ATE488794T1 - Halbleiter-bearbeitungsverfahren mit virtuellen modulen - Google Patents

Halbleiter-bearbeitungsverfahren mit virtuellen modulen

Info

Publication number
ATE488794T1
ATE488794T1 AT05768604T AT05768604T ATE488794T1 AT E488794 T1 ATE488794 T1 AT E488794T1 AT 05768604 T AT05768604 T AT 05768604T AT 05768604 T AT05768604 T AT 05768604T AT E488794 T1 ATE488794 T1 AT E488794T1
Authority
AT
Austria
Prior art keywords
machining process
virtual modules
semiconductor machining
relates
semiconductor
Prior art date
Application number
AT05768604T
Other languages
English (en)
Inventor
Merritt Funk
Wesley Natzle
Original Assignee
Tokyo Electron Ltd
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd, Ibm filed Critical Tokyo Electron Ltd
Application granted granted Critical
Publication of ATE488794T1 publication Critical patent/ATE488794T1/de

Links

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Quality & Reliability (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Factory Administration (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Bipolar Transistors (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
AT05768604T 2004-08-27 2005-06-30 Halbleiter-bearbeitungsverfahren mit virtuellen modulen ATE488794T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/927,514 US7451011B2 (en) 2004-08-27 2004-08-27 Process control using physical modules and virtual modules
PCT/US2005/023941 WO2006025943A1 (en) 2004-08-27 2005-06-30 Semiconductor processing method using virtual modules

Publications (1)

Publication Number Publication Date
ATE488794T1 true ATE488794T1 (de) 2010-12-15

Family

ID=35004156

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05768604T ATE488794T1 (de) 2004-08-27 2005-06-30 Halbleiter-bearbeitungsverfahren mit virtuellen modulen

Country Status (9)

Country Link
US (1) US7451011B2 (de)
EP (1) EP1782139B1 (de)
JP (1) JP5033627B2 (de)
KR (1) KR101200657B1 (de)
CN (1) CN101006398B (de)
AT (1) ATE488794T1 (de)
DE (1) DE602005024821D1 (de)
TW (1) TWI308705B (de)
WO (1) WO2006025943A1 (de)

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* Cited by examiner, † Cited by third party
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US9785140B2 (en) * 2000-02-01 2017-10-10 Peer Intellectual Property Inc. Multi-protocol multi-client equipment server
US20060139587A1 (en) * 2004-12-23 2006-06-29 Asml Netherlands B.V. Software mechanism for generating flexible equipment state model views, software mechanism for measuring equipment reliability
US7289867B1 (en) * 2005-06-08 2007-10-30 Advanced Micro Devices, Inc. Automated integrated circuit device manufacturing facility using distributed control
DE102006004408B4 (de) * 2006-01-31 2010-03-18 Advanced Micro Devices, Inc., Sunnyvale Verfahren und System zum Analysieren von standardmäßigen Anlagennachrichten in einer Fertigungsumgebung
US7412295B2 (en) * 2006-03-14 2008-08-12 Sap Ag Modeling manufacturing processes to include defined markers
US20070238201A1 (en) * 2006-03-28 2007-10-11 Merritt Funk Dynamic metrology sampling with wafer uniformity control
US7567700B2 (en) * 2006-03-28 2009-07-28 Tokyo Electron Limited Dynamic metrology sampling with wafer uniformity control
US7502709B2 (en) * 2006-03-28 2009-03-10 Tokyo Electron, Ltd. Dynamic metrology sampling for a dual damascene process
US7558641B2 (en) * 2007-03-29 2009-07-07 Lam Research Corporation Recipe report card framework and methods thereof
US8396582B2 (en) 2008-03-08 2013-03-12 Tokyo Electron Limited Method and apparatus for self-learning and self-improving a semiconductor manufacturing tool
US8190543B2 (en) 2008-03-08 2012-05-29 Tokyo Electron Limited Autonomous biologically based learning tool
US8725667B2 (en) * 2008-03-08 2014-05-13 Tokyo Electron Limited Method and system for detection of tool performance degradation and mismatch
US8229588B2 (en) * 2009-03-03 2012-07-24 Taiwan Semiconductor Manufacturing Company, Ltd. Method and system for tuning advanced process control parameters
US8229578B2 (en) * 2009-09-21 2012-07-24 Fisher-Rosemount Systems, Inc. Methods and apparatus to manage module run sequences in a process control environment
TWI427722B (zh) * 2010-08-02 2014-02-21 Univ Nat Cheng Kung 使用具有信心指標之虛擬量測的先進製程控制系統與方法及其電腦程式產品
CN104752150A (zh) * 2013-12-27 2015-07-01 中芯国际集成电路制造(上海)有限公司 工艺流程建立的方法
US9592443B2 (en) 2014-03-11 2017-03-14 Microsoft Technology Licensing, Llc Data store for a modular assembly system
US9555326B2 (en) 2014-03-11 2017-01-31 Microsoft Technology Licensing, Llc Gaming system for modular toys
US9703896B2 (en) 2014-03-11 2017-07-11 Microsoft Technology Licensing, Llc Generation of custom modular objects
AU2015100137A4 (en) * 2015-01-12 2015-03-05 Macau University Of Science And Technology Optimization of Start-up Transient Processes for Dual-Armed Cluster Tools with Wafer Revisiting
US10043690B2 (en) * 2015-03-31 2018-08-07 Lam Research Corporation Fault detection using showerhead voltage variation
JP6337869B2 (ja) * 2015-11-05 2018-06-06 横河電機株式会社 プラントモデル作成装置、プラントモデル作成方法、およびプラントモデル作成プログラム
JP6805733B2 (ja) * 2016-10-31 2020-12-23 オムロン株式会社 制御システム、その制御方法およびそのコンピュータ読取可能な記憶媒体
US10930531B2 (en) 2018-10-09 2021-02-23 Applied Materials, Inc. Adaptive control of wafer-to-wafer variability in device performance in advanced semiconductor processes
US10705514B2 (en) * 2018-10-09 2020-07-07 Applied Materials, Inc. Adaptive chamber matching in advanced semiconductor process control
US10657214B2 (en) 2018-10-09 2020-05-19 Applied Materials, Inc. Predictive spatial digital design of experiment for advanced semiconductor process optimization and control
EP3696738A1 (de) * 2019-02-12 2020-08-19 ABB Schweiz AG Automatisiertes wartungsplanerstellungsverfahren für modulare anlagen
CN112486113B (zh) * 2020-11-20 2021-09-24 长江存储科技有限责任公司 一种机台程式控制方法及装置
CN112580997B (zh) * 2020-12-24 2021-07-27 上海赛美特软件科技有限公司 数据收集方法及系统、spc系统及计算机存储介质

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07297258A (ja) 1994-04-26 1995-11-10 Tokyo Electron Ltd 板状体の搬送装置
US5914879A (en) * 1997-03-04 1999-06-22 Advanced Micro Devices System and method for calculating cluster tool performance metrics using a weighted configuration matrix
US6747734B1 (en) 2000-07-08 2004-06-08 Semitool, Inc. Apparatus and method for processing a microelectronic workpiece using metrology
US6447370B1 (en) * 2001-04-17 2002-09-10 Speedfam-Ipec Corporation Inline metrology device
US6708129B1 (en) * 2001-12-13 2004-03-16 Advanced Micro Devices, Inc. Method and apparatus for wafer-to-wafer control with partial measurement data
DE60335268D1 (de) 2002-08-20 2011-01-20 Tokyo Electron Ltd Verfahren zum verarbeiten von daten auf der basis des datenkontexts
US20040200574A1 (en) 2003-04-11 2004-10-14 Applied Materials, Inc. Method for controlling a process for fabricating integrated devices
US7212878B2 (en) * 2004-08-27 2007-05-01 Tokyo Electron Limited Wafer-to-wafer control using virtual modules

Also Published As

Publication number Publication date
EP1782139A1 (de) 2007-05-09
JP2008511986A (ja) 2008-04-17
CN101006398A (zh) 2007-07-25
WO2006025943A1 (en) 2006-03-09
TW200615814A (en) 2006-05-16
KR20070070165A (ko) 2007-07-03
DE602005024821D1 (de) 2010-12-30
US20060042543A1 (en) 2006-03-02
KR101200657B1 (ko) 2012-11-12
EP1782139B1 (de) 2010-11-17
CN101006398B (zh) 2011-08-03
JP5033627B2 (ja) 2012-09-26
TWI308705B (en) 2009-04-11
US7451011B2 (en) 2008-11-11

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