
Saint-Gobain Ceramics & Plastics, Inc. |
Sapphire substrates and methods of making same
|
|
JP5099476B2
(ja)
|
2006-12-28 |
2012-12-19 |
株式会社ニコン |
清掃装置及び清掃システム、パターン形成装置、清掃方法及び露光方法、並びにデバイス製造方法
|
|
JP4864757B2
(ja)
*
|
2007-02-14 |
2012-02-01 |
東京エレクトロン株式会社 |
基板載置台及びその表面処理方法
|
|
JP5018249B2
(ja)
|
2007-06-04 |
2012-09-05 |
株式会社ニコン |
クリーニング装置、クリーニング方法、露光装置、及びデバイス製造方法
|
|
JP2009043931A
(ja)
*
|
2007-08-08 |
2009-02-26 |
Disco Abrasive Syst Ltd |
ウェーハの裏面研削方法
|
|
JP2009094326A
(ja)
*
|
2007-10-10 |
2009-04-30 |
Disco Abrasive Syst Ltd |
ウェーハの研削方法
|
|
JP2010153407A
(ja)
|
2008-12-23 |
2010-07-08 |
Nikon Corp |
清掃方法及び装置、並びに露光方法及び装置
|
|
JP5275016B2
(ja)
*
|
2008-12-25 |
2013-08-28 |
株式会社ディスコ |
研削装置
|
|
US8588956B2
(en)
*
|
2009-01-29 |
2013-11-19 |
Tayyab Ishaq Suratwala |
Apparatus and method for deterministic control of surface figure during full aperture polishing
|
|
NL2004153A
(en)
*
|
2009-02-24 |
2010-08-25 |
Asml Netherlands Bv |
Lithographic apparatus, a method for removing material of one or more protrusions on a support surface, and an article support system.
|
|
US20100330890A1
(en)
|
2009-06-30 |
2010-12-30 |
Zine-Eddine Boutaghou |
Polishing pad with array of fluidized gimballed abrasive members
|
|
JP5796412B2
(ja)
*
|
2011-08-26 |
2015-10-21 |
三菱電機株式会社 |
半導体素子の製造方法
|
|
JP5931084B2
(ja)
*
|
2011-10-26 |
2016-06-08 |
ケヰテック株式会社 |
偏心回転軸を有する研磨具
|
|
US9358660B2
(en)
*
|
2011-11-07 |
2016-06-07 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Grinding wheel design with elongated teeth arrangement
|
|
US9138855B2
(en)
*
|
2012-01-19 |
2015-09-22 |
Dalian University of Technology School of Mechanical Engineering |
Multifunctional substrate polishing and burnishing device and polishing and burnishing method thereof
|
|
CN109298602B
(zh)
|
2012-02-03 |
2021-10-15 |
Asml荷兰有限公司 |
衬底保持器和光刻装置
|
|
JP2013162084A
(ja)
*
|
2012-02-08 |
2013-08-19 |
Ulvac Japan Ltd |
静電チャックの再生方法
|
|
JP6085152B2
(ja)
|
2012-11-22 |
2017-02-22 |
日本特殊陶業株式会社 |
真空チャック
|
|
JP6129551B2
(ja)
*
|
2012-12-27 |
2017-05-17 |
株式会社ディスコ |
板状物の加工方法
|
|
KR20150073214A
(ko)
*
|
2013-10-02 |
2015-06-30 |
엔지케이 인슐레이터 엘티디 |
연마물의 제조 방법
|
|
JP2014128877A
(ja)
|
2014-03-03 |
2014-07-10 |
Femutekku:Kk |
表面加工装置及び方法
|
|
JP6307022B2
(ja)
*
|
2014-03-05 |
2018-04-04 |
東京エレクトロン株式会社 |
基板処理装置、基板処理方法及び記録媒体
|
|
DE102014003598B4
(de)
*
|
2014-03-17 |
2020-02-27 |
Satisloh Ag |
Vorrichtung zum Schleifen, Feinschleifen und/oder Polieren von Werkstücken in optischer Qualität, insbesondere von sphärischen Linsenflächen in der Feinoptik
|
|
WO2016081951A1
(en)
|
2014-11-23 |
2016-05-26 |
M Cubed Technologies |
Wafer pin chuck fabrication and repair
|
|
WO2017030874A1
(en)
*
|
2015-08-14 |
2017-02-23 |
M Cubed Technologies, Inc. |
Machine for finishing a work piece, and having a highly controllable treatment tool
|
|
US10144106B2
(en)
*
|
2015-11-02 |
2018-12-04 |
Lake Country Manufacturing, Inc. |
Adjustable stroke mechanism for random orbital machine
|